MP6903DS-LF-Z Equivalent & Substitute Parts

Part Overview

The MP6903DS-LF-Z is an active secondary-side controller IC manufactured by Monolithic Power Systems Inc., designed for power supply applications. This 8-SOIC surface mount device operates across a supply voltage range of 8V to 24V with a supply current of 3 mA and maintains functionality across the industrial temperature range of -40°C to 125°C. The part holds Active product status and is ROHS3 compliant. Equivalent and substitute parts are identified for applications requiring alternative packaging formats, different voltage specifications, or supply chain flexibility while maintaining core secondary-side controller functionality.

Substiute Parts

MP6903DS-LF-Z

Monolithic Power Systems Inc.In Stock: 26825MP6903DS-LF-Z Datasheet

Current PartRFQ

ISPPAC-POWR605-01SN24I

Lattice Semiconductor CorporationIn Stock: 2607ISPPAC-POWR605-01SN24I Datasheet

MFR RecommendedRFQ

UCC24610DRBR

Texas InstrumentsIn Stock: 23130UCC24610DRBR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the MP6903DS-LF-Z are qualified based on the following core substitution criteria:

• Functional Category: Power Management (PMIC) secondary-side controller
• Mounting Type: Surface Mount
• Product Status: Active
• RoHS Compliance: ROHS3 Compliant
• Operating Temperature Range: Minimum -40°C to 125°C support
• Supply Current: Within acceptable operational range (≤4.6 mA)

The identified substitutes maintain secondary-side controller functionality across different packaging formats and voltage specifications. Substitution validity is determined by compatibility within the allowed electrical and mechanical parameter ranges specified for this product category.

Parameter Comparison

Engineering Selection Recommendations

All three parts maintain Active product status and ROHS3 compliance, qualifying them for equivalent substitution within their respective electrical operating ranges. The MP6903DS-LF-Z operates across 8V to 24V supply voltage. The ISPPAC-POWR605-01SN24I operates within a narrower 2.64V to 3.96V range and includes a higher pin count (24-QFNS) with power supply monitoring functionality. The UCC24610DRBR operates within 4.5V to 5.5V and maintains the same operating temperature range as the primary part (-40°C to 125°C) with lower supply current consumption (2.15 mA).

Selection between these parts depends on circuit voltage requirements and available board space for package accommodation. The UCC24610DRBR maintains MSL 2 rating identical to the primary part, while the ISPPAC-POWR605-01SN24I carries MSL 3 with reduced shelf life (168 hours versus 1 year).

Frequently Asked Questions (FAQ)

Q: Can the ISPPAC-POWR605-01SN24I directly replace the MP6903DS-LF-Z in a circuit designed for 8V to 24V operation?

A: No. The ISPPAC-POWR605-01SN24I operates within 2.64V to 3.96V supply voltage range, which does not overlap with the MP6903DS-LF-Z operating range of 8V to 24V. This part is suitable only for circuits operating within its specified voltage window.

Q: What are the package differences between these three parts?

A: The MP6903DS-LF-Z uses 8-SOIC packaging (0.154" width, 3.90mm). The ISPPAC-POWR605-01SN24I uses 24-VFQFN Exposed Pad (4x4mm), requiring significantly more board space. The UCC24610DRBR uses 8-VDFN Exposed Pad (3x3mm), offering a compact footprint similar in pin count to the primary part.

Q: Is the UCC24610DRBR suitable for applications requiring the full -40°C to 125°C temperature range?

A: Yes. The UCC24610DRBR maintains the complete -40°C to 125°C operating temperature range specified for the MP6903DS-LF-Z.

Q: What is the significance of the MSL rating difference between these parts?

A: The MP6903DS-LF-Z and UCC24610DRBR carry MSL 2 (1 Year shelf life), while the ISPPAC-POWR605-01SN24I carries MSL 3 (168 Hours shelf life). MSL 3 components require more stringent moisture control during storage and handling to prevent solder joint degradation.

Q: Can these parts be used interchangeably in the same PCB layout?

A: No. Package differences (8-SOIC versus 24-QFNS versus 8-VDFN) require different footprints and board layouts. PCB redesign is necessary when substituting between these parts.