MT47H32M16CC-5E:B Equivalent & Substitute Parts

Part Overview

The MT47H32M16CC-5E:B is a 512Mbit DDR2 SDRAM memory IC manufactured by Micron Technology Inc., configured as 32M x 16 with parallel interface in 84-FBGA (12x12.5) packaging. This part operates at 200 MHz with 600 ps access time and 1.7V–1.9V supply voltage. The product is currently obsolete, making equivalent and substitute parts necessary for legacy system maintenance, board redesigns, and component sourcing.

Key Parameters

Parameter	Value
Memory Size	512Mbit
Memory Organization	32M x 16
Technology	SDRAM - DDR2
Memory Interface	Parallel
Clock Frequency	200 MHz
Access Time	600 ps
Voltage Supply	1.7V – 1.9V
Operating Temperature	0°C – 85°C (TC)
Package / Case	84-TFBGA
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility is determined by strict alignment with the following electrical and mechanical parameters:

Primary Substitution Criteria:

Memory Size: 512Mbit (exact match required)
Memory Organization: 32M x 16 (exact match required)
Technology: SDRAM - DDR2 (exact match required)
Memory Interface: Parallel (exact match required)
Voltage Supply: 1.7V – 1.9V (exact match required)
Package Type: 84-TFBGA or 84-FBGA (pin-compatible variants acceptable)
Mounting Type: Surface Mount (exact match required)

Secondary Compatibility Factors:

Clock Frequency: Substitute parts operating at 200 MHz or higher are compatible
Access Time: Substitute parts with 600 ps or faster access time are compatible
Operating Temperature: Substitute parts must support minimum 0°C – 85°C range
RoHS Compliance: ROHS3 Compliant status required

Substitute parts are grouped by manufacturer and product status. Parts with Active status are prioritized for new designs. Parts with Not For New Designs or Obsolete status are suitable for legacy system replacement only.

Parameter Comparison

Part Number	Manufacturer	Memory Size	Organization	Clock Frequency	Access Time	Voltage Supply	Operating Temperature	Package	Product Status
MT47H32M16CC-5E:B	Micron Technology Inc.	512Mbit	32M x 16	200 MHz	600 ps	1.7V – 1.9V	0°C – 85°C	84-FBGA (12x12.5)	Obsolete
MT47H32M16NF-25E AAT:H	Micron Technology Inc.	512Mbit	32M x 16	400 MHz	400 ps	1.7V – 1.9V	-40°C – 105°C	84-FBGA (8x12.5)	Active
MT47H32M16NF-25E IT:H	Micron Technology Inc.	512Mbit	32M x 16	400 MHz	400 ps	1.7V – 1.9V	-40°C – 95°C	84-FBGA (8x12.5)	Active
MT47H32M16NF-25E:H	Micron Technology Inc.	512Mbit	32M x 16	400 MHz	400 ps	1.7V – 1.9V	0°C – 85°C	84-FBGA (8x12.5)	Active
AS4C32M16D2A-25BAN	Alliance Memory, Inc.	512Mbit	32M x 16	400 MHz	400 ps	1.7V – 1.9V	-40°C – 105°C	84-TFBGA (8x12.5)	Active
AS4C32M16D2A-25BCNTR	Alliance Memory, Inc.	512Mbit	32M x 16	400 MHz	400 ps	1.7V – 1.9V	0°C – 95°C	84-TFBGA (8x12.5)	Not For New Designs
AS4C32M16D2A-25BIN	Alliance Memory, Inc.	512Mbit	32M x 16	400 MHz	400 ps	1.7V – 1.9V	-40°C – 95°C	84-FBGA (8x12.5)	Active
IS43DR16320C-3DBL	ISSI, Integrated Silicon Solution Inc	512Mbit	32M x 16	333 MHz	450 ps	1.7V – 1.9V	0°C – 70°C	84-TWBGA (8x12.5)	Not For New Designs
IS43DR16320E-25DBL	ISSI, Integrated Silicon Solution Inc	512Mbit	32M x 16	400 MHz	400 ps	1.7V – 1.9V	0°C – 85°C	84-TWBGA (8x12.5)	Active
IS43DR16320E-3DBL	ISSI, Integrated Silicon Solution Inc	512Mbit	32M x 16	333 MHz	450 ps	1.7V – 1.9V	0°C – 85°C	84-TWBGA (8x12.5)	Active
IS43DR16320E-3DBLI-TR	ISSI, Integrated Silicon Solution Inc	512Mbit	32M x 16	333 MHz	450 ps	1.7V – 1.9V	-40°C – 85°C	84-TWBGA (8x12.5)	Active

Engineering Selection Recommendations

For Active Product Status (Recommended for New Designs):

Micron Technology MT47H32M16NF-25E series parts (AAT:H, IT:H, :H variants) are the primary substitutes. These parts maintain the same base product number MT47H32M16, ensuring design compatibility. The MT47H32M16NF-25E:H variant matches the original operating temperature range (0°C – 85°C) and is ROHS3 compliant with MSL 3 rating.

