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MP86883GQKT-Z Equivalent & Substitute Parts
Part Overview
The MP86883GQKT-Z is a half bridge driver IC from Monolithic Power Systems Inc., designed for general purpose power MOSFET applications. This device features a 55A output current capability, integrated bootstrap circuit, and comprehensive fault protection including current limiting and over-temperature detection. The part is packaged in a 34-TQFN (6x6) surface mount configuration and operates across a supply voltage range of 4.5V to 5.5V with load voltage support from 4.5V to 14V.
The MP86883GQKT-Z carries a product status of "Not For New Designs," indicating that Monolithic Power Systems Inc. has designated this part as obsolete or end-of-life for new applications. This status necessitates identification of functionally equivalent alternatives for ongoing production requirements and new design implementations.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Monolithic Power Systems Inc. |
| Category | Power Management (PMIC) |
| Output Configuration | Half Bridge |
| Current - Output / Channel | 55A |
| Voltage - Supply | 4.5V ~ 5.5V |
| Voltage - Load | 4.5V ~ 14V |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Package / Case | 34-PowerWFQFN (34-TQFN 6x6) |
| Mounting Type | Surface Mount |
| Features | Bootstrap Circuit, Status Flag |
| Fault Protection | Current Limiting, Over Temperature |
| RoHS Status | ROHS3 Compliant |
| MSL Rating | 2 (1 Year) |
Substitute Part Grouping Explanation
The MP86945-AGVT-Z qualifies as a manufacturer-recommended substitute for the MP86883GQKT-Z based on the following substitution criteria:
Common Functional Parameters:
- Manufacturer: Monolithic Power Systems Inc. (same manufacturer ensures design continuity and support)
- Category: Power Management (PMIC) with half-bridge driver topology
- Output Configuration: Half Bridge (identical functional architecture)
- Fault Protection: Current limiting and over-temperature protection (equivalent safety features)
- RoHS Status: ROHS3 Compliant (equivalent environmental compliance)
- MSL Rating: 2 (1 Year) (identical moisture sensitivity level)
- Mounting Type: Surface Mount (same assembly compatibility)
Substitution Basis: The MP86945-AGVT-Z represents an active product with enhanced specifications. The substitute maintains the core half-bridge driver functionality while offering increased output current capability (60A versus 55A) and a more compact package footprint (25-TQFN 4x5 versus 34-TQFN 6x6). Both devices operate within compatible voltage ranges and temperature specifications, enabling direct functional replacement in applications where the original part is no longer available.
Parameter Comparison
| Parameter | MP86883GQKT-Z (Original) | MP86945-AGVT-Z (Substitute) |
|---|---|---|
| Manufacturer | Monolithic Power Systems Inc. | Monolithic Power Systems Inc. |
| Category | Power Management (PMIC) | Power Management (PMIC) |
| Output Configuration | Half Bridge | Half Bridge |
| Current - Output / Channel | 55A | 60A |
| Package / Case | 34-PowerWFQFN (34-TQFN 6x6) | 25-PowerWFQFN (25-TQFN 4x5) |
| Mounting Type | Surface Mount | Surface Mount |
| Fault Protection | Current Limiting, Over Temperature | Current Limiting, Over Temperature |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| MSL Rating | 2 (1 Year) | 2 (1 Year) |
| Product Status | Not For New Designs | Active |
Engineering Selection Recommendations
The MP86945-AGVT-Z is designated as the manufacturer-recommended substitute for the MP86883GQKT-Z. Selection of the substitute part is based on the following engineering considerations:
Product Status: The original MP86883GQKT-Z carries a "Not For New Designs" status, indicating manufacturer discontinuation for new applications. The MP86945-AGVT-Z maintains "Active" product status with full manufacturer support and ongoing availability (40,787 units in stock versus 1,550 units for the original part).
Compliance & Certifications: Both parts maintain identical RoHS3 compliance and REACH unaffected status, ensuring equivalent environmental and regulatory compliance across supply chain requirements. MSL ratings are identical at Level 2 (1 Year), maintaining equivalent moisture handling and storage protocols.
Functional Equivalence: Both devices implement half-bridge driver architecture with current limiting and over-temperature fault protection. The substitute provides enhanced output current capability (60A versus 55A), representing a performance improvement rather than a limitation. The more compact package footprint (25-TQFN 4x5) of the substitute requires PCB layout redesign but offers reduced board space consumption.
Frequently Asked Questions (FAQ)
Q: Can the MP86945-AGVT-Z directly replace the MP86883GQKT-Z without circuit modifications?
A: Functional replacement is possible due to identical half-bridge driver topology and fault protection features. However, the substitute uses a different package (25-TQFN 4x5 versus 34-TQFN 6x6), requiring PCB layout redesign. Pin configuration and electrical interface must be verified against device datasheets before implementation.
Q: What are the key differences between these two parts?
A: The primary differences are output current rating (60A substitute versus 55A original), package size (25-TQFN versus 34-TQFN), and product status (Active versus Not For New Designs). Both maintain identical supply voltage ranges (4.5V ~ 5.5V), load voltage ranges (4.5V ~ 14V), and operating temperature specifications (-40°C ~ 125°C).
Q: Why is the original part marked "Not For New Designs"?
A: This designation indicates that Monolithic Power Systems Inc. has discontinued the MP86883GQKT-Z for new applications. Existing inventory remains available for legacy product support, but new designs should utilize the MP86945-AGVT-Z or other active alternatives.
Q: Are there any compliance or certification differences between the parts?
A: No. Both parts maintain identical RoHS3 compliance, REACH unaffected status, and MSL Level 2 (1 Year) ratings. Regulatory and environmental compliance requirements are equivalent across both devices.
Q: What considerations apply to package migration from 34-TQFN to 25-TQFN?
A: The substitute's smaller package footprint (4x5mm versus 6x6mm) reduces board area but requires complete PCB layout redesign. Pin pitch, thermal pad configuration, and trace routing must be re-evaluated. Thermal performance characteristics should be verified against application requirements, as the smaller package may affect heat dissipation properties.
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