MPC8313ECZQAFFC Equivalent & Substitute Parts

Part Overview

The MPC8313ECZQAFFC is a PowerPC e300c3 microprocessor from NXP Semiconductors designed for embedded applications requiring 32-bit processing at 333MHz. This device integrates dual Gigabit Ethernet ports, USB 2.0 interface, DDR/DDR2 memory controllers, and cryptographic security features in a 516-TEPBGA package. The main part is classified as obsolete, making equivalent substitute parts necessary for ongoing system support, maintenance, and new design implementations where this processor family remains applicable.

Substiute Parts

MPC8313ECZQAFFC
NXP SemiconductorsIn Stock: 1027MPC8313ECZQAFFC Datasheet
MPC8313ECZQAFFC
Current Part
MPC8313ECVRAFFC
NXP USA Inc.In Stock: 1283MPC8313ECVRAFFC Datasheet
MPC8313ECVRAFFC
Direct

Key Parameters

Parameter Value
Core Processor PowerPC e300c3
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 333MHz
RAM Controllers DDR, DDR2
Ethernet 10/100/1000Mbps (2)
USB USB 2.0 + PHY (1)
Security Features Cryptography; SEC 2.2
Voltage - I/O 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA)
Package / Case 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27)
Additional Interfaces DUART, HSSI, I2C, PCI, SPI
Mounting Type Surface Mount

Substitute Part Grouping Explanation

Substitution of the MPC8313ECZQAFFC is determined by strict equivalence across the following critical parameters:

  • Processor Architecture: PowerPC e300c3 core with identical instruction set
  • Performance Specification: 333MHz clock speed
  • Memory Interface: DDR and DDR2 controller support
  • Connectivity: Dual Gigabit Ethernet (10/100/1000Mbps), USB 2.0 with PHY, and identical peripheral interfaces (DUART, HSSI, I2C, PCI, SPI)
  • Security Capability: SEC 2.2 cryptographic coprocessor
  • Electrical Compatibility: 1.8V, 2.5V, 3.3V I/O voltage support
  • Thermal Range: -40°C to 105°C operating temperature
  • Physical Form Factor: 516-TEPBGA (27x27) package with exposed pad

The MPC8313ECVRAFFC qualifies as a direct substitute based on identical core specifications, performance metrics, interface configuration, and package geometry. Differences in product status and compliance certifications do not affect functional or electrical compatibility.

Parameter Comparison

Parameter MPC8313ECZQAFFC MPC8313ECVRAFFC
Manufacturer NXP Semiconductors NXP USA Inc.
Core Processor PowerPC e300c3 PowerPC e300c3
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 333MHz 333MHz
RAM Controllers DDR, DDR2 DDR, DDR2
Ethernet 10/100/1000Mbps (2) 10/100/1000Mbps (2)
USB USB 2.0 + PHY (1) USB 2.0 + PHY (1)
Security Features Cryptography; SEC 2.2 Cryptography; SEC 2.2
Voltage - I/O 1.8V, 2.5V, 3.3V 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Package / Case 516-BBGA Exposed Pad 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27) 516-TEPBGA (27x27)
Additional Interfaces DUART, HSSI, I2C, PCI, SPI DUART, HSSI, I2C, PCI, SPI
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
RoHS Status RoHS non-compliant ROHS3 Compliant
Packaging Not specified Tray

Engineering Selection Recommendations

The MPC8313ECVRAFFC is a direct functional equivalent to the MPC8313ECZQAFFC. Selection between these parts should be based on the following criteria:

Product Status: The MPC8313ECVRAFFC carries Active status, ensuring continued availability and manufacturing support. The MPC8313ECZQAFFC is classified as Obsolete, limiting future procurement options.

Compliance Certifications: The MPC8313ECVRAFFC meets ROHS3 compliance requirements, while the MPC8313ECZQAFFC is RoHS non-compliant. For applications subject to environmental or regulatory restrictions, the MPC8313ECVRAFFC is the appropriate selection.

Packaging Configuration: The MPC8313ECVRAFFC is supplied in Tray packaging, which may affect inventory management and handling procedures compared to the main part.

Both devices are electrically and functionally identical across all specified parameters, including processor architecture, clock speed, memory interface, connectivity, security features, voltage support, and thermal operating range. PCB layout and firmware compatibility remain unchanged between these parts.

Frequently Asked Questions (FAQ)

Q: Are MPC8313ECZQAFFC and MPC8313ECVRAFFC pin-compatible?

A: Yes. Both devices use the 516-TEPBGA (27x27) package with identical pinout, signal definitions, and electrical characteristics. Direct PCB substitution is possible without layout modifications.

Q: What is the difference between these part numbers?

A: The primary differences are product status (Obsolete vs. Active), RoHS compliance certification (non-compliant vs. ROHS3 Compliant), and packaging format (unspecified vs. Tray). All functional and electrical specifications are identical.

Q: Can I use MPC8313ECVRAFFC in a design originally specified for MPC8313ECZQAFFC?

A: Yes. The MPC8313ECVRAFFC is a direct substitute with identical core processor, clock speed, memory controllers, Ethernet interfaces, USB capability, security features, voltage support, and operating temperature range. No firmware or hardware modifications are required.

Q: Does the 516-TEPBGA package require special handling?

A: The 516-TEPBGA package is a surface-mount BGA device with 516 balls on a 27x27mm substrate. Standard BGA assembly processes, reflow profiles, and thermal management practices apply. Moisture sensitivity level is 3 (168 Hours), requiring appropriate storage and handling protocols.

Q: Are there inventory differences between these parts?

A: Yes. MPC8313ECZQAFFC inventory is listed as 918 Pcs New Original In Stock. MPC8313ECVRAFFC inventory is listed as 1201 Pcs New Original In Stock. Availability may vary by distributor and time.

Q: What security features are included in both parts?

A: Both devices include SEC 2.2 cryptographic coprocessor supporting cryptography operations. Security feature set is identical between the two parts.

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