MTFC16GAKAEEF-AAT Equivalent & Substitute Parts

Part Overview

The MTFC16GAKAEEF-AAT is a 128Gbit NAND Flash memory IC in MMC interface format, manufactured by Micron Technology Inc. in a 169-TFBGA (14x18) package. This component is classified as obsolete, necessitating identification of equivalent substitute parts for ongoing design requirements and procurement needs. The part operates across an industrial temperature range of -40°C to 105°C and complies with ROHS3 and REACH standards.

Substiute Parts

MTFC16GAKAEEF-AAT

Micron Technology Inc.In Stock: 1163MTFC16GAKAEEF-AAT Datasheet

Current PartRFQ

MTFC16GAPALBH-AAT

Micron Technology Inc.In Stock: 7524MTFC16GAPALBH-AAT Datasheet

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MTFC16GAPALGT-AAT

Micron Technology Inc.In Stock: 1390MTFC16GAPALGT-AAT Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the MTFC16GAKAEEF-AAT are identified based on the following critical parameters that determine functional equivalence:

• Memory Size: 128Gbit (constant across all substitutes)
• Memory Organization: 16G x 8 (constant across all substitutes)
• Memory Interface: MMC (constant across all substitutes)
• Technology: FLASH - NAND (constant across all substitutes)
• Operating Temperature Range: -40°C ~ 105°C (constant across all substitutes)
• Base Product Number: MTFC16 (common designation)
• Compliance Standards: ROHS3 Compliant, REACH Unaffected, MSL 3 (constant across all substitutes)

The primary differentiators among substitute parts are package configuration (BGA ball count and dimensions) and product status. All identified substitutes maintain electrical and functional compatibility through identical memory capacity, organization, interface protocol, and thermal specifications.

Parameter Comparison

Engineering Selection Recommendations

MTFC16GAPALBH-AAT is the primary substitute option, offering active product status with full availability and compliance certification. This part maintains all critical electrical and functional parameters while providing a smaller footprint in 153-TFBGA packaging. PCB layout redesign is required to accommodate the reduced package dimensions (11.5x13 versus 14x18).

MTFC16GAPALGT-AAT serves as a secondary option for applications where package specifications are not constrained. This part carries discontinued status at DiGi Electronics, limiting long-term procurement viability.

Selection between substitutes depends on PCB layout constraints and long-term supply chain requirements. Both alternatives maintain ROHS3 compliance and identical memory specifications.

Frequently Asked Questions (FAQ)

Q: Can MTFC16GAPALBH-AAT directly replace MTFC16GAKAEEF-AAT without design changes?

A: Electrical and functional compatibility is maintained. However, the 153-TFBGA package (11.5x13) differs from the original 169-TFBGA (14x18), requiring PCB layout modification for ball grid array repositioning and trace routing adjustments.

Q: What is the significance of the different package designations?

A: Package designation indicates ball count and physical dimensions. The 169-TFBGA contains 169 solder balls in a 14x18mm footprint, while the 153-TFBGA contains 153 balls in an 11.5x13mm footprint. Both packages support identical MMC interface signaling and memory capacity.

Q: Are all substitutes ROHS3 compliant?

A: Yes. MTFC16GAKAEEF-AAT, MTFC16GAPALBH-AAT, and MTFC16GAPALGT-AAT all carry ROHS3 Compliant certification and are REACH Unaffected.

Q: What is the product status difference, and why does it matter?

A: MTFC16GAKAEEF-AAT is obsolete, indicating end-of-life status. MTFC16GAPALBH-AAT is active with ongoing manufacturing and availability. MTFC16GAPALGT-AAT is discontinued at DiGi Electronics, limiting procurement channels. Active status ensures supply chain continuity.

Q: Do voltage supply specifications affect substitution?

A: MTFC16GAPALBH-AAT specifies 1.7V ~ 1.9V supply voltage. The original part and MTFC16GAPALGT-AAT do not provide voltage specifications in available documentation. Verify power supply compatibility with system design requirements before implementation.