MPC8313ZQAFFC Equivalent & Substitute Parts

Part Overview

The MPC8313ZQAFFC is a PowerPC e300c3-based microprocessor IC manufactured by NXP USA Inc., designed for embedded applications requiring 32-bit processing capability. This device is packaged in a 516-TEPBGA (27x27) ball grid array with exposed pad configuration. The part is currently classified as obsolete, making identification of functionally equivalent alternatives essential for system redesign, legacy support, and procurement planning.

Substiute Parts

MPC8313ZQAFFC

NXP USA Inc.In Stock: 1140MPC8313ZQAFFC Datasheet

Current PartRFQ

MPC8313VRAFFC

NXP USA Inc.In Stock: 1561MPC8313VRAFFC Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

The MPC8313VRAFFC qualifies as a direct substitute for the MPC8313ZQAFFC based on the following alignment of critical parameters:

Mechanical Compatibility:

• Identical package type: 516-BBGA Exposed Pad
• Identical supplier device package: 516-TEPBGA (27x27)
• Identical mounting type: Surface Mount
• Identical MSL rating: 3 (168 Hours)

Regulatory & Classification Alignment:

• Same manufacturer: NXP USA Inc.
• Same category: Embedded Microprocessor
• Same ECCN classification: 3A991A2
• Same HTSUS code: 8542.31.0001
• Same REACH status: REACH Unaffected

Functional Core Architecture:

• Same base product family: MPC83xx series
• Same processor core: PowerPC e300c3
• Same core configuration: 1 Core, 32-Bit

The substitution is valid because both parts share identical physical footprints, thermal characteristics, and regulatory classifications, enabling direct PCB-level replacement without layout modification.

Parameter Comparison

Engineering Selection Recommendations

Primary Recommendation: MPC8313VRAFFC

The MPC8313VRAFFC is the direct substitute for the obsolete MPC8313ZQAFFC. Selection is justified on the following basis:

• Product Status: The substitute is classified as Active, ensuring continued availability and supply chain support, whereas the original part is Obsolete.
• Regulatory Compliance: The MPC8313VRAFFC achieves ROHS3 compliance, representing an improvement over the non-compliant original part. Both parts maintain identical REACH and ECCN classifications.
• Physical Compatibility: Identical package footprint (516-TEPBGA 27x27), mounting type, and MSL rating enable direct PCB-level substitution without design modification.
• Functional Equivalence: Both parts utilize the same PowerPC e300c3 processor core architecture and belong to the MPC83xx family, ensuring functional compatibility at the system level.

No design changes, firmware modifications, or board layout alterations are required for substitution.

Frequently Asked Questions (FAQ)

Q: Can the MPC8313VRAFFC be used as a direct replacement for the MPC8313ZQAFFC without PCB modifications?

A: Yes. Both parts share identical package specifications (516-TEPBGA 27x27), mounting type (Surface Mount), and ball grid array configuration. No PCB layout changes are necessary.

Q: What is the primary reason for substitution?

A: The MPC8313ZQAFFC is classified as Obsolete. The MPC8313VRAFFC is an Active product from the same manufacturer and family, ensuring long-term availability and supply chain continuity.

Q: Are there differences in regulatory compliance between the two parts?

A: Yes. The MPC8313VRAFFC achieves ROHS3 compliance, whereas the MPC8313ZQAFFC is RoHS non-compliant. Both parts maintain identical REACH Unaffected status and ECCN classification (3A991A2).

Q: Do both parts have the same moisture sensitivity rating?

A: Yes. Both the MPC8313ZQAFFC and MPC8313VRAFFC are rated MSL 3 (168 Hours), requiring identical handling and storage protocols.

Q: What processor architecture do these parts use?

A: Both parts utilize the PowerPC e300c3 core, a 32-bit embedded processor architecture. The MPC8313VRAFFC operates at 333MHz.

Q: Are there any electrical parameter differences?

A: The provided data specifies that the MPC8313VRAFFC supports I/O voltages of 1.8V, 2.5V, and 3.3V, with DDR and DDR2 RAM controller support, dual 10/100/1000Mbps Ethernet interfaces, USB 2.0 with PHY, and additional interfaces including DUART, HSSI, I2C, PCI, and SPI. Detailed electrical specifications should be verified against the respective datasheets for system-level design validation.

Q: What is the packaging difference between the two parts?

A: The MPC8313ZQAFFC is supplied without specified packaging, while the MPC8313VRAFFC is supplied in Tray packaging. Both use the identical 516-TEPBGA (27x27) device package.