MTFC128GAPALNS-AIT Equivalent & Substitute Parts

Part Overview

The MTFC128GAPALNS-AIT is a FLASH NAND Memory IC with 1Tbit capacity in a 153-TFBGA package manufactured by Micron Technology Inc. This component operates across the temperature range of -40°C to 85°C and is classified as obsolete. Due to its obsolete status, identifying functionally equivalent substitute parts is essential for ongoing system support, design updates, and procurement continuity.

Substiute Parts

MTFC128GAPALNS-AIT

Micron Technology Inc.In Stock: 1386MTFC128GAPALNS-AIT Datasheet

Current PartRFQ

MTFC128GAZAQJP-AIT

Micron Technology Inc.In Stock: 2501MTFC128GAZAQJP-AIT Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the MTFC128GAPALNS-AIT is determined by the following critical parameters:

• Memory capacity: 1Tbit
• Memory organization: 128G x 8
• Memory interface: MMC
• Operating temperature range: -40°C ~ 85°C
• Mounting type: Surface Mount
• RoHS compliance: ROHS3 Compliant
• Moisture sensitivity level: 3 (168 Hours)

The substitute part MTFC128GAZAQJP-AIT meets all core functional and environmental requirements. While the package designation differs (153-VFBGA versus 153-TFBGA), both are 11.5x13mm BGA packages with 153 pins, maintaining mechanical and electrical compatibility. The substitute part is classified as active, providing long-term availability and supply chain stability.

Parameter Comparison

Engineering Selection Recommendations

The MTFC128GAZAQJP-AIT is the designated substitute for the obsolete MTFC128GAPALNS-AIT. Selection is based on:

• Identical memory capacity, organization, and interface specifications
• Matching operating temperature range and environmental ratings
• Equivalent RoHS3 compliance and moisture sensitivity classification
• Active product status ensuring continued availability and supply chain support
• Automotive-grade qualification (AEC-Q100) and specified supply voltage (2.7V ~ 3.6V) provide enhanced reliability documentation
• Both parts maintain the same 11.5x13mm footprint with 153-pin BGA configuration

The substitute part is suitable for direct replacement in applications where the main part is no longer available.

Frequently Asked Questions (FAQ)

Q: Can MTFC128GAZAQJP-AIT be used as a direct replacement for MTFC128GAPALNS-AIT?

A: Yes. Both parts share identical memory capacity (1Tbit), organization (128G x 8), MMC interface, operating temperature range (-40°C ~ 85°C), and package footprint (11.5x13mm, 153-pin BGA). The substitute part is active and available.

Q: What is the difference between the 153-TFBGA and 153-VFBGA packages?

A: Both designations refer to 153-pin ball grid array packages with identical 11.5x13mm dimensions. The letter designation indicates minor variations in ball pitch or internal construction, but both maintain mechanical and electrical compatibility for this application.

Q: Does the substitute part have additional certifications?

A: Yes. MTFC128GAZAQJP-AIT carries automotive-grade qualification (AEC-Q100) and specifies supply voltage (2.7V ~ 3.6V) and clock frequency (200 MHz), providing additional documentation compared to the main part.

Q: Are both parts RoHS3 compliant?

A: Yes. Both MTFC128GAPALNS-AIT and MTFC128GAZAQJP-AIT are ROHS3 compliant with MSL rating of 3 (168 Hours).

Q: Why is the main part obsolete?

A: Product obsolescence is determined by the manufacturer based on market demand and technology lifecycle. The substitute part maintains functional equivalence while offering active production status and supply availability.