MT47H256M8EB-3:C TR - DDR2 SDRAM 2Gbit Equivalent & Substitute Parts

Part Overview

The MT47H256M8EB-3:C TR is a 2Gbit DDR2 SDRAM memory IC manufactured by Micron Technology Inc., configured as 256M x 8 with parallel interface in a 60-FBGA (9x11.5) package. This part operates at 333 MHz with 450 ps access time and is classified as obsolete. Due to its obsolete status, equivalent and substitute parts from active manufacturers are necessary for new designs and ongoing production requirements. Substitute parts maintain core electrical and mechanical compatibility while offering active product status and improved availability.

Key Parameters

Parameter	Value
Memory Type	Volatile DRAM
Technology	SDRAM - DDR2
Memory Size	2Gbit
Memory Organization	256M x 8
Memory Interface	Parallel
Clock Frequency	333 MHz
Access Time	450 ps
Write Cycle Time	15 ns
Voltage Supply	1.7V ~ 1.9V
Operating Temperature	0°C ~ 85°C (TC)
Package / Case	60-TFBGA
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
MSL Rating	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution for MT47H256M8EB-3:C TR is determined by the following critical parameters:

Core Electrical Compatibility:

Memory technology: SDRAM - DDR2
Memory size: 2Gbit
Memory organization: 256M x 8
Memory interface: Parallel
Voltage supply range: 1.7V ~ 1.9V
Write cycle time: 15 ns

Mechanical Compatibility:

Package type: 60-TFBGA (pin-compatible variants)
Mounting type: Surface Mount
MSL rating: 3 (168 Hours)

Performance Parameters:

Clock frequency: 333 MHz or higher
Access time: 450 ps or faster

Substitute parts are grouped into two categories: direct manufacturer alternatives from Micron Technology Inc. with improved performance specifications, and parametric equivalents from Alliance Memory Inc. and ISSI that maintain electrical and mechanical compatibility within the allowed parameter ranges.

Parameter Comparison

Part Number	Manufacturer	Memory Size	Organization	Clock Frequency	Access Time	Package	Temp Range	Status	Packaging Type
MT47H256M8EB-3:C TR	Micron	2Gbit	256M x 8	333 MHz	450 ps	60-FBGA (9x11.5)	0°C ~ 85°C	Obsolete	Tape & Reel
MT47H256M8EB-25E:C TR	Micron	2Gbit	256M x 8	400 MHz	400 ps	60-FBGA (9x11.5)	0°C ~ 85°C	Active	Tape & Reel
AS4C256M8D2-25BCN	Alliance Memory	2Gbit	256M x 8	400 MHz	57.5 ns	60-FBGA (8x10)	0°C ~ 95°C	Active	Tray
AS4C256M8D2-25BCNTR	Alliance Memory	2Gbit	256M x 8	400 MHz	57.5 ns	60-FBGA (8x10)	0°C ~ 95°C	Active	Tape & Reel
AS4C256M8D2-25BIN	Alliance Memory	2Gbit	256M x 8	400 MHz	57.5 ns	60-FBGA (8x10)	-40°C ~ 95°C	Active	Tray
AS4C256M8D2-25BINTR	Alliance Memory	2Gbit	256M x 8	400 MHz	57.5 ns	60-FBGA (8x10)	-40°C ~ 95°C	Active	Tape & Reel
IS43DR82560B-3DBL-TR	ISSI	2Gbit	256M x 8	333 MHz	450 ps	60-TWBGA (10.5x13)	0°C ~ 85°C	Active	Tape & Reel
IS43DR82560C-3DBL-TR	ISSI	2Gbit	256M x 8	333 MHz	450 ps	60-TWBGA (8x10.5)	0°C ~ 85°C	Active	Tape & Reel
IS43DR82560C-3DBLI	ISSI	2Gbit	256M x 8	333 MHz	450 ps	60-TWBGA (8x10.5)	-40°C ~ 85°C	Active	Tray
IS43DR82560C-3DBLI-TR	ISSI	2Gbit	256M x 8	333 MHz	450 ps	60-TWBGA (8x10.5)	-40°C ~ 85°C	Active	Tape & Reel
IS43DR82560B-3DBLI	ISSI	2Gbit	256M x 8	333 MHz	450 ps	60-TWBGA (10.5x13)	-40°C ~ 85°C	Active	Tray

Engineering Selection Recommendations

Primary Recommendation - Micron Direct Upgrade: MT47H256M8EB-25E:C TR is the direct successor from the original manufacturer. It maintains identical package dimensions (60-FBGA 9x11.5), voltage specifications (1.7V ~ 1.9V), and temperature range (0°C ~ 85°C) while providing improved performance at 400 MHz with 400 ps access time. Active product status and ROHS3 compliance ensure long-term availability and regulatory compliance.

