MP86883GQKT-Z Equivalent & Substitute Parts

Part Overview

The MP86883GQKT-Z is a half bridge driver IC from Monolithic Power Systems Inc., designed for general purpose power MOSFET applications. This device features a 55A output current capability, integrated bootstrap circuit, and comprehensive fault protection including current limiting and over-temperature detection. The part is packaged in a 34-TQFN (6x6) surface mount configuration and operates across a supply voltage range of 4.5V to 5.5V with load voltage support from 4.5V to 14V.

The MP86883GQKT-Z carries a product status of "Not For New Designs," indicating that Monolithic Power Systems Inc. has designated this part as obsolete or end-of-life for new applications. This status necessitates identification of functionally equivalent alternatives for ongoing production requirements and new design implementations.

Substiute Parts

MP86883GQKT-Z
Monolithic Power Systems Inc.In Stock: 1643MP86883GQKT-Z Datasheet
MP86883GQKT-Z
Current Part
MP86945-AGVT-Z
Monolithic Power Systems Inc.In Stock: 40831MP86945-AGVT-Z Datasheet
MP86945-AGVT-Z
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Monolithic Power Systems Inc.
Category Power Management (PMIC)
Output Configuration Half Bridge
Current - Output / Channel 55A
Voltage - Supply 4.5V ~ 5.5V
Voltage - Load 4.5V ~ 14V
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 34-PowerWFQFN (34-TQFN 6x6)
Mounting Type Surface Mount
Features Bootstrap Circuit, Status Flag
Fault Protection Current Limiting, Over Temperature
RoHS Status ROHS3 Compliant
MSL Rating 2 (1 Year)

Substitute Part Grouping Explanation

The MP86945-AGVT-Z qualifies as a manufacturer-recommended substitute for the MP86883GQKT-Z based on the following substitution criteria:

Common Functional Parameters:

  • Manufacturer: Monolithic Power Systems Inc. (same manufacturer ensures design continuity and support)
  • Category: Power Management (PMIC) with half-bridge driver topology
  • Output Configuration: Half Bridge (identical functional architecture)
  • Fault Protection: Current limiting and over-temperature protection (equivalent safety features)
  • RoHS Status: ROHS3 Compliant (equivalent environmental compliance)
  • MSL Rating: 2 (1 Year) (identical moisture sensitivity level)
  • Mounting Type: Surface Mount (same assembly compatibility)

Substitution Basis: The MP86945-AGVT-Z represents an active product with enhanced specifications. The substitute maintains the core half-bridge driver functionality while offering increased output current capability (60A versus 55A) and a more compact package footprint (25-TQFN 4x5 versus 34-TQFN 6x6). Both devices operate within compatible voltage ranges and temperature specifications, enabling direct functional replacement in applications where the original part is no longer available.

Parameter Comparison

Parameter MP86883GQKT-Z (Original) MP86945-AGVT-Z (Substitute)
Manufacturer Monolithic Power Systems Inc. Monolithic Power Systems Inc.
Category Power Management (PMIC) Power Management (PMIC)
Output Configuration Half Bridge Half Bridge
Current - Output / Channel 55A 60A
Package / Case 34-PowerWFQFN (34-TQFN 6x6) 25-PowerWFQFN (25-TQFN 4x5)
Mounting Type Surface Mount Surface Mount
Fault Protection Current Limiting, Over Temperature Current Limiting, Over Temperature
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 2 (1 Year) 2 (1 Year)
Product Status Not For New Designs Active

Engineering Selection Recommendations

The MP86945-AGVT-Z is designated as the manufacturer-recommended substitute for the MP86883GQKT-Z. Selection of the substitute part is based on the following engineering considerations:

Product Status: The original MP86883GQKT-Z carries a "Not For New Designs" status, indicating manufacturer discontinuation for new applications. The MP86945-AGVT-Z maintains "Active" product status with full manufacturer support and ongoing availability (40,787 units in stock versus 1,550 units for the original part).

Compliance & Certifications: Both parts maintain identical RoHS3 compliance and REACH unaffected status, ensuring equivalent environmental and regulatory compliance across supply chain requirements. MSL ratings are identical at Level 2 (1 Year), maintaining equivalent moisture handling and storage protocols.

Functional Equivalence: Both devices implement half-bridge driver architecture with current limiting and over-temperature fault protection. The substitute provides enhanced output current capability (60A versus 55A), representing a performance improvement rather than a limitation. The more compact package footprint (25-TQFN 4x5) of the substitute requires PCB layout redesign but offers reduced board space consumption.

Frequently Asked Questions (FAQ)

Q: Can the MP86945-AGVT-Z directly replace the MP86883GQKT-Z without circuit modifications?

A: Functional replacement is possible due to identical half-bridge driver topology and fault protection features. However, the substitute uses a different package (25-TQFN 4x5 versus 34-TQFN 6x6), requiring PCB layout redesign. Pin configuration and electrical interface must be verified against device datasheets before implementation.

Q: What are the key differences between these two parts?

A: The primary differences are output current rating (60A substitute versus 55A original), package size (25-TQFN versus 34-TQFN), and product status (Active versus Not For New Designs). Both maintain identical supply voltage ranges (4.5V ~ 5.5V), load voltage ranges (4.5V ~ 14V), and operating temperature specifications (-40°C ~ 125°C).

Q: Why is the original part marked "Not For New Designs"?

A: This designation indicates that Monolithic Power Systems Inc. has discontinued the MP86883GQKT-Z for new applications. Existing inventory remains available for legacy product support, but new designs should utilize the MP86945-AGVT-Z or other active alternatives.

Q: Are there any compliance or certification differences between the parts?

A: No. Both parts maintain identical RoHS3 compliance, REACH unaffected status, and MSL Level 2 (1 Year) ratings. Regulatory and environmental compliance requirements are equivalent across both devices.

Q: What considerations apply to package migration from 34-TQFN to 25-TQFN?

A: The substitute's smaller package footprint (4x5mm versus 6x6mm) reduces board area but requires complete PCB layout redesign. Pin pitch, thermal pad configuration, and trace routing must be re-evaluated. Thermal performance characteristics should be verified against application requirements, as the smaller package may affect heat dissipation properties.

Request Quote (Ships tomorrow)