MP2002AGD-Z Equivalent & Substitute Parts

Part Overview

The MP2002AGD-Z is a linear voltage regulator IC from Monolithic Power Systems Inc., classified as a Power Management (PMIC) component. This device functions as a positive adjustable output regulator with 500mA output current capability in an 8-QFN (2x3) surface mount package. The part is currently in active production status with 2402 units available in inventory. Substitute parts are identified when equivalent electrical specifications and mechanical compatibility are maintained across the product line, enabling procurement flexibility and supply chain continuity.

Substiute Parts

MP2002AGD-Z
Monolithic Power Systems Inc.In Stock: 2453MP2002AGD-Z Datasheet
MP2002AGD-Z
Current Part
MP2002AGD-P
Monolithic Power Systems Inc.In Stock: 1487MP2002AGD-P Datasheet
MP2002AGD-P
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Monolithic Power Systems Inc.
Category Power Management (PMIC)
Output Configuration Positive
Output Type Adjustable
Number of Regulators 1
Voltage - Input (Max) 6.5V
Voltage - Output (Min/Fixed) 0.5V
Voltage - Output (Max) 5V
Voltage Dropout (Max) 0.29V @ 500mA
Current - Output 500mA
Control Features Enable, Power Good
Protection Features Over Current, Over Temperature
Operating Temperature (TJ) 125°C
Mounting Type Surface Mount
Package / Case 8-TFDFN Exposed Pad
Supplier Device Package 8-QFN (2x3)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Substitute Part Grouping Explanation

Substitution eligibility for the MP2002AGD-Z is determined by strict equivalence across all critical electrical and mechanical parameters. The substitute part MP2002AGD-P maintains identical specifications in the following key areas:

Output voltage range (0.5V to 5V adjustable), maximum input voltage (6.5V), output current capacity (500mA), dropout voltage performance (0.29V @ 500mA), control features (Enable and Power Good), and protection mechanisms (Over Current and Over Temperature). Both parts share the same package configuration (8-QFN 2x3 with exposed pad), mounting technology (surface mount), and thermal rating (125°C junction temperature).

Compliance certifications are equivalent: both parts are ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99. Moisture sensitivity level is identical at MSL 1 (unlimited). The base product number MP2002 is common to both variants, confirming they belong to the same product family with interchangeable functionality.

Parameter Comparison

Parameter MP2002AGD-Z (Main) MP2002AGD-P (Substitute) Match Status
Manufacturer Monolithic Power Systems Inc. Monolithic Power Systems Inc. Identical
Output Configuration Positive Positive Identical
Output Type Adjustable Adjustable Identical
Number of Regulators 1 1 Identical
Voltage - Input (Max) 6.5V 6.5V Identical
Voltage - Output (Min/Fixed) 0.5V 0.5V Identical
Voltage - Output (Max) 5V 5V Identical
Voltage Dropout (Max) 0.29V @ 500mA 0.29V @ 500mA Identical
Current - Output 500mA 500mA Identical
Control Features Enable, Power Good Enable, Power Good Identical
Protection Features Over Current, Over Temperature Over Current, Over Temperature Identical
Operating Temperature (TJ) 125°C 125°C Identical
Mounting Type Surface Mount Surface Mount Identical
Package / Case 8-TFDFN Exposed Pad 8-TFDFN Exposed Pad Identical
Supplier Device Package 8-QFN (2x3) 8-QFN (2x3) Identical
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) Identical
REACH Status REACH Unaffected REACH Unaffected Identical
ECCN EAR99 EAR99 Identical
HTSUS 8542.39.0001 8542.39.0001 Identical

Engineering Selection Recommendations

Both MP2002AGD-Z and MP2002AGD-P are active production parts from Monolithic Power Systems Inc. with full compliance to ROHS3 and REACH regulations. Selection between these parts is based on availability and procurement requirements rather than functional differences.

The MP2002AGD-Z currently maintains higher inventory (2402 units) compared to MP2002AGD-P (1449 units). Both parts carry identical electrical performance specifications, package configurations, and regulatory certifications. The choice between these variants does not impact circuit design, PCB layout, or thermal management considerations, as all critical parameters are equivalent.

Frequently Asked Questions (FAQ)

Q: Are MP2002AGD-Z and MP2002AGD-P pin-compatible?

A: Yes. Both parts use the 8-QFN (2x3) package with exposed pad configuration. Pin assignments, spacing, and PCB footprint requirements are identical.

Q: Can I substitute MP2002AGD-P for MP2002AGD-Z in an existing design?

A: Yes. All electrical specifications, output voltage range, current capacity, control features, and protection mechanisms are identical. No circuit modifications are required.

Q: What is the difference between these two part numbers?

A: The difference is limited to the packaging designation suffix (Z versus P). Both parts are manufactured by Monolithic Power Systems Inc. and belong to the MP2002 product family. Electrical and mechanical specifications are equivalent.

Q: Are there any thermal or performance differences between these parts?

A: No. Both parts have identical maximum junction temperature (125°C), dropout voltage (0.29V @ 500mA), and output current rating (500mA).

Q: Do both parts meet the same compliance standards?

A: Yes. Both MP2002AGD-Z and MP2002AGD-P are ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99. Moisture sensitivity level is MSL 1 (unlimited) for both.

Q: Which part should I order if both are available?

A: Selection is based on procurement availability and lead time requirements. The MP2002AGD-Z has higher current inventory (2402 units). Both parts are functionally equivalent and interchangeable.

Q: Can these parts be used in high-temperature applications?

A: Both parts are rated to 125°C junction temperature. Application suitability depends on the specific thermal environment and circuit design requirements.

Q: Are there any soldering or assembly differences between these parts?

A: No. Both parts use surface mount technology with identical package dimensions and thermal characteristics. Standard SMT assembly processes apply to both variants.

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