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MSP430F5259IZQER Equivalent & Substitute Parts
Part Overview
The MSP430F5259IZQER is a 16-bit microcontroller from Texas Instruments' MSP430F5xx series, featuring 128KB FLASH program memory, 32KB RAM, and integrated connectivity interfaces including I2C, SPI, UART/USART, and IrDA. The device is packaged in an 80-BGA MICROSTAR JUNIOR (5x5) form factor and operates across a supply voltage range of 1.8V to 3.6V with a maximum clock speed of 25MHz.
The MSP430F5259IZQER is classified as obsolete. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure component availability, and support ongoing production requirements for applications utilizing this microcontroller platform.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Core Processor | MSP430 CPUXV2 |
| Core Size | 16-Bit |
| Speed | 25MHz |
| Program Memory Size | 128KB (128K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 32K x 8 |
| Voltage Supply (Vcc/Vdd) | 1.8V ~ 3.6V |
| Data Converters | A/D 12x10b |
| Connectivity | I2C, IrDA, SCI, SPI, UART/USART |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| Number of I/O | 53 |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution of the MSP430F5259IZQER is determined by strict equivalence across core functional parameters. The substitute part MSP430F5259IRGCR maintains identical specifications for the following critical parameters:
Core processor architecture (MSP430 CPUXV2), core size (16-Bit), clock speed (25MHz), program memory capacity and type (128KB FLASH), RAM size (32K x 8), supply voltage range (1.8V ~ 3.6V), data converter configuration (A/D 12x10b), connectivity interfaces (I2C, IrDA, SCI, SPI, UART/USART), peripheral set (Brown-out Detect/Reset, DMA, POR, PWM, WDT), I/O count (53), operating temperature range (-40°C ~ 85°C), and compliance certifications (ROHS3, REACH Unaffected).
The primary difference between these parts is the package configuration: the main part uses 80-BGA MICROSTAR JUNIOR (5x5), while the substitute uses 64-VQFN (9x9). Both are surface-mount packages with identical electrical functionality and pin-level compatibility within their respective package footprints.
Parameter Comparison
| Parameter | MSP430F5259IZQER (Main) | MSP430F5259IRGCR (Substitute) |
|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments |
| Series | MSP430F5xx | MSP430F5xx |
| Base Product Number | MSP430F5259 | MSP430F5259 |
| Core Processor | MSP430 CPUXV2 | MSP430 CPUXV2 |
| Core Size | 16-Bit | 16-Bit |
| Speed | 25MHz | 25MHz |
| Program Memory Size | 128KB (128K x 8) | 128KB (128K x 8) |
| Program Memory Type | FLASH | FLASH |
| RAM Size | 32K x 8 | 32K x 8 |
| Voltage Supply (Vcc/Vdd) | 1.8V ~ 3.6V | 1.8V ~ 3.6V |
| Data Converters | A/D 12x10b | A/D 12x10b |
| Connectivity | I2C, IrDA, SCI, SPI, UART/USART | I2C, IrDA, SCI, SPI, UART/USART |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| Number of I/O | 53 | 53 |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | 80-VFBGA | 64-VFQFN Exposed Pad |
| Supplier Device Package | 80-BGA MICROSTAR JUNIOR (5x5) | 64-VQFN (9x9) |
| Product Status | Obsolete | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| REACH Status | REACH Unaffected | REACH Unaffected |
Engineering Selection Recommendations
The MSP430F5259IRGCR is the designated manufacturer substitute for the obsolete MSP430F5259IZQER. Both parts maintain identical electrical specifications, core functionality, and compliance certifications (ROHS3 Compliant, REACH Unaffected).
The primary consideration for part selection is package compatibility. The MSP430F5259IZQER uses an 80-BGA MICROSTAR JUNIOR (5x5) package, while the MSP430F5259IRGCR uses a 64-VQFN (9x9) package. PCB layout and footprint design must accommodate the selected package format. The MSP430F5259IRGCR is currently in active production status, ensuring ongoing availability and supply chain continuity.
Both parts are classified as ROHS3 Compliant and REACH Unaffected, meeting current environmental and regulatory requirements. The MSL rating of 3 (168 Hours) applies to both variants, requiring equivalent moisture control during storage and handling.
Frequently Asked Questions (FAQ)
Q: Can MSP430F5259IRGCR directly replace MSP430F5259IZQER in existing designs?
A: Electrical and functional replacement is direct. However, the package change from 80-BGA MICROSTAR JUNIOR (5x5) to 64-VQFN (9x9) requires PCB redesign. Pin mapping and footprint layout differ between packages and must be verified against the respective datasheets.
Q: What is the primary reason for substitution?
A: The MSP430F5259IZQER is classified as obsolete. The MSP430F5259IRGCR is the active production equivalent, ensuring component availability and supply chain support.
Q: Are the electrical specifications identical between these parts?
A: Yes. Both parts share identical core processor architecture, clock speed (25MHz), memory configuration (128KB FLASH, 32KB RAM), supply voltage range (1.8V ~ 3.6V), connectivity interfaces, peripheral set, and operating temperature range (-40°C ~ 85°C).
Q: Do both parts meet the same compliance standards?
A: Yes. Both MSP430F5259IZQER and MSP430F5259IRGCR are ROHS3 Compliant and REACH Unaffected. Moisture Sensitivity Level (MSL) is 3 (168 Hours) for both variants.
Q: What packaging considerations apply to the substitute part?
A: The MSP430F5259IRGCR is supplied in Tape & Reel (TR) packaging in a 64-VQFN (9x9) form factor. This differs from the 80-BGA MICROSTAR JUNIOR (5x5) package of the original part. Board-level integration requires footprint redesign and pin assignment verification.
Q: Is the substitute part currently available?
A: Yes. The MSP430F5259IRGCR is classified as Active product status with documented inventory availability, ensuring supply continuity for new designs and production requirements.
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