MPC8313CVRADDB Equivalent & Substitute Parts

Part Overview

The MPC8313CVRADDB is a PowerPC e300c3 microprocessor IC from the MPC83xx series, featuring a single 32-bit core operating at 267MHz in a 516-TEPBGA package. This embedded processor integrates dual Gigabit Ethernet controllers, DDR/DDR2 memory support, USB 2.0 connectivity, and multiple serial interfaces including DUART, HSSI, I2C, PCI, and SPI. The part is classified as obsolete, making equivalent substitutes necessary for ongoing system support and new design implementations where this architecture remains applicable.

Substiute Parts

MPC8313CVRADDB
NXP USA Inc.In Stock: 1806MPC8313CVRADDB Datasheet
MPC8313CVRADDB
Current Part
MPC8313CVRADDC
NXP USA Inc.In Stock: 2118MPC8313CVRADDC Datasheet
MPC8313CVRADDC
Direct

Key Parameters

Parameter Value
Manufacturer NXP USA Inc.
Series MPC83xx
Core Processor PowerPC e300c3
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 267MHz
RAM Controllers DDR, DDR2
Ethernet 10/100/1000Mbps (2)
USB USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA)
Package / Case 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27)
Additional Interfaces DUART, HSSI, I2C, PCI, SPI
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the MPC8313CVRADDB is determined by strict equivalence across the following critical parameters:

  • Processor Architecture: PowerPC e300c3 core with identical instruction set compatibility
  • Core Configuration: Single 32-bit core at 267MHz
  • Memory Support: DDR and DDR2 controller functionality
  • Peripheral Integration: Dual Gigabit Ethernet (10/100/1000Mbps), USB 2.0 with PHY, and complete serial interface set (DUART, HSSI, I2C, PCI, SPI)
  • Electrical Specifications: I/O voltage levels (1.8V, 2.5V, 3.3V) and operating temperature range (-40°C to 105°C)
  • Package Compatibility: 516-TEPBGA (27x27) ball grid array with exposed pad
  • Compliance Standards: ROHS3 compliance and MSL 3 rating

The MPC8313CVRADDC qualifies as a direct substitute based on identical electrical, functional, and mechanical specifications across all parameters listed above.

Parameter Comparison

Parameter MPC8313CVRADDB MPC8313CVRADDC
Manufacturer NXP USA Inc. NXP USA Inc.
Series MPC83xx MPC83xx
Core Processor PowerPC e300c3 PowerPC e300c3
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 267MHz 267MHz
RAM Controllers DDR, DDR2 DDR, DDR2
Ethernet 10/100/1000Mbps (2) 10/100/1000Mbps (2)
USB USB 2.0 + PHY (1) USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 2.5V, 3.3V 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Package / Case 516-BBGA Exposed Pad 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27) 516-TEPBGA (27x27)
Additional Interfaces DUART, HSSI, I2C, PCI, SPI DUART, HSSI, I2C, PCI, SPI
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active

Engineering Selection Recommendations

The MPC8313CVRADDC is the qualified substitute for the obsolete MPC8313CVRADDB. Both parts maintain identical electrical, functional, and mechanical specifications, ensuring direct compatibility in existing designs and new implementations.

The primary distinction is product status: MPC8313CVRADDB is classified as obsolete, while MPC8313CVRADDC maintains active status with current manufacturing support. Both parts carry ROHS3 compliance and identical MSL 3 ratings, confirming equivalent environmental and regulatory standing.

For applications requiring the MPC83xx PowerPC e300c3 architecture with 267MHz operation, dual Gigabit Ethernet, DDR/DDR2 memory support, and 516-TEPBGA packaging, the MPC8313CVRADDC provides uninterrupted supply continuity and manufacturing support.

Frequently Asked Questions (FAQ)

Q: Are MPC8313CVRADDB and MPC8313CVRADDC pin-for-pin compatible?

A: Yes. Both parts use the 516-TEPBGA (27x27) package with identical ball assignments, electrical characteristics, and functional specifications. Direct PCB-level substitution is supported without design modification.

Q: What is the difference between these two part numbers?

A: The MPC8313CVRADDB is obsolete, while MPC8313CVRADDC maintains active production status. All electrical, functional, and mechanical parameters are identical. The suffix change reflects manufacturing lifecycle management by NXP USA Inc.

Q: Can I use MPC8313CVRADDC in a design originally specified for MPC8313CVRADDB?

A: Yes. Identical core processor architecture, clock speed, memory controllers, peripheral integration, I/O voltage levels, operating temperature range, and package specifications ensure full functional equivalence.

Q: Are there any compliance or certification differences?

A: No. Both parts carry ROHS3 compliance and MSL 3 (168 Hours) ratings. Regulatory and environmental certifications are equivalent.

Q: What interfaces are supported on both parts?

A: Both MPC8313CVRADDB and MPC8313CVRADDC support DUART, HSSI, I2C, PCI, and SPI interfaces, along with dual Gigabit Ethernet controllers and single USB 2.0 port with integrated PHY.

Q: Are there any thermal or voltage differences between these parts?

A: No. Both parts operate across the identical temperature range (-40°C to 105°C) and support the same I/O voltage levels (1.8V, 2.5V, 3.3V).

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