MPC8343ZQADDB Equivalent & Substitute Parts

Part Overview

The MPC8343ZQADDB is a PowerPC e300 microprocessor IC from the MPC83xx series, featuring a single 32-bit core operating at 266MHz. This embedded processor integrates DDR/DDR2 memory controllers, triple Gigabit Ethernet ports, dual USB 2.0 interfaces with PHY, and additional connectivity options including DUART, I2C, PCI, and SPI. The device is packaged in a 620-HBGA (29x29) ball grid array with exposed pad and operates across the industrial temperature range of 0°C to 105°C.

The MPC8343ZQADDB carries an obsolete product status. Identifying equivalent substitute parts is necessary for ongoing system support, design updates, and procurement continuity when original inventory becomes unavailable.

Substiute Parts

MPC8343ZQADDB
NXP USA Inc.In Stock: 1686MPC8343ZQADDB Datasheet
MPC8343ZQADDB
Current Part
MPC8343VRADDB
NXP SemiconductorsIn Stock: 2244MPC8343VRADDB Datasheet
MPC8343VRADDB
Direct
MPC8343VRADDB
NXP SemiconductorsIn Stock: 2244MPC8343VRADDB Datasheet
MPC8343VRADDB
Direct

Key Parameters

Parameter Value
Core Processor PowerPC e300
Number of Cores / Bus Width 1 Core, 32-Bit
Speed 266MHz
RAM Controllers DDR, DDR2
Ethernet 10/100/1000Mbps (3)
USB USB 2.0 + PHY (2)
Voltage - I/O 1.8V, 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA)
Additional Interfaces DUART, I2C, PCI, SPI
Package / Case 620-BBGA Exposed Pad
Supplier Device Package 620-HBGA (29x29)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution for the MPC8343ZQADDB is determined by strict equivalence across the following critical parameters:

  • Processor Architecture: PowerPC e300 core
  • Core Configuration: Single 32-bit core
  • Clock Speed: 266MHz
  • Memory Support: DDR and DDR2 controllers
  • Ethernet Capability: Triple 10/100/1000Mbps ports
  • USB Interface: Dual USB 2.0 with integrated PHY
  • I/O Voltage Levels: 1.8V, 2.5V, 3.3V support
  • Operating Temperature Range: 0°C to 105°C
  • Peripheral Interfaces: DUART, I2C, PCI, SPI
  • Physical Package: 620-HBGA (29x29) ball grid array with exposed pad
  • Mounting: Surface mount technology

The MPC8343VRADDB meets all electrical and mechanical compatibility requirements for direct substitution. Both parts share identical core functionality, performance specifications, and package geometry.

Parameter Comparison

Parameter MPC8343ZQADDB MPC8343VRADDB Match
Core Processor PowerPC e300 PowerPC e300
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 266MHz 266MHz
RAM Controllers DDR, DDR2 DDR, DDR2
Ethernet 10/100/1000Mbps (3) 10/100/1000Mbps (3)
USB USB 2.0 + PHY (2) USB 2.0 + PHY (2)
Voltage - I/O 1.8V, 2.5V, 3.3V 1.8V, 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA) 0°C ~ 105°C (TA)
Additional Interfaces DUART, I2C, PCI, SPI DUART, I2C, PCI, SPI
Package / Case 620-BBGA Exposed Pad 620-BBGA Exposed Pad
Supplier Device Package 620-HBGA (29x29) 620-HBGA (29x29)
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
ECCN 3A991A2 3A991A2
HTSUS 8542.31.0001 8542.31.0001

Engineering Selection Recommendations

The MPC8343VRADDB is the direct equivalent substitute for the MPC8343ZQADDB. Both parts are manufactured by NXP and share identical electrical specifications and physical packaging.

Product Status Consideration: The MPC8343ZQADDB is classified as obsolete, while the MPC8343VRADDB maintains active product status. This distinction makes the MPC8343VRADDB the preferred selection for new designs and ongoing procurement.

Compliance Status: The MPC8343VRADDB is RoHS3 compliant, whereas the MPC8343ZQADDB is RoHS non-compliant. For applications subject to RoHS regulations, the MPC8343VRADDB is the appropriate choice.

Packaging Difference: The MPC8343ZQADDB is supplied without specified packaging, while the MPC8343VRADDB is supplied in trays. This packaging difference does not affect electrical or mechanical compatibility.

Both parts carry identical ECCN (3A991A2) and HTSUS (8542.31.0001) classifications, confirming regulatory equivalence.

Frequently Asked Questions (FAQ)

Q: Can the MPC8343VRADDB replace the MPC8343ZQADDB in existing designs?

A: Yes. The MPC8343VRADDB is electrically and mechanically equivalent to the MPC8343ZQADDB. All core processor specifications, memory controllers, interface counts, voltage levels, temperature range, and package geometry are identical. Direct substitution is supported without design modification.

Q: What is the difference between the MPC8343ZQADDB and MPC8343VRADDB?

A: The primary differences are product status and compliance certification. The MPC8343ZQADDB is obsolete and RoHS non-compliant. The MPC8343VRADDB is active and RoHS3 compliant. Packaging is also different: the MPC8343ZQADDB has no specified packaging, while the MPC8343VRADDB is supplied in trays. Electrical and mechanical specifications are identical.

Q: Are there any pin compatibility concerns with substitution?

A: No. Both parts use the identical 620-HBGA (29x29) package with exposed pad. Pin count, ball positions, and electrical assignments are identical. PCB layout and solder reflow profiles remain unchanged.

Q: Does the MPC8343VRADDB support the same memory types?

A: Yes. Both parts integrate DDR and DDR2 memory controllers with identical functionality and timing specifications.

Q: Are the Ethernet and USB specifications identical?

A: Yes. Both parts feature triple 10/100/1000Mbps Ethernet ports and dual USB 2.0 interfaces with integrated PHY. All interface specifications and performance characteristics are identical.

Q: What is the moisture sensitivity level for both parts?

A: Both parts carry MSL 3 (168 Hours) classification, indicating identical moisture handling and storage requirements.

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