MMSZ5235B Zener Diode Equivalent & Substitute Parts

Part Overview

The MMSZ5235B is an active-status Zener diode manufactured by Taiwan Semiconductor Corporation, designed for surface mount applications in the SOD-123F package. This component operates at a nominal Zener voltage of 6.8 V with a maximum power dissipation of 500 mW, suitable for voltage regulation and protection circuits. The part is RoHS3 compliant and REACH unaffected, meeting current environmental standards. Substitute parts are identified when packaging configurations differ while maintaining identical electrical performance specifications, allowing procurement flexibility across supply channels.

Substiute Parts

MMSZ5235B

Taiwan Semiconductor CorporationIn Stock: 71130MMSZ5235B Datasheet

Current PartRFQ

MMSZ5235B RHG

Taiwan Semiconductor CorporationIn Stock: 7057MMSZ5235B RHG Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the MMSZ5235B is determined by electrical parameter equivalence and package compatibility. The critical parameters defining substitution eligibility are:

• Voltage - Zener (Nom): 6.8 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max): 5 Ohms
• Current - Reverse Leakage @ Vr: 3 µA @ 5 V
• Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
• Operating Temperature Range: -65°C to 150°C (TJ)
• Package / Case: SOD-123F
• Mounting Type: Surface Mount

The identified substitute part, MMSZ5235B RHG, maintains identical electrical specifications and package form factor. The substitution differs only in packaging configuration (Tape & Reel versus standard packaging), which does not affect electrical performance or circuit functionality.

Parameter Comparison

Engineering Selection Recommendations

Both MMSZ5235B and MMSZ5235B RHG are active-status components manufactured by Taiwan Semiconductor Corporation with identical electrical specifications and SOD-123F package form factors. Selection between these parts is determined by procurement and assembly requirements rather than electrical performance.

The MMSZ5235B RHG variant in Tape & Reel packaging is suitable for high-volume automated assembly operations where reel-fed component handling is standard. The standard MMSZ5235B packaging accommodates lower-volume applications or manual assembly processes.

Both variants maintain RoHS3 compliance and REACH unaffected status, satisfying current environmental and regulatory requirements. No electrical performance degradation occurs when substituting between these parts within the same circuit design.

Frequently Asked Questions (FAQ)

Q: Can MMSZ5235B RHG be used as a direct replacement for MMSZ5235B in circuit designs?

A: Yes. Both parts are electrically identical with matching Zener voltage (6.8 V), power rating (500 mW), impedance (5 Ohms), and operating temperature range (-65°C to 150°C). The SOD-123F package and surface mount configuration are identical. Substitution is valid for all circuit applications.

Q: What is the difference between MMSZ5235B and MMSZ5235B RHG?

A: The primary difference is packaging configuration. MMSZ5235B RHG is supplied in Tape & Reel (TR) format, while MMSZ5235B uses standard packaging. Electrical performance and physical package dimensions remain identical.

Q: Are there any compliance or certification differences between these parts?

A: No. Both MMSZ5235B and MMSZ5235B RHG carry identical RoHS3 compliance and REACH unaffected status. Environmental and regulatory certifications are equivalent.

Q: Which part should be selected for high-volume production?

A: MMSZ5235B RHG in Tape & Reel packaging is optimized for high-volume automated assembly operations. Standard MMSZ5235B packaging is suitable for lower-volume or manual assembly processes.

Q: Is the SOD-123F package identical for both parts?

A: Yes. Both MMSZ5235B and MMSZ5235B RHG use the SOD-123F surface mount package with identical physical dimensions and pin configuration.

Q: Can these parts be used interchangeably in existing PCB designs?

A: Yes. Since both parts share identical electrical specifications, package form factor, and mounting type, they are fully interchangeable in existing PCB designs without circuit modification.