MR25H40CDC Equivalent & Substitute Parts

Part Overview

The MR25H40CDC is a 4Mbit MRAM (Magnetoresistive RAM) memory IC with SPI interface operating at 40 MHz, packaged in 8-DFN-EP with large flag configuration. This part is classified as "Not For New Designs," indicating it has reached end-of-life status. Finding equivalent or substitute parts is necessary for legacy system support, maintenance, and component replenishment where design flexibility permits.

Key Parameters

Parameter	Value
Memory Type	Non-Volatile MRAM
Memory Size	4Mbit
Memory Organization	512K x 8
Interface	SPI
Clock Frequency	40 MHz
Supply Voltage	3V ~ 3.6V
Operating Temperature	-40°C ~ 85°C
Package	8-DFN-EP
Product Status	Not For New Designs

Substitute Part Grouping Explanation

Substitution eligibility for the MR25H40CDC is determined by the following critical parameters:

Core Compatibility Requirements:

Memory Type: Non-Volatile MRAM
Memory Size: 4Mbit
Memory Organization: 512K x 8
Interface: SPI
Supply Voltage: 3V ~ 3.6V
Package Type: 8-DFN-EP Exposed Pad

Allowable Variations:

Clock Frequency: Equal to or greater than 40 MHz (backward compatible)
Operating Temperature Range: Equal to or greater than -40°C ~ 85°C (extended ranges acceptable)
Package Flag Size: Variation permitted (large flag to small flag transition acceptable for mechanical fit)
Product Status: Active status preferred for new stock availability
Grade/Qualification: Automotive-grade variants acceptable for enhanced reliability

The three identified substitutes meet these criteria with specific distinctions in clock frequency, temperature range, and package flag configuration.

Parameter Comparison

Parameter	MR25H40CDC	MR25H40CDF	MR20H40CDF	MR25H40MDF
Manufacturer	Everspin Technologies Inc.	Everspin Technologies Inc.	Everspin Technologies Inc.	Everspin Technologies Inc.
Memory Type	Non-Volatile MRAM	Non-Volatile MRAM	Non-Volatile MRAM	Non-Volatile MRAM
Memory Size	4Mbit	4Mbit	4Mbit	4Mbit
Memory Organization	512K x 8	512K x 8	512K x 8	512K x 8
Interface	SPI	SPI	SPI	SPI
Clock Frequency	40 MHz	40 MHz	50 MHz	40 MHz
Supply Voltage	3V ~ 3.6V	3V ~ 3.6V	3V ~ 3.6V	3V ~ 3.6V
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 125°C
Package / Case	8-VDFN Exposed Pad	8-VDFN Exposed Pad	8-VDFN Exposed Pad	8-VDFN Exposed Pad
Package Flag Size	Large Flag (5x6)	Small Flag (5x6)	Small Flag (5x6)	Small Flag (5x6)
Product Status	Not For New Designs	Active	Active	Active
Grade	Commercial	Commercial	Commercial	Automotive
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
REACH Status	REACH Unaffected	REACH Unaffected	REACH Unaffected	REACH Unaffected

Engineering Selection Recommendations

MR25H40CDF is the direct functional equivalent with identical electrical specifications (40 MHz, -40°C ~ 85°C). The primary difference is the package flag size transition from large to small flag configuration. This part carries Active product status, ensuring ongoing availability. Selection is appropriate for applications where mechanical PCB layout accommodates the small flag package variant.

MR20H40CDF provides enhanced clock frequency performance at 50 MHz, exceeding the original 40 MHz specification. This part is backward compatible for timing-critical applications requiring higher data throughput. Identical temperature range and voltage specifications apply. Active product status confirms current manufacturing support.

MR25H40MDF maintains identical electrical performance to the original part (40 MHz, same voltage) but extends the operating temperature range to -40°C ~ 125°C and includes AEC-Q100 automotive qualification. This variant is suitable for applications requiring enhanced thermal performance or automotive-grade reliability standards. Active product status and small flag package configuration apply.

All substitute parts maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment with the original MR25H40CDC.

Frequently Asked Questions (FAQ)

Q: Can MR25H40CDF directly replace MR25H40CDC in existing designs?

A: Electrical and functional compatibility is complete. The package flag size differs (small vs. large), requiring PCB layout verification to confirm mechanical fit. Consult PCB design documentation and component placement constraints before implementation.

Q: What is the significance of the clock frequency difference in MR20H40CDF?

A: MR20H40CDF operates at 50 MHz versus the original 40 MHz. This higher frequency is backward compatible with 40 MHz system designs, as the part can operate at reduced clock speeds. No timing conflicts occur when substituting into 40 MHz applications.

Q: Is MR25H40MDF suitable for non-automotive applications?

A: Yes. MR25H40MDF is a commercial-grade part with automotive qualification (AEC-Q100). The extended temperature range (-40°C ~ 125°C) and enhanced reliability characteristics benefit any application requiring superior thermal performance or long-term operational stability, regardless of automotive classification.

Q: How do package flag size variations affect PCB assembly?

A: Flag size differences (large vs. small) impact thermal dissipation characteristics and PCB footprint compatibility. Large flag packages provide enhanced thermal performance through increased exposed pad area. Small flag variants reduce thermal dissipation but maintain electrical functionality. Verify thermal requirements and PCB layout constraints before substitution.

Q: Are all substitute parts manufactured by Everspin Technologies Inc.?

A: Yes. All substitute parts are manufactured by Everspin Technologies Inc., the original manufacturer of MR25H40CDC. This ensures consistent quality standards, process control, and technical support across all variants.

Q: What compliance certifications apply to these parts?

A: All parts maintain ROHS3 compliance and REACH unaffected status. MR25H40MDF additionally carries AEC-Q100 automotive qualification. These certifications confirm regulatory alignment and suitability for regulated applications.

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