MT47H256M8EB-3:C Equivalent & Substitute Parts

Part Overview

The MT47H256M8EB-3:C is a 2Gbit DDR2 SDRAM memory IC manufactured by Micron Technology Inc., configured as 256M x 8 with parallel interface architecture. This component operates at 333 MHz clock frequency with 450 ps access time in a 60-FBGA (9x11.5) surface mount package. The part is classified as obsolete, necessitating identification of active equivalent and substitute components for ongoing system support and new design implementations.

Key Parameters

Parameter	Value
Memory Size	2Gbit
Memory Organization	256M x 8
Technology	SDRAM - DDR2
Clock Frequency	333 MHz
Access Time	450 ps
Voltage Supply	1.7V ~ 1.9V
Operating Temperature	0°C ~ 85°C (TC)
Package Type	60-FBGA
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
MSL Rating	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the MT47H256M8EB-3:C is determined by strict electrical and mechanical parameter matching within DDR2 SDRAM technology. The following criteria establish valid substitution relationships:

Primary Substitution Criteria:

Memory capacity: 2Gbit (256M x 8 organization)
Technology platform: SDRAM - DDR2
Memory interface: Parallel
Voltage supply range: 1.7V ~ 1.9V
Write cycle time: 15ns
RoHS3 compliance
MSL rating: 3 (168 Hours)

Performance Tier Classification:

Tier 1 (Direct Equivalent): Clock frequency 333 MHz, access time 450 ps
Tier 2 (Enhanced Performance): Clock frequency 400 MHz, access time 400 ps or 57.5 ns

Package Compatibility:

60-FBGA (9x11.5) - Micron Technology
60-FBGA (8x10) - Alliance Memory
60-TWBGA (8x10.5 or 10.5x13) - ISSI

Packaging variants (Tray, Tape & Reel) do not affect electrical substitution but impact procurement and assembly workflows.

Parameter Comparison

Part Number	Manufacturer	Memory Size	Organization	Clock Frequency	Access Time	Voltage Supply	Operating Temp	Package	Status
MT47H256M8EB-3:C	Micron Technology	2Gbit	256M x 8	333 MHz	450 ps	1.7V ~ 1.9V	0°C ~ 85°C	60-FBGA (9x11.5)	Obsolete
MT47H256M8EB-25E:C	Micron Technology	2Gbit	256M x 8	400 MHz	400 ps	1.7V ~ 1.9V	0°C ~ 85°C	60-FBGA (9x11.5)	Active
AS4C256M8D2-25BCN	Alliance Memory	2Gbit	256M x 8	400 MHz	57.5 ns	1.7V ~ 1.9V	0°C ~ 95°C	60-FBGA (8x10)	Active
AS4C256M8D2-25BCNTR	Alliance Memory	2Gbit	256M x 8	400 MHz	57.5 ns	1.7V ~ 1.9V	0°C ~ 95°C	60-FBGA (8x10)	Active
AS4C256M8D2-25BIN	Alliance Memory	2Gbit	256M x 8	400 MHz	57.5 ns	1.7V ~ 1.9V	-40°C ~ 95°C	60-FBGA (8x10)	Active
AS4C256M8D2-25BINTR	Alliance Memory	2Gbit	256M x 8	400 MHz	57.5 ns	1.7V ~ 1.9V	-40°C ~ 95°C	60-FBGA (8x10)	Active
IS43DR82560B-3DBLI	ISSI	2Gbit	256M x 8	333 MHz	450 ps	1.7V ~ 1.9V	-40°C ~ 85°C	60-TWBGA (10.5x13)	Active
IS43DR82560C-25DBLI	ISSI	2Gbit	256M x 8	400 MHz	400 ps	1.7V ~ 1.9V	-40°C ~ 85°C	60-TWBGA (8x10.5)	Active
IS43DR82560C-25DBLI-TR	ISSI	2Gbit	256M x 8	400 MHz	400 ps	1.7V ~ 1.9V	-40°C ~ 85°C	60-TWBGA (8x10.5)	Active
IS43DR82560B-3DBL	ISSI	2Gbit	256M x 8	333 MHz	450 ps	1.7V ~ 1.9V	0°C ~ 85°C	60-TWBGA (10.5x13)	Active

