MP86884DQKT-LF-Z Equivalent & Substitute Parts

Part Overview

The MP86884DQKT-LF-Z is a half bridge driver IC manufactured by Monolithic Power Systems Inc., designed for general purpose power MOSFET applications with a 55A output current capability. This device operates within a supply voltage range of 4.5V to 5.5V and supports inductive load switching with current limiting fault protection. The part is classified as Not For New Designs, indicating it has been superseded in the product lifecycle. Identifying equivalent and substitute parts is necessary for applications requiring continued support, inventory management, or design flexibility when the primary part becomes unavailable.

Substiute Parts

MP86884DQKT-LF-Z

Monolithic Power Systems Inc.In Stock: 4752MP86884DQKT-LF-Z Datasheet

Current PartRFQ

MP86945-AGVT-Z

Monolithic Power Systems Inc.In Stock: 40831MP86945-AGVT-Z Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The MP86945-AGVT-Z is identified as a manufacturer-recommended substitute for the MP86884DQKT-LF-Z. Substitution eligibility is determined by the following key parameters:

• Output Configuration: Both devices implement half bridge driver topology
• Fault Protection: Both provide current limiting protection
• Supply Voltage Range: Both operate within compatible 4.5V to 5.5V supply specifications
• Load Voltage Range: Both support 4.5V to 14V load voltage operation
• Operating Temperature Range: Both maintain -40°C to 125°C (TJ) thermal specifications
• Compliance Standards: Both are ROHS3 compliant and REACH unaffected
• Moisture Sensitivity: Both rated at MSL 2 (1 Year)
• Mounting Technology: Both are surface mount devices

The primary difference lies in output current capability (60A versus 55A) and package form factor (25-TQFN versus 34-TQFN), with the substitute offering higher current capacity in a smaller package footprint.

Parameter Comparison

Engineering Selection Recommendations

The MP86945-AGVT-Z is the manufacturer-recommended substitute and is classified as Active product status, providing continued support and availability. The MP86884DQKT-LF-Z is designated Not For New Designs, making the MP86945-AGVT-Z the preferred choice for ongoing applications and new designs requiring half bridge driver functionality.

Both parts maintain identical compliance certifications (ROHS3 Compliant, REACH Unaffected) and equivalent electrical operating parameters across supply voltage, load voltage, and temperature ranges. The substitute offers enhanced current capacity (60A versus 55A) within a more compact package footprint (25-TQFN versus 34-TQFN), providing design flexibility for space-constrained applications.

Frequently Asked Questions (FAQ)

Q: Can the MP86945-AGVT-Z directly replace the MP86884DQKT-LF-Z in existing designs?

A: Yes. Both devices share identical half bridge output configuration, supply voltage range (4.5V to 5.5V), load voltage range (4.5V to 14V), operating temperature range (-40°C to 125°C), and current limiting fault protection. The substitute provides equal or superior electrical performance with higher output current capacity (60A versus 55A).

Q: What are the package differences between these parts?

A: The MP86884DQKT-LF-Z uses a 34-TQFN (6x6mm) package, while the MP86945-AGVT-Z uses a 25-TQFN (4x5mm) package. The smaller footprint of the substitute may require PCB layout modifications but offers space savings in compact designs.

Q: Are there compliance or certification differences?

A: No. Both parts are ROHS3 compliant, REACH unaffected, and rated at MSL 2 (1 Year) moisture sensitivity level. Compliance certifications are equivalent.

Q: Why is the MP86884DQKT-LF-Z marked as Not For New Designs?

A: This designation indicates the part has been superseded in the manufacturer's product lifecycle. The MP86945-AGVT-Z, classified as Active, represents the current generation solution and is recommended for all new applications.

Q: What is the primary advantage of the MP86945-AGVT-Z?

A: The substitute offers higher output current capacity (60A versus 55A) in a smaller package form factor (25-TQFN versus 34-TQFN), providing improved thermal performance and design flexibility while maintaining full electrical compatibility.