MPC8323EVRAFDC Equivalent & Substitute Parts

Part Overview

The MPC8323EVRAFDC is a PowerPC e300c2 microprocessor IC from NXP Semiconductors, featuring a single 32-bit core operating at 333MHz in a 516-PBGA package. This embedded processor integrates communications capabilities, QUICC Engine, and Security (SEC 2.2) co-processors, along with DDR/DDR2 RAM controllers and triple 10/100Mbps Ethernet interfaces. The device is classified as obsolete, making equivalent and substitute parts necessary for legacy system maintenance, board redesigns, and inventory replenishment where original stock is unavailable or depleted.

Substiute Parts

MPC8323EVRAFDC

NXP SemiconductorsIn Stock: 708MPC8323EVRAFDC Datasheet

Current PartRFQ

MPC8323EVRAFDCA

NXP SemiconductorsIn Stock: 2023MPC8323EVRAFDCA Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the MPC8323EVRAFDC is determined by strict equivalence across the following critical parameters:

• Processor Architecture: PowerPC e300c2 core
• Core Configuration: Single 32-bit core
• Clock Speed: 333MHz
• Co-Processor Suite: Communications QUICC Engine and Security SEC 2.2
• Memory Controllers: DDR and DDR2 support
• Peripheral Integration: Triple Ethernet (10/100Mbps), USB 2.0, DUART, I2C, PCI, SPI, TDM, UART
• Electrical Specifications: I/O voltage levels (1.8V, 2.5V, 3.3V) and operating temperature range (0°C ~ 105°C)
• Physical Package: 516-PBGA (27x27) ball grid array

The MPC8323EVRAFDCA qualifies as a direct substitute based on identical core processor, clock speed, co-processor configuration, memory controllers, peripheral set, electrical specifications, and package geometry. Differences in packaging designation (Bulk vs. standard) and compliance certifications do not affect functional equivalence.

Parameter Comparison

Engineering Selection Recommendations

The MPC8323EVRAFDCA is a functional equivalent to the MPC8323EVRAFDC for applications requiring identical processor performance, peripheral integration, and electrical characteristics. Both devices are classified as obsolete products.

Selection between these parts should account for regulatory and compliance requirements:

• MPC8323EVRAFDC: RoHS3 compliant and REACH unaffected. Suitable for applications subject to European Union environmental directives and REACH regulations.
• MPC8323EVRAFDCA: RoHS non-compliant with vendor-undefined REACH status. Appropriate for legacy systems or applications without RoHS/REACH compliance mandates.

Inventory availability differs between the two part numbers. Current stock levels should be evaluated against project timelines and supply chain requirements.

Frequently Asked Questions (FAQ)

Q: Are MPC8323EVRAFDC and MPC8323EVRAFDCA pin-compatible?

A: Yes. Both devices use the 516-PBGA (27x27) package with identical ball grid array geometry and pinout. Direct socket substitution is supported without PCB redesign.

Q: What is the functional difference between these two part numbers?

A: There is no functional difference. Both devices contain the PowerPC e300c2 core, identical co-processor suite, memory controllers, and peripheral interfaces. Differences exist only in packaging designation and compliance certifications.

Q: Can I use MPC8323EVRAFDCA in a design originally specified for MPC8323EVRAFDC?

A: Functional compatibility is confirmed. Compliance compatibility depends on your application's regulatory requirements. If RoHS3 compliance or REACH unaffected status is mandatory, MPC8323EVRAFDC is required. If these certifications are not required, MPC8323EVRAFDCA is functionally equivalent.

Q: What does "obsolete" product status mean for these devices?

A: Both parts are no longer in active production by NXP Semiconductors. Availability is limited to existing inventory from authorized distributors. Long-term supply cannot be guaranteed.

Q: Are there any electrical or thermal differences between these parts?

A: No. Both devices operate at 333MHz, support identical I/O voltage levels (1.8V, 2.5V, 3.3V), and share the same operating temperature range (0°C ~ 105°C).

Q: Which part should I select for new designs?

A: Since both parts are obsolete, neither is recommended for new designs. Evaluate current NXP embedded processor offerings for new applications. For legacy system maintenance or board redesigns, select based on compliance requirements and inventory availability.