MPC8313CZQADDC Equivalent & Substitute Parts

Part Overview

The MPC8313CZQADDC is a PowerPC e300c3 microprocessor from NXP USA Inc., designed for embedded applications requiring 32-bit processing at 267MHz. This single-core processor integrates dual Gigabit Ethernet controllers, USB 2.0 with PHY, DDR/DDR2 memory support, and multiple serial interfaces including DUART, HSSI, I2C, PCI, and SPI. The device is packaged in a 516-TEPBGA (27x27) ball grid array with exposed pad and operates across the industrial temperature range of -40°C to 105°C.

The MPC8313CZQADDC carries an obsolete product status. Identifying equivalent substitute parts is necessary for design continuity, procurement planning, and system maintenance where this processor remains in active use or requires replacement in legacy systems.

Substiute Parts

MPC8313CZQADDC
NXP USA Inc.In Stock: 915MPC8313CZQADDC Datasheet
MPC8313CZQADDC
Current Part
MPC8313CVRADDC
NXP USA Inc.In Stock: 2118MPC8313CVRADDC Datasheet
MPC8313CVRADDC
Direct

Key Parameters

Parameter Value
Core Processor PowerPC e300c3
Number of Cores / Bus Width 1 Core, 32-Bit
Speed 267MHz
RAM Controllers DDR, DDR2
Ethernet 10/100/1000Mbps (2)
USB USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA)
Additional Interfaces DUART, HSSI, I2C, PCI, SPI
Package / Case 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27)
Mounting Type Surface Mount

Substitute Part Grouping Explanation

Substitution eligibility for the MPC8313CZQADDC is determined by strict equivalence across the following critical parameters:

  • Core processor architecture (PowerPC e300c3)
  • Core count and bus width (1 Core, 32-Bit)
  • Operating frequency (267MHz)
  • Memory controller support (DDR, DDR2)
  • Ethernet capability (10/100/1000Mbps dual controllers)
  • USB interface specification (USB 2.0 + PHY)
  • I/O voltage levels (1.8V, 2.5V, 3.3V)
  • Operating temperature range (-40°C ~ 105°C)
  • Peripheral interface set (DUART, HSSI, I2C, PCI, SPI)
  • Physical package format (516-TEPBGA 27x27 with exposed pad)

The MPC8313CVRADDC meets all these criteria and qualifies as a direct functional equivalent. Both parts share identical core specifications, peripheral integration, and package geometry, ensuring pin-for-pin and functional compatibility in existing designs.

Parameter Comparison

Parameter MPC8313CZQADDC MPC8313CVRADDC
Manufacturer NXP USA Inc. NXP USA Inc.
Series MPC83xx MPC83xx
Core Processor PowerPC e300c3 PowerPC e300c3
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 267MHz 267MHz
RAM Controllers DDR, DDR2 DDR, DDR2
Ethernet 10/100/1000Mbps (2) 10/100/1000Mbps (2)
USB USB 2.0 + PHY (1) USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 2.5V, 3.3V 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Additional Interfaces DUART, HSSI, I2C, PCI, SPI DUART, HSSI, I2C, PCI, SPI
Package / Case 516-BBGA Exposed Pad 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27) 516-TEPBGA (27x27)
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
RoHS Status RoHS non-compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN 3A991A2 3A991A2
HTSUS 8542.31.0001 8542.31.0001

Engineering Selection Recommendations

The MPC8313CVRADDC is the direct substitute for the MPC8313CZQADDC. Both parts are functionally identical across all electrical and mechanical specifications. The primary distinction is product lifecycle status: the MPC8313CZQADDC is obsolete, while the MPC8313CVRADDC maintains active production status.

For new designs or system refreshes, the MPC8313CVRADDC is the appropriate selection. This part carries ROHS3 compliance, meeting current environmental and regulatory requirements, whereas the MPC8313CZQADDC does not. Both parts maintain identical REACH and ECCN classifications.

Inventory availability differs between the two parts. The MPC8313CVRADDC has 2066 units in stock compared to 889 units for the MPC8313CZQADDC, providing greater procurement flexibility and supply chain security.

Frequently Asked Questions (FAQ)

Q: Are the MPC8313CZQADDC and MPC8313CVRADDC pin-for-pin compatible?

A: Yes. Both parts use the 516-TEPBGA (27x27) package with exposed pad and share identical pinout. They are directly interchangeable at the board level without layout modifications.

Q: What is the difference between these two part numbers?

A: The parts are functionally equivalent. The primary differences are product status (obsolete vs. active) and RoHS compliance (non-compliant vs. ROHS3 compliant). The MPC8313CVRADDC is the current production equivalent.

Q: Can I use the MPC8313CVRADDC as a drop-in replacement in existing designs using the MPC8313CZQADDC?

A: Yes. The MPC8313CVRADDC is a direct functional substitute with identical electrical specifications, peripheral integration, and package geometry. No design changes are required.

Q: What is the significance of the RoHS compliance difference?

A: The MPC8313CVRADDC meets ROHS3 standards, restricting hazardous substances in accordance with current environmental regulations. The MPC8313CZQADDC does not meet these standards. For applications subject to RoHS requirements, the MPC8313CVRADDC is the compliant choice.

Q: Are there any thermal or performance differences between these parts?

A: No. Both parts operate at 267MHz, support identical memory controllers (DDR, DDR2), and maintain the same operating temperature range (-40°C to 105°C). Thermal and performance characteristics are equivalent.

Q: What is the moisture sensitivity level for these parts?

A: Both parts carry MSL 3 with a 168-hour floor life. Standard moisture control procedures during storage and handling apply to both devices.

Q: Are there any supply chain considerations when switching from MPC8313CZQADDC to MPC8313CVRADDC?

A: The MPC8313CVRADDC has significantly higher inventory availability (2066 units vs. 889 units), providing better procurement security and shorter lead times for new orders.

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