MT29F2T08CTCCBJ7-6C:C Equivalent & Substitute Parts

Part Overview

The MT29F2T08CTCCBJ7-6C:C is a FLASH NAND memory IC with 2Tbit capacity, parallel interface, and 167 MHz clock frequency, manufactured by Micron Technology Inc. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and component procurement. The part operates within a 2.7V to 3.6V supply voltage range and is housed in a 152-LBGA package suitable for surface mount applications.

Substiute Parts

MT29F2T08CTCCBJ7-6C:C
Micron Technology Inc.In Stock: 1019MT29F2T08CTCCBJ7-6C:C Datasheet
MT29F2T08CTCCBJ7-6C:C
Current Part
MT29F4T08CTHBBM5-3C:B
Micron Technology Inc.In Stock: 807MT29F4T08CTHBBM5-3C:B Datasheet
MT29F4T08CTHBBM5-3C:B
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Key Parameters

Parameter Value
Manufacturer Part Number MT29F2T08CTCCBJ7-6C:C
Manufacturer Micron Technology Inc.
Memory Type Non-Volatile FLASH
Memory Size 2Tbit
Memory Organization 256G x 8
Memory Interface Parallel
Clock Frequency 167 MHz
Voltage Supply Range 2.7V ~ 3.6V
Operating Temperature 0°C ~ 70°C
Package Type 152-LBGA (14x18)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
MSL Rating 3 (168 Hours)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution eligibility for FLASH NAND memory components is determined by the following critical parameters:

  • Memory Technology: Both parts must utilize FLASH NAND technology
  • Memory Interface: Parallel interface compatibility is required
  • Voltage Supply Range: Supply voltage specifications must be compatible with system design
  • Operating Temperature Range: Temperature operating window must meet or exceed application requirements
  • Memory Organization: Data width (x8 organization) must match system bus architecture
  • Mounting Type: Surface mount compatibility for PCB integration
  • Compliance Standards: RoHS and REACH compliance status must be verified

The MT29F4T08CTHBBM5-3C:B qualifies as a substitute based on shared FLASH NAND technology, parallel interface architecture, compatible voltage supply range (2.5V ~ 3.6V encompasses the original 2.7V ~ 3.6V specification), matching x8 memory organization, surface mount capability, and equivalent RoHS3 compliance status.

Parameter Comparison

Parameter MT29F2T08CTCCBJ7-6C:C (Main) MT29F4T08CTHBBM5-3C:B (Substitute)
Manufacturer Micron Technology Inc. Micron Technology Inc.
Memory Type Non-Volatile FLASH Non-Volatile FLASH
Memory Format FLASH FLASH
Technology FLASH - NAND FLASH - NAND
Memory Size 2Tbit 4Tbit
Memory Organization 256G x 8 512G x 8
Memory Interface Parallel Parallel
Clock Frequency 167 MHz 333 MHz
Voltage Supply Range 2.7V ~ 3.6V 2.5V ~ 3.6V
Operating Temperature 0°C ~ 70°C 0°C ~ 70°C
Mounting Type Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active

Engineering Selection Recommendations

The MT29F4T08CTHBBM5-3C:B presents a viable substitute for the obsolete MT29F2T08CTCCBJ7-6C:C based on the following engineering criteria:

  • Compliance Alignment: Both components maintain ROHS3 compliance and equivalent MSL ratings, ensuring regulatory and manufacturing process compatibility
  • Active Product Status: The substitute part maintains active product status with Micron Technology Inc., ensuring ongoing availability and supply chain stability
  • Interface Compatibility: Parallel interface architecture and x8 memory organization preserve system-level bus compatibility
  • Voltage Specification: The substitute's 2.5V minimum supply voltage is lower than the original 2.7V specification, providing enhanced compatibility with systems operating at reduced voltage levels
  • Performance Enhancement: The 333 MHz clock frequency exceeds the original 167 MHz specification, offering improved data throughput without compromising backward compatibility
  • Thermal Compatibility: Identical operating temperature range (0°C ~ 70°C) ensures thermal design equivalence

Frequently Asked Questions (FAQ)

Q: Can the MT29F4T08CTHBBM5-3C:B directly replace the MT29F2T08CTCCBJ7-6C:C in existing designs?

A: Direct substitution is feasible from an electrical and mechanical standpoint. Both components share parallel interface architecture, x8 memory organization, compatible voltage supply ranges, and identical operating temperature specifications. However, the substitute part doubles the memory capacity (4Tbit vs. 2Tbit) and doubles the clock frequency (333 MHz vs. 167 MHz). System firmware and memory addressing schemes must accommodate the increased capacity, and timing analysis must confirm compatibility with the higher clock frequency.

Q: What are the key differences between these two parts?

A: The primary differences are memory capacity (2Tbit vs. 4Tbit), memory organization (256G x 8 vs. 512G x 8), clock frequency (167 MHz vs. 333 MHz), minimum supply voltage (2.7V vs. 2.5V), and product status (obsolete vs. active). Both maintain identical operating temperature ranges, mounting types, and compliance certifications.

Q: Does the lower minimum voltage specification of the substitute part affect compatibility?

A: No. The substitute part's 2.5V minimum supply voltage is lower than the original 2.7V specification, meaning it operates across a broader voltage range. Systems designed for the original 2.7V ~ 3.6V specification will operate within the substitute's 2.5V ~ 3.6V range without adverse effects.

Q: Are there package or pinout differences between these components?

A: Package information for the substitute part (MT29F4T08CTHBBM5-3C:B) is not specified in the available data. The original part uses a 152-LBGA (14x18) package. Pinout compatibility must be verified through detailed package documentation before implementation.

Q: What is the significance of the active product status for the substitute part?

A: Active product status indicates that Micron Technology Inc. continues to manufacture and support the MT29F4T08CTHBBM5-3C:B, ensuring long-term availability, supply chain stability, and access to technical documentation and support resources. This contrasts with the obsolete status of the original part, which may face procurement challenges and limited manufacturer support.

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