MT47H64M8CB-5E:B Equivalent & Substitute Parts

Part Overview

The MT47H64M8CB-5E:B is a 512Mbit DDR2 SDRAM memory IC manufactured by Micron Technology Inc., configured as 64M x 8 with parallel interface architecture. This component operates at 200 MHz clock frequency with 600 ps access time in a 60-FBGA package. The part is classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new designs requiring compatible memory solutions.

Substiute Parts

MT47H64M8CB-5E:B
Micron Technology Inc.In Stock: 1201MT47H64M8CB-5E:B Datasheet
MT47H64M8CB-5E:B
Current Part
IS43DR86400E-3DBLI
ISSI, Integrated Silicon Solution IncIn Stock: 5320IS43DR86400E-3DBLI Datasheet
IS43DR86400E-3DBLI
Similar
IS43DR86400E-3DBLI-TR
ISSI, Integrated Silicon Solution IncIn Stock: 794IS43DR86400E-3DBLI-TR Datasheet
IS43DR86400E-3DBLI-TR
Similar

Key Parameters

Parameter Value
Memory Size 512Mbit
Memory Organization 64M x 8
Memory Technology SDRAM - DDR2
Memory Interface Parallel
Clock Frequency 200 MHz
Access Time 600 ps
Voltage Supply 1.7V ~ 1.9V
Operating Temperature 0°C ~ 85°C
Package Type 60-FBGA
Write Cycle Time 15ns
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the MT47H64M8CB-5E:B is determined by strict equivalence in the following parameters: memory capacity (512Mbit), organization (64M x 8), technology (DDR2 SDRAM), interface type (parallel), and supply voltage range (1.7V ~ 1.9V). The identified substitute parts, IS43DR86400E-3DBLI and IS43DR86400E-3DBLI-TR from ISSI, maintain identical memory specifications and electrical characteristics. Both substitute parts exceed the minimum performance requirements with 333 MHz clock frequency and 450 ps access time, while supporting the same 15ns write cycle time. Package differences (60-TWBGA versus 60-FBGA) require mechanical validation for PCB layout compatibility. Both substitutes are ROHS3 compliant and REACH unaffected, matching the regulatory status of the original part.

Parameter Comparison

Parameter MT47H64M8CB-5E:B (Micron) IS43DR86400E-3DBLI (ISSI) IS43DR86400E-3DBLI-TR (ISSI)
Memory Size 512Mbit 512Mbit 512Mbit
Memory Organization 64M x 8 64M x 8 64M x 8
Technology SDRAM - DDR2 SDRAM - DDR2 SDRAM - DDR2
Memory Interface Parallel Parallel Parallel
Clock Frequency 200 MHz 333 MHz 333 MHz
Access Time 600 ps 450 ps 450 ps
Write Cycle Time 15ns 15ns 15ns
Voltage Supply 1.7V ~ 1.9V 1.7V ~ 1.9V 1.7V ~ 1.9V
Operating Temperature 0°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
Package Type 60-FBGA 60-TWBGA (8x10.5) 60-TWBGA (8x10.5)
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Product Status Obsolete Active Active

Engineering Selection Recommendations

The IS43DR86400E-3DBLI and IS43DR86400E-3DBLI-TR represent functionally equivalent alternatives to the obsolete MT47H64M8CB-5E:B. Both ISSI parts maintain active product status, ensuring long-term availability and supply chain continuity. The substitutes deliver superior performance specifications with 333 MHz clock frequency and 450 ps access time, providing operational margin beyond the original 200 MHz / 600 ps design point. Both alternatives maintain ROHS3 compliance and REACH unaffected status, satisfying regulatory requirements equivalent to the original component.

The primary distinction between the two ISSI substitutes is packaging format: IS43DR86400E-3DBLI is supplied in Tray packaging with 5300 units in stock, while IS43DR86400E-3DBLI-TR is supplied in Tape & Reel format with 738 units available. Selection between these variants depends on assembly process requirements and procurement volume. The extended operating temperature range of the ISSI parts (-40°C ~ 85°C versus 0°C ~ 85°C) provides additional environmental margin for applications requiring lower temperature operation.

Frequently Asked Questions (FAQ)

Q: Can IS43DR86400E-3DBLI directly replace MT47H64M8CB-5E:B without design modification?

A: Electrical substitution is valid based on identical memory capacity, organization, technology, interface, voltage, and write cycle time specifications. However, package geometry differs (60-TWBGA versus 60-FBGA), requiring PCB layout verification for pin-to-pin compatibility and mechanical fit validation before implementation.

Q: What is the difference between IS43DR86400E-3DBLI and IS43DR86400E-3DBLI-TR?

A: Both parts are electrically and functionally identical. The difference is packaging format: IS43DR86400E-3DBLI uses Tray packaging suitable for bulk handling, while IS43DR86400E-3DBLI-TR uses Tape & Reel format optimized for automated assembly processes. Selection depends on manufacturing workflow and volume requirements.

Q: Are the ISSI substitutes backward compatible with systems designed for the Micron MT47H64M8CB-5E:B?

A: Backward compatibility is confirmed for electrical operation within the specified voltage (1.7V ~ 1.9V) and timing parameters. The ISSI parts exceed minimum performance requirements. Physical compatibility requires validation of the 60-TWBGA package footprint against the original 60-FBGA layout.

Q: What is the significance of the extended temperature range in the ISSI substitutes?

A: The ISSI parts support -40°C ~ 85°C operation compared to the original 0°C ~ 85°C range. This extended lower temperature capability provides operational margin for applications requiring sub-zero environment support, though it does not affect standard room-temperature operation.

Q: Do the substitute parts maintain the same regulatory compliance as the original component?

A: Yes. Both IS43DR86400E-3DBLI and IS43DR86400E-3DBLI-TR are ROHS3 compliant and REACH unaffected, matching the regulatory status of the MT47H64M8CB-5E:B.

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