Secondary Recommendation - ISSI Parametric Equivalents: IS43DR82560C-3DBL-TR and IS43DR82560C-3DBLI-TR match the original part's electrical specifications exactly (333 MHz, 450 ps access time, 1.7V ~ 1.9V supply). These parts are active products with ROHS3 compliance and REACH unaffected status. Package variant is 60-TWBGA (8x10.5), which differs in physical dimensions from the original 60-FBGA (9x11.5). PCB layout verification is required for mechanical fit.

Alternative Option - Alliance Memory Parts: AS4C256M8D2-25BCNTR and AS4C256M8D2-25BINTR provide 2Gbit DDR2 SDRAM in 60-FBGA (8x10) package with 400 MHz operation. These parts are active with ROHS3 compliance. The AS4C256M8D2-25BIN and AS4C256M8D2-25BINTR variants support extended temperature range (-40°C ~ 95°C), suitable for industrial applications. Package dimensions differ from the original part.

Selection Criteria:

For direct pin and package compatibility: MT47H256M8EB-25E:C TR
For identical electrical performance with active status: IS43DR82560C-3DBL-TR or IS43DR82560C-3DBLI-TR
For extended temperature range: AS4C256M8D2-25BIN or AS4C256M8D2-25BINTR
For tape and reel packaging: MT47H256M8EB-25E:C TR, IS43DR82560C-3DBL-TR, AS4C256M8D2-25BCNTR, AS4C256M8D2-25BINTR

Frequently Asked Questions (FAQ)

Q: Can MT47H256M8EB-25E:C TR be used as a direct replacement for MT47H256M8EB-3:C TR?

A: Yes. Both parts share identical package dimensions (60-FBGA 9x11.5), voltage specifications (1.7V ~ 1.9V), and operating temperature range (0°C ~ 85°C). The MT47H256M8EB-25E:C TR offers improved performance specifications (400 MHz vs 333 MHz, 400 ps vs 450 ps access time) and active product status, making it a direct upgrade.

Q: What is the difference between ISSI IS43DR82560B and IS43DR82560C variants?

A: Both variants maintain identical electrical specifications (333 MHz, 450 ps access time, 1.7V ~ 1.9V supply). The primary difference is package dimensions: IS43DR82560B uses 60-TWBGA (10.5x13) while IS43DR82560C uses 60-TWBGA (8x10.5). Both are pin-compatible DDR2 SDRAM devices with 2Gbit capacity and 256M x 8 organization.

Q: Are Alliance Memory AS4C256M8D2 parts compatible with the original MT47H256M8EB-3:C TR?

A: Alliance Memory AS4C256M8D2 parts are parametrically equivalent in electrical function (2Gbit DDR2 SDRAM, 256M x 8, 1.7V ~ 1.9V supply, 15 ns write cycle time). However, the package is 60-FBGA (8x10), which differs in physical dimensions from the original 60-FBGA (9x11.5). PCB layout and mechanical fit must be evaluated before substitution.

Q: What does the temperature range difference mean for part selection?

A: The original MT47H256M8EB-3:C TR operates from 0°C ~ 85°C. ISSI parts with -40°C ~ 85°C range and Alliance Memory AS4C256M8D2-25BIN variants with -40°C ~ 95°C range support extended operating conditions. Select based on your application's thermal requirements. Standard commercial range (0°C ~ 85°C) is sufficient for most applications.

Q: What is the significance of packaging type (Tape & Reel vs Tray)?

A: Tape & Reel (TR) packaging is standard for automated assembly lines and high-volume production. Tray packaging is used for manual handling or lower-volume applications. Both packaging types contain identical components; selection depends on your assembly process requirements.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All substitute parts listed are ROHS3 compliant. The original MT47H256M8EB-3:C TR is also ROHS3 compliant. All parts meet environmental and regulatory requirements for lead-free manufacturing.

Q: Can I mix different substitute parts in the same design?

A: All listed substitute parts are electrically compatible as DDR2 SDRAM devices with 2Gbit capacity and 256M x 8 organization. However, physical package differences (FBGA vs TWBGA, different dimensions) require separate PCB designs. Within a single PCB design, use only one part number to ensure consistent mechanical fit and electrical performance.

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