Alliance Memory AS4C32M16D2A-25BAN and AS4C32M16D2A-25BIN are functionally equivalent alternatives with Active status. Both support extended temperature ranges and are ROHS3 compliant. The AS4C32M16D2A-25BAN variant supports -40°C – 105°C operation, suitable for automotive and industrial applications.

ISSI IS43DR16320E-25DBL and IS43DR16320E-3DBL are Active status alternatives. The IS43DR16320E-25DBL operates at 400 MHz with 400 ps access time, matching the performance envelope of Micron NF-25E variants. The IS43DR16320E-3DBL operates at 333 MHz with 450 ps access time, providing backward compatibility with the original 200 MHz specification.

For Legacy System Replacement:

AS4C32M16D2A-25BCNTR and IS43DR16320C-3DBL are marked Not For New Designs but remain suitable for direct replacement in existing systems. These parts maintain electrical and mechanical compatibility with the original MT47H32M16CC-5E:B.

Compliance Considerations:

All substitute parts are ROHS3 compliant and REACH unaffected, matching the original part's regulatory status. Moisture sensitivity levels range from MSL 3 to MSL 5; verify PCB assembly process compatibility with the selected substitute's MSL rating.

Frequently Asked Questions (FAQ)

Q: Can MT47H32M16NF-25E variants directly replace MT47H32M16CC-5E:B?

A: Yes. Both share the same base product number MT47H32M16 and maintain identical memory organization (32M x 16), voltage supply (1.7V – 1.9V), and parallel interface. The NF-25E variants operate at higher clock frequencies (400 MHz vs. 200 MHz) and faster access times (400 ps vs. 600 ps), ensuring backward compatibility. Package dimensions differ slightly (8x12.5 vs. 12x12.5), but both use 84-TFBGA pinout.

Q: What is the difference between 84-FBGA and 84-TWBGA packaging?

A: Both are 84-pin ball grid array packages with identical pinout and electrical characteristics. FBGA denotes standard fine-pitch BGA, while TWBGA denotes thin wafer BGA. The functional difference is negligible for substitution purposes; both are surface-mount compatible with standard PCB assembly processes.

Q: Are Alliance Memory and ISSI parts fully compatible with Micron parts?

A: Yes, within the specified electrical and mechanical parameters. All substitute parts maintain 512Mbit capacity, 32M x 16 organization, DDR2 SDRAM technology, parallel interface, and 1.7V – 1.9V supply voltage. Functional compatibility is guaranteed; however, verify board layout and assembly process compatibility with the selected part's MSL rating and package variant.

Q: Which substitute part should I select for new designs?

A: MT47H32M16NF-25E:H (Micron, Active status) is the primary recommendation for new designs. It matches the original operating temperature range (0°C – 85°C), maintains ROHS3 compliance, and offers improved performance specifications. For extended temperature or automotive applications, select AS4C32M16D2A-25BAN (Alliance Memory, -40°C – 105°C).

Q: Can I use IS43DR16320E-3DBL as a direct replacement?

A: Yes. The IS43DR16320E-3DBL operates at 333 MHz with 450 ps access time, which exceeds the original 200 MHz / 600 ps specification. It is ROHS3 compliant, Active status, and pin-compatible in 84-TWBGA packaging. Verify PCB layout compatibility with the package variant before implementation.

Q: What does "Not For New Designs" status mean for substitute parts?

A: Parts marked Not For New Designs are suitable for legacy system replacement and maintenance but should not be selected for new product development. These parts remain functionally compatible and electrically equivalent; the status reflects manufacturer lifecycle decisions. For new designs, prioritize Active status parts.

Q: How do I verify MSL (Moisture Sensitivity Level) compatibility?

A: MSL ratings indicate the maximum time a component can be exposed to ambient conditions (30°C, 60% relative humidity) before soldering. The original MT47H32M16CC-5E:B has MSL 5 (48 hours); substitute parts range from MSL 3 (168 hours) to MSL 5. Higher MSL ratings provide longer shelf life. Verify your PCB assembly process can accommodate the selected part's MSL requirement.

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