MPC17511EP Equivalent & Substitute Parts

Part Overview

The MPC17511EP is a bipolar motor driver IC manufactured by NXP USA Inc., designed for brushed DC motor control applications in battery-powered systems. This device integrates control and power stage functionality in a 24-QFN-EP package with a supply voltage range of 2.7V to 5.7V and output current capability of 1A. The product is currently obsolete, making equivalent substitute parts necessary for ongoing design support and component sourcing.

Substiute Parts

MPC17511EP
NXP USA Inc.In Stock: 1487MPC17511EP Datasheet
MPC17511EP
Current Part
BA6209
Rohm SemiconductorIn Stock: 20872BA6209 Datasheet
BA6209
MFR Recommended
BD65496MUV-E2
Rohm SemiconductorIn Stock: 17963BD65496MUV-E2 Datasheet
BD65496MUV-E2
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number MPC17511EP
Manufacturer NXP USA Inc.
Category Power Management (PMIC)
Motor Type Brushed DC
Function Driver - Fully Integrated, Control and Power Stage
Output Configuration Half Bridge (2)
Interface Parallel
Technology CMOS
Current - Output 1A
Voltage - Supply 2.7V ~ 5.7V
Voltage - Load 2V ~ 6.8V
Operating Temperature -20°C ~ 150°C (TJ)
Mounting Type Surface Mount
Package / Case 24-VFQFN Exposed Pad
Product Status Obsolete
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the MPC17511EP is determined by the following critical parameters:

  • Motor control function (brushed DC motor driver with fully integrated control and power stage)
  • Output configuration (half bridge with 2 outputs)
  • Parallel interface compatibility
  • Supply voltage operating range overlap or compatibility with 2.7V ~ 5.7V
  • Output current capability of 1A or greater
  • Surface mount packaging with exposed pad design
  • ROHS3 compliance and active product status

Two substitute parts meet these criteria with varying degrees of parameter alignment:

BD65496MUV-E2 provides the closest electrical and mechanical match, maintaining surface mount packaging, similar supply voltage range (2.5V ~ 5.5V), and higher output current (1.2A). This part uses DMOS technology instead of CMOS and offers extended temperature range.

BA6209 offers functional equivalence as a brushed DC motor driver with half bridge output configuration and parallel interface, but operates at a higher supply voltage range (6V ~ 18V) and uses through-hole packaging, making it suitable only for applications where voltage and form factor constraints permit.

Parameter Comparison

Parameter MPC17511EP BD65496MUV-E2 BA6209
Manufacturer NXP USA Inc. Rohm Semiconductor Rohm Semiconductor
Motor Type - AC, DC Brushed DC Brushed DC Brushed DC
Function Driver - Fully Integrated, Control and Power Stage Driver - Fully Integrated, Control and Power Stage Driver - Fully Integrated, Control and Power Stage
Output Configuration Half Bridge (2) Half Bridge (2) Half Bridge (2)
Interface Parallel Parallel Parallel
Technology CMOS DMOS CMOS
Current - Output 1A 1.2A 1.6A
Voltage - Supply 2.7V ~ 5.7V 2.5V ~ 5.5V 6V ~ 18V
Voltage - Load 2V ~ 6.8V 1.8V ~ 16V 6.6V ~ 7.2V
Operating Temperature -20°C ~ 150°C (TJ) -30°C ~ 150°C (TJ) -20°C ~ 75°C (TA)
Mounting Type Surface Mount Surface Mount Through Hole
Package / Case 24-VFQFN Exposed Pad 24-VFQFN Exposed Pad 10-SIP Exposed Tab
Product Status Obsolete Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

BD65496MUV-E2 is the primary substitute for MPC17511EP applications. This part maintains identical surface mount packaging (24-VFQFN Exposed Pad), operates within the compatible supply voltage range (2.5V ~ 5.5V overlap with 2.7V ~ 5.7V), and provides equivalent or superior output current (1.2A versus 1A). The part is active in production status with ROHS3 compliance and unlimited moisture sensitivity level rating. Extended operating temperature range (-30°C to 150°C) provides additional thermal margin compared to the original part.

BA6209 serves as a functional alternative only when circuit design permits operation at higher supply voltages (6V ~ 18V minimum). This part is active in production with ROHS3 compliance but requires through-hole mounting, making it unsuitable for surface mount PCB designs. The restricted load voltage range (6.6V ~ 7.2V) and lower maximum operating temperature (75°C) limit its applicability to specific use cases.

Frequently Asked Questions (FAQ)

Q: Can BD65496MUV-E2 directly replace MPC17511EP in existing designs?

A: BD65496MUV-E2 is electrically compatible for applications operating within the overlapping supply voltage range (2.5V ~ 5.5V). Both parts use identical 24-VFQFN Exposed Pad packaging, enabling direct PCB footprint compatibility. Pin configuration and parallel interface alignment must be verified against device datasheets before implementation.

Q: What are the key differences between BD65496MUV-E2 and MPC17511EP?

A: BD65496MUV-E2 uses DMOS technology versus CMOS in the original part, resulting in different electrical characteristics. Output current is increased from 1A to 1.2A. Supply voltage range is slightly lower (2.5V minimum versus 2.7V minimum). Operating temperature range is extended at the lower end (-30°C versus -20°C). Load voltage range is significantly wider (1.8V ~ 16V versus 2V ~ 6.8V).

Q: Is BA6209 suitable for battery-powered applications?

A: BA6209 operates at a minimum supply voltage of 6V, making it unsuitable for battery-powered systems designed around the MPC17511EP's 2.7V ~ 5.7V range. This part is applicable only to applications with higher voltage supplies and through-hole mounting requirements.

Q: What compliance certifications apply to substitute parts?

A: Both BD65496MUV-E2 and BA6209 are ROHS3 compliant and REACH unaffected, matching the compliance profile of the obsolete MPC17511EP. Both parts carry EAR99 export classification.

Q: How does packaging affect substitution decisions?

A: BD65496MUV-E2 maintains identical surface mount packaging (24-VFQFN Exposed Pad), requiring no PCB redesign. BA6209 uses 10-SIP through-hole packaging, necessitating PCB layout modifications and is incompatible with surface mount assembly processes.

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