MSP430F122IDWR Equivalent & Substitute Parts

Part Overview

The MSP430F122IDWR is a 16-bit microcontroller from Texas Instruments' MSP430x1xx series, featuring 4KB flash memory, 256 bytes of RAM, and integrated peripherals including SPI, UART/USART, PWM, and watchdog timer functionality. The device operates at 8MHz with a supply voltage range of 1.8V to 3.6V and is housed in a 28-SOIC package.

This part is classified as obsolete. Identifying equivalent substitute parts is necessary to ensure design continuity, maintain supply chain flexibility, and support long-term product availability for applications currently utilizing this microcontroller.

Substiute Parts

MSP430F122IDWR
Texas InstrumentsIn Stock: 1211MSP430F122IDWR Datasheet
MSP430F122IDWR
Current Part
MSP430F122IPW
Texas InstrumentsIn Stock: 971MSP430F122IPW Datasheet
MSP430F122IPW
MFR Recommended

Key Parameters

Parameter Value
Core Processor MSP430 CPU16
Core Size 16-Bit
Speed 8MHz
Program Memory Size 4KB (4K x 8 + 256B)
Program Memory Type FLASH
RAM Size 256 x 8
Voltage Supply (Vcc/Vdd) 1.8V ~ 3.6V
Number of I/O 22
Connectivity SPI, UART/USART
Peripherals POR, PWM, WDT
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Base Product Number MSP430F122

Substitute Part Grouping Explanation

Substitution of the MSP430F122IDWR is determined by equivalence across the following critical parameters:

  • Core processor architecture (MSP430 CPU16)
  • Core size (16-Bit)
  • Operating frequency (8MHz)
  • Program memory capacity (4KB FLASH)
  • RAM capacity (256 x 8)
  • Supply voltage range (1.8V ~ 3.6V)
  • I/O count (22 pins)
  • Peripheral set (SPI, UART/USART, POR, PWM, WDT)
  • Operating temperature range (-40°C ~ 85°C)
  • Base product number (MSP430F122)

The MSP430F122IPW qualifies as a direct functional equivalent, maintaining identical electrical specifications and core functionality. The primary difference lies in packaging format: the substitute uses a 28-TSSOP package instead of the 28-SOIC package of the main part.

Parameter Comparison

Parameter MSP430F122IDWR (28-SOIC) MSP430F122IPW (28-TSSOP)
Manufacturer Texas Instruments Texas Instruments
Series MSP430x1xx MSP430x1xx
Core Processor MSP430 CPU16 MSP430 CPU16
Core Size 16-Bit 16-Bit
Speed 8MHz 8MHz
Program Memory Size 4KB (4K x 8 + 256B) 4KB (4K x 8 + 256B)
Program Memory Type FLASH FLASH
RAM Size 256 x 8 256 x 8
Voltage Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V
Number of I/O 22 22
Connectivity SPI, UART/USART SPI, UART/USART
Peripherals POR, PWM, WDT POR, PWM, WDT
Data Converters Slope A/D Slope A/D
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 28-SOIC (0.295", 7.50mm Width) 28-TSSOP (0.173", 4.40mm Width)
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99
HTSUS 8542.31.0001 8542.31.0001

Engineering Selection Recommendations

The MSP430F122IPW is a valid substitute for the MSP430F122IDWR based on electrical and functional equivalence. Both devices maintain identical core specifications, memory configuration, and peripheral functionality.

The MSP430F122IPW carries an active product status, whereas the MSP430F122IDWR is obsolete. Both parts are ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99.

Selection between these parts depends on PCB layout constraints and package compatibility requirements. The 28-SOIC package (0.295" width) of the main part differs from the 28-TSSOP package (0.173" width) of the substitute. The TSSOP variant offers a smaller footprint, which may be advantageous for space-constrained applications. PCB redesign and revalidation may be necessary if switching between these package formats.

Frequently Asked Questions (FAQ)

Q: Can the MSP430F122IPW directly replace the MSP430F122IDWR without firmware changes?

A: Yes. Both devices share identical core processor architecture, memory configuration, peripheral set, and electrical specifications. Firmware compatibility is maintained. Package differences require PCB layout modifications.

Q: What is the primary difference between these two parts?

A: The MSP430F122IDWR uses a 28-SOIC package, while the MSP430F122IPW uses a 28-TSSOP package. All electrical and functional parameters are identical.

Q: Are there any compliance or certification differences?

A: No. Both parts are ROHS3 compliant, REACH unaffected, and carry the same ECCN and HTSUS classifications.

Q: Why is the MSP430F122IDWR classified as obsolete?

A: Product status reflects Texas Instruments' lifecycle management. The MSP430F122IPW remains in active production and serves as the current equivalent offering.

Q: What are the package dimension implications for PCB design?

A: The 28-SOIC package has a width of 0.295" (7.50mm), while the 28-TSSOP package has a width of 0.173" (4.40mm). The TSSOP variant is narrower and requires different footprint design. Pin pitch and lead configuration also differ between packages.

Q: Are both parts available in the same supply voltage range?

A: Yes. Both the MSP430F122IDWR and MSP430F122IPW operate across 1.8V to 3.6V supply voltage range.

Q: What is the moisture sensitivity level for both parts?

A: Both parts are rated MSL 1 (Unlimited), indicating minimal moisture sensitivity and no special storage or handling requirements.

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