MPIA4040R3-4R7-R Equivalent & Substitute Parts

Part Overview

The MPIA4040R3-4R7-R is a 4.7 µH shielded molded inductor manufactured by Eaton - Electronics Division, rated for 2.3 A continuous current with 92mOhm DC resistance. This component is classified as obsolete, necessitating identification of active equivalent parts for ongoing production and design requirements. The part features metal composite core construction, AEC-Q200 rating, and operates across the -55°C to 125°C temperature range. Due to its obsolete status, substitute parts with matching or superior electrical characteristics are required to maintain design continuity and supply chain reliability.

Substiute Parts

MPIA4040R3-4R7-R

Eaton - Electronics DivisionIn Stock: 1064MPIA4040R3-4R7-R Datasheet

Current PartRFQ

MPIA4020V2-4R7-R

Eaton - Electronics DivisionIn Stock: 3704MPIA4020V2-4R7-R Datasheet

SimilarRFQ

IHLP1616BZER4R7M11

Vishay DaleIn Stock: 17257IHLP1616BZER4R7M11 Datasheet

DirectRFQ

B82464G4472M000

EPCOS - TDK ElectronicsIn Stock: 9655B82464G4472M000 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the MPIA4040R3-4R7-R is determined by the following mandatory criteria:

Inductance Match: All substitute parts must provide 4.7 µH inductance within the ±20% tolerance band (3.76 µH to 5.64 µH). This is the primary functional specification.

Current Rating Compatibility: Substitute parts must support a minimum continuous current rating of 2.3 A. Parts with higher current ratings provide design margin and are acceptable. Parts with lower ratings are not suitable.

Shielding Requirement: All substitutes must be shielded to maintain electromagnetic compatibility and prevent interference in the target application.

Temperature Range: Substitute parts must operate across the full -55°C to 125°C range or provide an equivalent or wider operating window.

Surface Mount Configuration: All substitutes must be surface mount devices compatible with standard PCB assembly processes.

Electrical Test Standard: Inductance values must be measured or specified at 100 kHz to ensure direct comparison with the original part specification.

The three identified substitute parts meet these core criteria with variations in DC resistance, saturation current, package dimensions, and core material composition. These variations are documented in the parameter comparison table below.

Parameter Comparison

Engineering Selection Recommendations

MPIA4020V2-4R7-R (Eaton - Electronics Division)

This substitute is the primary equivalent option. It maintains the same manufacturer lineage, identical inductance and tolerance specifications, and equivalent operating temperature range. The current rating of 2.7 A exceeds the 2.3 A requirement, providing operational margin. DC resistance increases from 92mOhm to 118mOhm maximum, resulting in approximately 28% higher power dissipation at rated current. The part is active with full AEC-Q200 certification and ROHS3 compliance. Tape & Reel packaging supports high-volume production. Physical dimensions increase slightly (4.95 x 4.20mm vs. 4.45 x 4.06mm), requiring PCB layout verification. Self-resonant frequency of 24MHz is documented. This part is recommended for applications where the manufacturer continuity and proven qualification history are prioritized.

IHLP1616BZER4R7M11 (Vishay Dale)

This substitute provides identical physical footprint (4.45 x 4.06mm) and height (2.00mm maximum) compatibility with the original part. Inductance and tolerance match exactly. However, the continuous current rating of 1.7 A falls below the 2.3 A requirement, making this part unsuitable for applications operating at or near the original design current. DC resistance of 105mOhm maximum is acceptable. The part is active with ROHS3 compliance and Tape & Reel packaging. Self-resonant frequency of 29MHz is higher than the MPIA4020V2-4R7-R alternative. This part is not recommended due to insufficient current rating.

B82464G4472M000 (EPCOS - TDK Electronics)

This substitute employs ferrite drum core wirewound construction, differing fundamentally from the molded metal composite design of the original part. The current rating of 4.9 A significantly exceeds the 2.3 A requirement. DC resistance of 15mOhm maximum is substantially lower, reducing power dissipation by approximately 84% compared to the original specification. Operating temperature extends to 150°C, exceeding the original -55°C to 125°C range. AEC-Q200 certification and ROHS3 compliance are provided. However, physical dimensions are substantially larger (10.40 x 10.40mm footprint, 4.80mm height), requiring significant PCB redesign. Self-resonant frequency of 37MHz is the highest among all options. This part is suitable only for applications with PCB layout flexibility and where the reduced DC resistance and extended temperature range provide design advantages.

Frequently Asked Questions (FAQ)

Q: Can MPIA4020V2-4R7-R directly replace MPIA4040R3-4R7-R without PCB modification?

A: The MPIA4020V2-4R7-R has a slightly larger footprint (4.95 x 4.20mm vs. 4.45 x 4.06mm) and increased height (2.00mm vs. 1.80mm). PCB layout verification is required to confirm pad spacing and clearance compatibility. If the original PCB design includes adequate spacing margins, direct substitution is possible. Otherwise, minor layout adjustments may be necessary.

Q: What is the impact of increased DC resistance in the MPIA4020V2-4R7-R substitute?

A: DC resistance increases from 92mOhm to 118mOhm maximum, representing a 28% increase. At the 2.3 A rated current, power dissipation increases from approximately 486mW to 622mW. Thermal management and circuit performance must be re-evaluated. If the original design operated near thermal limits, this substitute may require additional cooling or current derating.

Q: Why is IHLP1616BZER4R7M11 not recommended despite matching physical dimensions?

A: The continuous current rating of 1.7 A is insufficient for applications requiring 2.3 A operation. Using this part at or above 2.3 A would exceed its rated capacity, resulting in accelerated aging, potential saturation, and reliability degradation. This part is only suitable for applications with reduced current requirements.

Q: When should B82464G4472M000 be considered as a substitute?

A: This part is appropriate for applications where PCB layout can accommodate the larger 10.40 x 10.40mm footprint and 4.80mm height. The significantly lower DC resistance (15mOhm) is advantageous in high-current or thermally constrained designs. The extended operating temperature range (-55°C to 150°C) supports applications in extreme environments. The ferrite drum core construction provides different frequency response characteristics that may be beneficial in specific RF or switching applications.

Q: Are all substitute parts qualified to the same standards as the original MPIA4040R3-4R7-R?

A: MPIA4020V2-4R7-R and B82464G4472M000 both carry AEC-Q200 certification matching the original part. IHLP1616BZER4R7M11 does not list AEC-Q200 certification. All three substitutes are ROHS3 compliant. For automotive or high-reliability applications requiring AEC-Q200 qualification, MPIA4020V2-4R7-R or B82464G4472M000 are preferred.

Q: What is the significance of self-resonant frequency differences among the substitutes?

A: Self-resonant frequency indicates the frequency at which the inductor transitions from inductive to capacitive behavior. MPIA4020V2-4R7-R (24MHz), IHLP1616BZER4R7M11 (29MHz), and B82464G4472M000 (37MHz) all operate well above typical switching frequencies in most applications. For designs operating near or above 20MHz, the higher self-resonant frequencies of the Vishay and EPCOS parts may provide improved high-frequency performance.

Q: Can substitutes be used interchangeably in existing designs?

A: No. Each substitute has distinct electrical and physical characteristics. MPIA4020V2-4R7-R is the closest functional equivalent but requires PCB verification. IHLP1616BZER4R7M11 is unsuitable due to current rating limitations. B82464G4472M000 requires significant PCB redesign. Each substitution decision must be based on specific application requirements, thermal constraints, frequency response needs, and PCB layout flexibility.