MSP430F5509IPTR Equivalent & Substitute Parts

Part Overview

The MSP430F5509IPTR is a 16-bit microcontroller from Texas Instruments' MSP430F5xx series, featuring 24KB FLASH program memory, 6KB RAM, and integrated connectivity interfaces including I2C, SPI, UART/USART, and USB. The device operates at 25MHz with a supply voltage range of 1.8V to 3.6V and includes integrated analog-to-digital conversion (8x10-bit). The MSP430F5509IPTR is classified as obsolete, making equivalent substitute parts necessary for ongoing design support and production continuity. The primary substitute maintains identical core functionality while offering improved availability through active product status and alternative packaging options.

Substiute Parts

MSP430F5509IPTR

Texas InstrumentsIn Stock: 965MSP430F5509IPTR Datasheet

Current PartRFQ

MSP430F5509IRGZR

Texas InstrumentsIn Stock: 2071MSP430F5509IRGZR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the MSP430F5509IPTR is determined by strict equivalence across the following critical parameters:

• Core processor architecture (MSP430 CPUXV2)
• Core size (16-Bit)
• Operating frequency (25MHz)
• Program memory capacity and type (24KB FLASH)
• RAM capacity (6K x 8)
• Supply voltage range (1.8V ~ 3.6V)
• I/O count (31 pins)
• Integrated connectivity and peripheral feature set
• Compliance certifications (RoHS3, REACH Unaffected)

The MSP430F5509IRGZR qualifies as a direct functional equivalent, maintaining identical electrical specifications and core functionality. The primary distinction lies in packaging format: the original part uses 48-LQFP (7x7) surface mount, while the substitute employs 48-VQFN (7x7) with exposed pad. Both packages are surface mount configurations with identical footprint dimensions (7x7mm), ensuring mechanical compatibility in most applications. The substitute part carries active product status with higher inventory availability.

Parameter Comparison

Engineering Selection Recommendations

The MSP430F5509IRGZR is the direct functional equivalent for the obsolete MSP430F5509IPTR. Selection of the substitute part is based on the following engineering criteria:

Product Status: The original MSP430F5509IPTR is classified as obsolete, limiting long-term availability and support. The MSP430F5509IRGZR maintains active product status with Texas Instruments, ensuring continued manufacturing and supply chain stability.

Electrical Equivalence: All electrical parameters, memory configurations, operating ranges, and peripheral features are identical between the two parts. No firmware or software modifications are required for functional substitution.

Compliance: Both parts maintain ROHS3 compliance and REACH Unaffected status, meeting current regulatory requirements for electronic component manufacturing and distribution.

Package Consideration: The substitute employs 48-VQFN packaging with exposed pad versus the original 48-LQFP format. Both maintain identical 7x7mm footprint dimensions. PCB layout modifications may be required to accommodate the different package geometry and thermal pad configuration. The VQFN package with exposed pad provides improved thermal performance compared to LQFP.

Inventory Availability: The substitute part is available in higher quantities (2000 pcs) compared to the original part (914 pcs), supporting production continuity and reducing procurement lead times.

Frequently Asked Questions (FAQ)

Q: Can the MSP430F5509IRGZR be used as a direct replacement for the MSP430F5509IPTR without firmware changes?

A: Yes. Both parts share identical core processor architecture, memory configuration, operating frequency, and peripheral feature sets. No firmware modifications are required for functional substitution.

Q: What is the primary difference between these two parts?

A: The primary difference is packaging format. The MSP430F5509IPTR uses 48-LQFP (7x7) while the MSP430F5509IRGZR uses 48-VQFN (7x7) with exposed pad. Both maintain identical footprint dimensions (7x7mm) and pin count (48).

Q: Will existing PCB designs require modification to accommodate the substitute part?

A: PCB layout modifications are necessary due to different package geometries. LQFP and VQFN packages have different solder pad configurations and thermal pad placement. The VQFN package includes an exposed thermal pad that must be properly connected to ground planes for optimal thermal performance.

Q: Are there any electrical performance differences between the two packages?

A: No electrical performance differences exist. The VQFN package with exposed pad provides superior thermal dissipation characteristics compared to LQFP, potentially improving thermal performance in high-power applications.

Q: What is the significance of the exposed pad in the VQFN package?

A: The exposed pad provides a direct thermal connection to the device substrate, enabling more efficient heat transfer to the PCB ground plane. This is particularly beneficial in applications with sustained high current draw or elevated ambient temperatures.

Q: Are both parts available from the same manufacturer?

A: Yes. Both parts are manufactured by Texas Instruments and carry identical compliance certifications (ROHS3, REACH Unaffected).

Q: What is the moisture sensitivity level for both parts?

A: Both parts carry MSL 3 (168 Hours) moisture sensitivity rating, requiring identical handling and storage protocols.