Engineering Selection Recommendations

Direct Manufacturer Equivalent (Recommended for Micron-based designs): MT47H256M8EB-25E:C provides enhanced performance at 400 MHz with 400 ps access time while maintaining identical 60-FBGA (9x11.5) package geometry and Micron Technology manufacturing. Active product status ensures long-term availability. Electrical compatibility is complete across all critical parameters.

Alliance Memory Substitutes (Cost-optimized alternatives): AS4C256M8D2-25BCN, AS4C256M8D2-25BCNTR, AS4C256M8D2-25BIN, and AS4C256M8D2-25BINTR deliver 400 MHz performance with extended temperature range options (-40°C ~ 95°C for BIN variants). Package footprint differs (60-FBGA 8x10 versus 9x11.5), requiring PCB layout verification. All variants maintain ROHS3 compliance and MSL 3 rating.

ISSI Substitutes (Extended temperature capability): IS43DR82560B-3DBLI and IS43DR82560B-3DBL match the original 333 MHz specification with 450 ps access time. IS43DR82560C-25DBLI and IS43DR82560C-25DBLI-TR provide 400 MHz performance. All ISSI parts support -40°C lower operating limit, expanding thermal envelope. 60-TWBGA package (8x10.5 or 10.5x13) requires PCB footprint redesign.

Product Status Consideration: All recommended substitutes maintain Active product status, ensuring procurement viability and manufacturing continuity through established supply channels.

Frequently Asked Questions (FAQ)

Q: Can MT47H256M8EB-25E:C directly replace MT47H256M8EB-3:C without PCB modification? A: Yes. Both components use identical 60-FBGA (9x11.5) package geometry, electrical specifications, and Micron Technology manufacturing. The 25E variant operates at higher performance (400 MHz versus 333 MHz) and is fully backward compatible.

Q: What is the impact of switching from 60-FBGA (9x11.5) to 60-FBGA (8x10) or 60-TWBGA packages? A: Package footprint changes require PCB layout redesign, including BGA pad array repositioning and via placement. Electrical functionality remains identical. Mechanical mounting and thermal characteristics may differ slightly.

Q: Are Alliance Memory AS4C256M8D2 variants electrically equivalent to the Micron MT47H256M8EB-3:C? A: Yes, within the specified electrical parameters. All variants maintain 2Gbit capacity, 256M x 8 organization, DDR2 technology, 1.7V ~ 1.9V supply voltage, and 15ns write cycle time. Performance specifications (400 MHz, 57.5 ns access time) exceed the original part.

Q: What is the difference between AS4C256M8D2-25BIN and AS4C256M8D2-25BINTR? A: Both parts are electrically identical. The suffix TR indicates Tape & Reel packaging for automated assembly, while BIN indicates Tray packaging. Selection depends on assembly process requirements and procurement workflow.

Q: Can ISSI IS43DR82560 series parts substitute for Micron MT47H256M8EB-3:C? A: Yes, electrically. IS43DR82560B-3DBLI and IS43DR82560B-3DBL match 333 MHz / 450 ps specifications. IS43DR82560C-25DBLI and IS43DR82560C-25DBLI-TR provide enhanced 400 MHz performance. Package geometry differs (60-TWBGA versus 60-FBGA), requiring PCB redesign.

Q: Why is the original MT47H256M8EB-3:C classified as obsolete? A: Obsolete status reflects end-of-life manufacturing by Micron Technology. Active equivalent parts from Micron (MT47H256M8EB-25E:C) and alternative manufacturers (Alliance Memory, ISSI) provide continued design support and component availability.

Q: Are all substitute parts ROHS3 compliant? A: Yes. All listed substitute parts maintain ROHS3 compliance and MSL 3 (168 Hours) rating, matching the original component's environmental and regulatory specifications.

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