MPC8313ECZQADDC Equivalent & Substitute Parts

Part Overview

The MPC8313ECZQADDC is a PowerPC e300c3 microprocessor IC from the MPC83xx series, featuring a single 32-bit core operating at 267MHz. This embedded processor integrates dual 10/100/1000Mbps Ethernet interfaces, USB 2.0 with PHY, DDR/DDR2 memory controllers, and security coprocessor (SEC 2.2) capabilities. The device is currently classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new designs requiring this processor architecture.

Substiute Parts

MPC8313ECZQADDC
NXP USA Inc.In Stock: 994MPC8313ECZQADDC Datasheet
MPC8313ECZQADDC
Current Part
MPC8313ECVRADDC
NXP USA Inc.In Stock: 3437MPC8313ECVRADDC Datasheet
MPC8313ECVRADDC
Direct

Key Parameters

Parameter Value
Manufacturer NXP USA Inc.
Series MPC83xx
Core Processor PowerPC e300c3
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 267MHz
RAM Controllers DDR, DDR2
Ethernet 10/100/1000Mbps (2)
USB USB 2.0 + PHY (1)
Co-Processors/DSP Security; SEC 2.2
Voltage - I/O 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA)
Package / Case 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27)
Additional Interfaces DUART, HSSI, I2C, PCI, SPI
Mounting Type Surface Mount

Substitute Part Grouping Explanation

Substitution eligibility for the MPC8313ECZQADDC is determined by strict equivalence across the following critical parameters:

  • Processor Architecture: PowerPC e300c3 core
  • Core Configuration: Single 32-bit core
  • Clock Speed: 267MHz
  • Memory Controller Support: DDR and DDR2 compatibility
  • Ethernet Capability: Dual 10/100/1000Mbps interfaces
  • USB Interface: USB 2.0 with integrated PHY
  • Security Coprocessor: SEC 2.2 implementation
  • I/O Voltage Levels: 1.8V, 2.5V, 3.3V support
  • Operating Temperature Range: -40°C to 105°C
  • Package Format: 516-TEPBGA (27x27) ball grid array
  • Peripheral Interfaces: DUART, HSSI, I2C, PCI, SPI

The MPC8313ECVRADDC meets all substitution criteria as a direct functional equivalent with identical electrical and mechanical specifications.

Parameter Comparison

Parameter MPC8313ECZQADDC MPC8313ECVRADDC
Manufacturer NXP USA Inc. NXP USA Inc.
Series MPC83xx MPC83xx
Core Processor PowerPC e300c3 PowerPC e300c3
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 267MHz 267MHz
RAM Controllers DDR, DDR2 DDR, DDR2
Ethernet 10/100/1000Mbps (2) 10/100/1000Mbps (2)
USB USB 2.0 + PHY (1) USB 2.0 + PHY (1)
Co-Processors/DSP Security; SEC 2.2 Security; SEC 2.2
Voltage - I/O 1.8V, 2.5V, 3.3V 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Package / Case 516-BBGA Exposed Pad 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27) 516-TEPBGA (27x27)
Additional Interfaces DUART, HSSI, I2C, PCI, SPI DUART, HSSI, I2C, PCI, SPI
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
RoHS Status RoHS non-compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN 5A002A1 5A002A1
HTSUS 8542.31.0001 8542.31.0001

Engineering Selection Recommendations

The MPC8313ECVRADDC is the direct substitute for the MPC8313ECZQADDC. Both parts maintain identical electrical specifications, core architecture, clock frequency, memory controller support, peripheral interfaces, and thermal operating range. The primary distinction is product lifecycle status: the MPC8313ECZQADDC is obsolete, while the MPC8313ECVRADDC maintains active production status.

The MPC8313ECVRADDC additionally provides ROHS3 compliance, addressing regulatory requirements for new designs and procurement cycles. Both parts carry identical REACH and ECCN classifications, ensuring consistent export and supply chain compliance.

Frequently Asked Questions (FAQ)

Q: Are the MPC8313ECZQADDC and MPC8313ECVRADDC pin-compatible?

A: Yes. Both devices use the 516-TEPBGA (27x27) package format with identical ball grid array pinout, enabling direct PCB-level substitution without layout modifications.

Q: What is the difference between these part numbers?

A: The MPC8313ECZQADDC is an obsolete variant, while the MPC8313ECVRADDC is the active production equivalent. All functional and electrical parameters are identical. The substitute part includes ROHS3 compliance certification.

Q: Can I use the MPC8313ECVRADDC in existing designs originally specified for the MPC8313ECZQADDC?

A: Yes. Identical electrical specifications, operating temperature range, voltage levels, and peripheral interface configurations ensure functional compatibility in existing circuit designs.

Q: Are there any thermal or power consumption differences between these parts?

A: No differences are specified in the provided technical parameters. Both parts operate within the same temperature range (-40°C to 105°C) and support identical I/O voltage levels (1.8V, 2.5V, 3.3V).

Q: What is the significance of the RoHS compliance difference?

A: The MPC8313ECVRADDC meets ROHS3 standards, making it suitable for applications subject to RoHS regulatory requirements. The MPC8313ECZQADDC does not carry this certification. For new designs or regulated markets, the MPC8313ECVRADDC is the appropriate selection.

Q: Do both parts support the same memory controller configurations?

A: Yes. Both the MPC8313ECZQADDC and MPC8313ECVRADDC support DDR and DDR2 memory controllers with identical electrical interface specifications.

Q: Is the Moisture Sensitivity Level (MSL) the same for both parts?

A: Yes. Both parts carry MSL 3 rating with a 168-hour floor life specification, requiring identical handling and storage protocols.

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