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MP2002AGD-Z Equivalent & Substitute Parts
Part Overview
The MP2002AGD-Z is a linear voltage regulator IC from Monolithic Power Systems Inc., classified as a Power Management (PMIC) component. This device functions as a positive adjustable output regulator with 500mA output current capability in an 8-QFN (2x3) surface mount package. The part is currently in active production status with 2402 units available in inventory. Substitute parts are identified when equivalent electrical specifications and mechanical compatibility are maintained across the product line, enabling procurement flexibility and supply chain continuity.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Monolithic Power Systems Inc. |
| Category | Power Management (PMIC) |
| Output Configuration | Positive |
| Output Type | Adjustable |
| Number of Regulators | 1 |
| Voltage - Input (Max) | 6.5V |
| Voltage - Output (Min/Fixed) | 0.5V |
| Voltage - Output (Max) | 5V |
| Voltage Dropout (Max) | 0.29V @ 500mA |
| Current - Output | 500mA |
| Control Features | Enable, Power Good |
| Protection Features | Over Current, Over Temperature |
| Operating Temperature (TJ) | 125°C |
| Mounting Type | Surface Mount |
| Package / Case | 8-TFDFN Exposed Pad |
| Supplier Device Package | 8-QFN (2x3) |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8542.39.0001 |
Substitute Part Grouping Explanation
Substitution eligibility for the MP2002AGD-Z is determined by strict equivalence across all critical electrical and mechanical parameters. The substitute part MP2002AGD-P maintains identical specifications in the following key areas:
Output voltage range (0.5V to 5V adjustable), maximum input voltage (6.5V), output current capacity (500mA), dropout voltage performance (0.29V @ 500mA), control features (Enable and Power Good), and protection mechanisms (Over Current and Over Temperature). Both parts share the same package configuration (8-QFN 2x3 with exposed pad), mounting technology (surface mount), and thermal rating (125°C junction temperature).
Compliance certifications are equivalent: both parts are ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99. Moisture sensitivity level is identical at MSL 1 (unlimited). The base product number MP2002 is common to both variants, confirming they belong to the same product family with interchangeable functionality.
Parameter Comparison
| Parameter | MP2002AGD-Z (Main) | MP2002AGD-P (Substitute) | Match Status |
|---|---|---|---|
| Manufacturer | Monolithic Power Systems Inc. | Monolithic Power Systems Inc. | Identical |
| Output Configuration | Positive | Positive | Identical |
| Output Type | Adjustable | Adjustable | Identical |
| Number of Regulators | 1 | 1 | Identical |
| Voltage - Input (Max) | 6.5V | 6.5V | Identical |
| Voltage - Output (Min/Fixed) | 0.5V | 0.5V | Identical |
| Voltage - Output (Max) | 5V | 5V | Identical |
| Voltage Dropout (Max) | 0.29V @ 500mA | 0.29V @ 500mA | Identical |
| Current - Output | 500mA | 500mA | Identical |
| Control Features | Enable, Power Good | Enable, Power Good | Identical |
| Protection Features | Over Current, Over Temperature | Over Current, Over Temperature | Identical |
| Operating Temperature (TJ) | 125°C | 125°C | Identical |
| Mounting Type | Surface Mount | Surface Mount | Identical |
| Package / Case | 8-TFDFN Exposed Pad | 8-TFDFN Exposed Pad | Identical |
| Supplier Device Package | 8-QFN (2x3) | 8-QFN (2x3) | Identical |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Identical |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | Identical |
| REACH Status | REACH Unaffected | REACH Unaffected | Identical |
| ECCN | EAR99 | EAR99 | Identical |
| HTSUS | 8542.39.0001 | 8542.39.0001 | Identical |
Engineering Selection Recommendations
Both MP2002AGD-Z and MP2002AGD-P are active production parts from Monolithic Power Systems Inc. with full compliance to ROHS3 and REACH regulations. Selection between these parts is based on availability and procurement requirements rather than functional differences.
The MP2002AGD-Z currently maintains higher inventory (2402 units) compared to MP2002AGD-P (1449 units). Both parts carry identical electrical performance specifications, package configurations, and regulatory certifications. The choice between these variants does not impact circuit design, PCB layout, or thermal management considerations, as all critical parameters are equivalent.
Frequently Asked Questions (FAQ)
Q: Are MP2002AGD-Z and MP2002AGD-P pin-compatible?
A: Yes. Both parts use the 8-QFN (2x3) package with exposed pad configuration. Pin assignments, spacing, and PCB footprint requirements are identical.
Q: Can I substitute MP2002AGD-P for MP2002AGD-Z in an existing design?
A: Yes. All electrical specifications, output voltage range, current capacity, control features, and protection mechanisms are identical. No circuit modifications are required.
Q: What is the difference between these two part numbers?
A: The difference is limited to the packaging designation suffix (Z versus P). Both parts are manufactured by Monolithic Power Systems Inc. and belong to the MP2002 product family. Electrical and mechanical specifications are equivalent.
Q: Are there any thermal or performance differences between these parts?
A: No. Both parts have identical maximum junction temperature (125°C), dropout voltage (0.29V @ 500mA), and output current rating (500mA).
Q: Do both parts meet the same compliance standards?
A: Yes. Both MP2002AGD-Z and MP2002AGD-P are ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99. Moisture sensitivity level is MSL 1 (unlimited) for both.
Q: Which part should I order if both are available?
A: Selection is based on procurement availability and lead time requirements. The MP2002AGD-Z has higher current inventory (2402 units). Both parts are functionally equivalent and interchangeable.
Q: Can these parts be used in high-temperature applications?
A: Both parts are rated to 125°C junction temperature. Application suitability depends on the specific thermal environment and circuit design requirements.
Q: Are there any soldering or assembly differences between these parts?
A: No. Both parts use surface mount technology with identical package dimensions and thermal characteristics. Standard SMT assembly processes apply to both variants.
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