MSP430F112IDWR Equivalent & Substitute Parts

Part Overview

The MSP430F112IDWR is a 16-bit microcontroller from Texas Instruments' MSP430x1xx series, featuring 4KB of FLASH program memory, 256 bytes of RAM, and integrated peripherals including Power-On Reset (POR), Pulse Width Modulation (PWM), and Watchdog Timer (WDT). The device operates at 8MHz with a supply voltage range of 1.8V to 3.6V and is housed in a 20-SOIC package.

This part is classified as Obsolete. Locating equivalent substitute parts is necessary for design continuity, procurement flexibility, and long-term product support when original inventory becomes unavailable.

Substiute Parts

MSP430F112IDWR
Texas InstrumentsIn Stock: 1206MSP430F112IDWR Datasheet
MSP430F112IDWR
Current Part
MSP430F112IPW
Texas InstrumentsIn Stock: 2984MSP430F112IPW Datasheet
MSP430F112IPW
MFR Recommended

Key Parameters

Parameter Value
Core Processor MSP430 CPU16
Core Size 16-Bit
Speed 8MHz
Program Memory Size 4KB (4K x 8 + 256B)
Program Memory Type FLASH
RAM Size 256 x 8
Voltage Supply (Vcc/Vdd) 1.8V ~ 3.6V
Number of I/O 14
Peripherals POR, PWM, WDT
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Series MSP430x1xx

Substitute Part Grouping Explanation

Substitution eligibility for the MSP430F112IDWR is determined by strict equivalence across the following critical parameters:

  • Core processor architecture (MSP430 CPU16)
  • Core size (16-Bit)
  • Operating frequency (8MHz)
  • Program memory capacity and type (4KB FLASH)
  • RAM capacity (256 x 8)
  • Supply voltage range (1.8V ~ 3.6V)
  • Peripheral set (POR, PWM, WDT)
  • I/O pin count (14)
  • Operating temperature range (-40°C ~ 85°C)
  • Base product number (MSP430F112)

The MSP430F112IPW qualifies as a direct functional equivalent. Both parts share identical electrical specifications and core functionality. The primary difference is packaging format: the MSP430F112IDWR uses 20-SOIC (0.295", 7.50mm width) while the MSP430F112IPW uses 20-TSSOP (0.173", 4.40mm width). This packaging distinction affects board layout and assembly processes but does not alter electrical performance or pin functionality.

Parameter Comparison

Parameter MSP430F112IDWR MSP430F112IPW
Manufacturer Texas Instruments Texas Instruments
Series MSP430x1xx MSP430x1xx
Core Processor MSP430 CPU16 MSP430 CPU16
Core Size 16-Bit 16-Bit
Speed 8MHz 8MHz
Program Memory Size 4KB (4K x 8 + 256B) 4KB (4K x 8 + 256B)
Program Memory Type FLASH FLASH
RAM Size 256 x 8 256 x 8
Voltage Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V
Number of I/O 14 14
Peripherals POR, PWM, WDT POR, PWM, WDT
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Supplier Device Package 20-SOIC 20-TSSOP
Package / Case 20-SOIC (0.295", 7.50mm Width) 20-TSSOP (0.173", 4.40mm Width)
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99
HTSUS 8542.31.0001 8542.31.0001

Engineering Selection Recommendations

The MSP430F112IPW is the direct substitute for the MSP430F112IDWR based on functional equivalence and regulatory compliance. Both parts maintain ROHS3 compliance, REACH unaffected status, and identical EAR99 export classification.

The MSP430F112IPW offers the advantage of Active product status, ensuring continued manufacturer support and availability. The MSP430F112IDWR, classified as Obsolete, presents supply chain risk and limited long-term procurement viability.

Selection between these parts depends on packaging requirements. The 20-SOIC package (MSP430F112IDWR) has a larger footprint (0.295" width) suitable for applications with less stringent space constraints. The 20-TSSOP package (MSP430F112IPW) provides a more compact form factor (0.173" width) for space-optimized designs. Pin functionality and electrical performance remain identical across both packages.

Frequently Asked Questions (FAQ)

Q: Are the MSP430F112IDWR and MSP430F112IPW electrically identical?

A: Yes. Both parts share identical electrical specifications including core processor, clock speed, memory configuration, supply voltage range, operating temperature, and peripheral set. The only difference is the physical package format.

Q: What is the primary difference between these two parts?

A: The packaging differs. The MSP430F112IDWR uses a 20-SOIC package (0.295" width), while the MSP430F112IPW uses a 20-TSSOP package (0.173" width). This affects PCB layout and assembly processes but not electrical function.

Q: Can I use the MSP430F112IPW as a direct replacement for the MSP430F112IDWR on an existing PCB?

A: Direct PCB replacement requires layout modification due to different package dimensions and pin spacing. The TSSOP package is narrower and has different lead geometry than the SOIC package. Footprint redesign is necessary.

Q: Why is the MSP430F112IDWR classified as Obsolete?

A: Obsolete status indicates the manufacturer has discontinued production. The MSP430F112IPW, with Active status, represents the current production equivalent and is the recommended choice for new designs and ongoing procurement.

Q: Are both parts RoHS compliant?

A: Yes. Both the MSP430F112IDWR and MSP430F112IPW are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

Q: What is the moisture sensitivity level for these parts?

A: Both parts have MSL 1 (Unlimited), indicating no moisture sensitivity restrictions during storage or handling.

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