MT29F4G08ABCHC-ET:C TR Equivalent & Substitute Parts

Part Overview

The MT29F4G08ABCHC-ET:C TR is a 4Gbit NAND Flash memory IC manufactured by Micron Technology Inc., configured as a parallel interface device in a 63-VFBGA package. This component is classified as obsolete, indicating discontinued production and limited availability in the market. Identifying equivalent substitute parts is necessary to maintain supply chain continuity for legacy system designs and ongoing production requirements where this memory IC serves as a critical storage component.

Substiute Parts

MT29F4G08ABCHC-ET:C TR
Micron Technology Inc.In Stock: 1005MT29F4G08ABCHC-ET:C TR Datasheet
MT29F4G08ABCHC-ET:C TR
Current Part
MT29F4G08ABBDAHC-IT:D TR
Micron Technology Inc.In Stock: 3832MT29F4G08ABBDAHC-IT:D TR Datasheet
MT29F4G08ABBDAHC-IT:D TR
Direct

Key Parameters

Parameter Value
Memory Type Non-Volatile FLASH
Memory Technology FLASH - NAND
Memory Size 4Gbit
Memory Organization 512M x 8
Memory Interface Parallel
Voltage Supply Range 1.7V ~ 1.95V
Operating Temperature Range -40°C ~ 85°C (TA)
Package Type 63-VFBGA (10.5x13)
Mounting Type Surface Mount
RoHS Compliance ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the MT29F4G08ABCHC-ET:C TR is determined by strict alignment across the following critical parameters:

  • Memory capacity: 4Gbit
  • Memory organization: 512M x 8 configuration
  • Interface type: Parallel
  • Supply voltage range: 1.7V ~ 1.95V
  • Operating temperature range: -40°C ~ 85°C
  • Package specification: 63-VFBGA (10.5x13)
  • Mounting technology: Surface Mount

The substitute part MT29F4G08ABBDAHC-IT:D TR meets all these electrical and mechanical requirements, enabling direct functional equivalence in circuit applications designed for the original component.

Parameter Comparison

Parameter MT29F4G08ABCHC-ET:C TR (Main) MT29F4G08ABBDAHC-IT:D TR (Substitute)
Manufacturer Micron Technology Inc. Micron Technology Inc.
Memory Type Non-Volatile FLASH Non-Volatile FLASH
Memory Technology FLASH - NAND FLASH - NAND
Memory Size 4Gbit 4Gbit
Memory Organization 512M x 8 512M x 8
Memory Interface Parallel Parallel
Voltage Supply Range 1.7V ~ 1.95V 1.7V ~ 1.95V
Operating Temperature Range -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Package Type 63-VFBGA (10.5x13) 63-VFBGA (10.5x13)
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
RoHS Compliance ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected
ECCN Classification 3A991B1A 3A991B1A
HTSUS Code 8542.32.0071 8542.32.0071

Engineering Selection Recommendations

The MT29F4G08ABBDAHC-IT:D TR is the qualified substitute for the obsolete MT29F4G08ABCHC-ET:C TR. Both components share identical electrical specifications, memory capacity, interface configuration, and package geometry. The substitute part maintains active product status with Micron Technology Inc., ensuring ongoing availability and supply chain reliability.

Both parts satisfy ROHS3 compliance requirements and carry identical ECCN and HTSUS classifications, confirming regulatory and trade compliance alignment. The substitute part is available in significantly higher inventory quantities (3735 Pcs versus 904 Pcs), supporting production scalability and reducing procurement risk.

Frequently Asked Questions (FAQ)

Q: Can MT29F4G08ABBDAHC-IT:D TR be used as a direct replacement for MT29F4G08ABCHC-ET:C TR?

A: Yes. Both parts are manufactured by Micron Technology Inc. and share identical memory capacity (4Gbit), organization (512M x 8), parallel interface, supply voltage range (1.7V ~ 1.95V), operating temperature range (-40°C ~ 85°C), and 63-VFBGA package specification. No circuit modifications are required.

Q: What is the difference between these two part numbers?

A: The primary difference is product status. The MT29F4G08ABCHC-ET:C TR is obsolete, while the MT29F4G08ABBDAHC-IT:D TR is active. The substitute part also differs in moisture sensitivity level (MSL 3 versus MSL 2) and inventory availability.

Q: Are there any compliance or certification differences?

A: No. Both parts are ROHS3 compliant, REACH unaffected, and carry identical ECCN and HTSUS classifications.

Q: What is the package specification for both parts?

A: Both components use a 63-VFBGA package with dimensions of 10.5x13mm, mounted as surface mount devices.

Q: Why should I select the substitute part?

A: The substitute part is active in production with higher inventory availability, ensuring reliable supply chain access for current and future production runs.

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