MPC8308CVMAGD Equivalent & Substitute Parts

Part Overview

The MPC8308CVMAGD is a PowerPC e300c3 microprocessor IC from the MPC83xx series, featuring a single 32-bit core operating at 400MHz. This embedded processor integrates DDR2 memory controllers, triple 10/100/1000Mbps Ethernet ports, USB 2.0, and additional interfaces including DUART, HSSI, I2C, MMC/SD/SDIO, and SPI. The device is housed in a 473-MAPBGA (19x19) package with surface mount configuration.

The MPC8308CVMAGD is classified as obsolete. Locating equivalent or substitute components becomes necessary when original stock is depleted or when system redesigns require component sourcing from alternative inventory channels.

Substiute Parts

MPC8308CVMAGD
NXP SemiconductorsIn Stock: 4060MPC8308CVMAGD Datasheet
MPC8308CVMAGD
Current Part
MPC8308CVMAGDA
NXP USA Inc.In Stock: 1566MPC8308CVMAGDA Datasheet
MPC8308CVMAGDA
Direct

Key Parameters

Parameter Value
Manufacturer Part Number MPC8308CVMAGD
Manufacturer NXP Semiconductors
Core Processor PowerPC e300c3
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 400MHz
RAM Controllers DDR2
Ethernet 10/100/1000Mbps (3)
USB USB 2.0 (1)
Voltage - I/O 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA)
Package / Case 473-LFBGA
Supplier Device Package 473-MAPBGA (19x19)
Additional Interfaces DUART, HSSI, I2C, MMC/SD/SDIO, SPI
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution eligibility for the MPC8308CVMAGD is determined by strict equivalence across the following critical parameters:

  • Core Processor Architecture: PowerPC e300c3
  • Core Count and Bus Width: 1 Core, 32-Bit
  • Operating Frequency: 400MHz
  • Memory Controller Type: DDR2
  • Ethernet Configuration: 10/100/1000Mbps (3 ports)
  • USB Configuration: USB 2.0 (1 port)
  • I/O Voltage Levels: 1.8V, 2.5V, 3.3V
  • Operating Temperature Range: -40°C ~ 105°C (TA)
  • Package Type: 473-MAPBGA (19x19)
  • Interface Set: DUART, HSSI, I2C, MMC/SD/SDIO, SPI

The MPC8308CVMAGDA qualifies as a direct substitute based on complete alignment across all specified electrical and mechanical parameters.

Parameter Comparison

Parameter MPC8308CVMAGD MPC8308CVMAGDA
Manufacturer NXP Semiconductors NXP USA Inc.
Core Processor PowerPC e300c3 PowerPC e300c3
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 400MHz 400MHz
RAM Controllers DDR2 DDR2
Ethernet 10/100/1000Mbps (3) 10/100/1000Mbps (3)
USB USB 2.0 (1) USB 2.0 (1)
Voltage - I/O 1.8V, 2.5V, 3.3V 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Package / Case 473-LFBGA 473-LFBGA
Supplier Device Package 473-MAPBGA (19x19) 473-MAPBGA (19x19)
Additional Interfaces DUART, HSSI, I2C, MMC/SD/SDIO, SPI DUART, HSSI, I2C, MMC/SD/SDIO, SPI
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Obsolete

Engineering Selection Recommendations

Both the MPC8308CVMAGD and MPC8308CVMAGDA are classified as obsolete products. Selection between these parts should be based on availability and compliance requirements.

Both components maintain ROHS3 compliance and identical MSL ratings (3, 168 Hours), ensuring equivalent handling and storage requirements. The electrical specifications, thermal operating range, and package footprint are identical, supporting direct substitution in existing designs without circuit modification.

When sourcing either component, verify that inventory meets the specified moisture sensitivity level requirements and that storage conditions comply with MSL 3 specifications prior to assembly.

Frequently Asked Questions (FAQ)

Q: Can MPC8308CVMAGDA replace MPC8308CVMAGD in production designs?

A: Yes. The MPC8308CVMAGDA is a direct electrical and mechanical equivalent. All core parameters—processor architecture, clock speed, memory controller type, peripheral configuration, voltage levels, temperature range, and package dimensions—are identical. No circuit redesign is required.

Q: Are there any differences in compliance or certification between these parts?

A: No. Both components carry identical RoHS3 compliance status and REACH unaffected designation. Moisture sensitivity levels and handling requirements are identical (MSL 3, 168 Hours).

Q: What is the significance of the package designation 473-MAPBGA (19x19)?

A: This specifies a 473-pin Micro Area Ball Grid Array package with 19mm × 19mm dimensions. Both parts use this identical package, ensuring PCB footprint compatibility and reflow soldering parameters remain unchanged.

Q: Why is component substitution necessary for obsolete parts?

A: Obsolete products have limited or depleted inventory. Equivalent parts from the same manufacturer provide continued access to functionally identical components for system maintenance, repair, or production continuation.

Q: Are there any interface or peripheral differences between these substitutes?

A: No. Both components provide identical peripheral configurations: triple Gigabit Ethernet ports, single USB 2.0 port, and identical auxiliary interfaces (DUART, HSSI, I2C, MMC/SD/SDIO, SPI).

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