MMRF1009HSR5 Equivalent & Substitute Parts

Part Overview

The MMRF1009HSR5 is an RF MOSFET LDMOS transistor manufactured by NXP USA Inc., designed for high-frequency RF applications operating at 1.03 GHz with 500W output power capability. This device features a 50V test voltage rating, 19.7 dB gain, and is housed in a NI-780S chassis mount package.

The MMRF1009HSR5 is classified as obsolete. Locating equivalent or substitute components is necessary to support ongoing system maintenance, repair, and production requirements where original inventory is depleted or unavailable.

Substiute Parts

MMRF1009HSR5
NXP USA Inc.In Stock: 1212MMRF1009HSR5 Datasheet
MMRF1009HSR5
Current Part
AFV10700HSR5
NXP USA Inc.In Stock: 744AFV10700HSR5 Datasheet
AFV10700HSR5
MFR Recommended

Key Parameters

Parameter Value Unit
Manufacturer NXP USA Inc.
Technology LDMOS
Frequency 1.03 GHz
Voltage - Test 50 V
Voltage - Rated 110 V
Current - Test 200 mA
Gain 19.7 dB
Power - Output 500 W
Package / Case NI-780S
Mounting Type Chassis Mount
RoHS Status ROHS3 Compliant
REACH Status REACH Unaffected

Substitute Part Grouping Explanation

Substitution of the MMRF1009HSR5 is determined by alignment across the following critical parameters:

Technology & Frequency Compatibility: Both the main part and substitute must operate on LDMOS technology within the RF frequency band. The MMRF1009HSR5 operates at 1.03 GHz; substitute parts must support this frequency or a compatible frequency range.

Voltage Specifications: Test voltage and rated voltage must be equal to or exceed the original part specifications to ensure safe operation within the same circuit topology.

Power Output Capability: The substitute must deliver equivalent or greater output power to maintain system performance.

Gain Performance: Gain values must be within acceptable tolerance to preserve signal amplification characteristics.

Package & Mounting: Physical package type and mounting configuration must be compatible with the existing PCB layout and thermal management design.

Regulatory Compliance: All substitute parts must maintain equivalent RoHS and REACH compliance status.

The AFV10700HSR5 qualifies as a substitute based on matching LDMOS technology, overlapping frequency range (1.03–1.09 GHz includes the original 1.03 GHz specification), equivalent voltage ratings, superior power output (770W exceeds 500W), comparable gain (19.2 dB is within acceptable tolerance of 19.7 dB), and identical regulatory compliance.

Parameter Comparison

Parameter MMRF1009HSR5 AFV10700HSR5 Unit
Manufacturer NXP USA Inc. NXP USA Inc.
Technology LDMOS LDMOS
Frequency 1.03 1.03–1.09 GHz
Voltage - Test 50 50 V
Voltage - Rated 110 105 V
Current - Test 200 100 mA
Gain 19.7 19.2 dB
Power - Output 500 770 W
Package / Case NI-780S NI-780S-4L
Mounting Type Chassis Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected
Product Status Obsolete Active

Engineering Selection Recommendations

The AFV10700HSR5 is the qualified substitute for the obsolete MMRF1009HSR5. Both devices are manufactured by NXP USA Inc. and maintain identical ROHS3 and REACH compliance certifications, ensuring regulatory alignment for applications requiring environmental and hazardous substance restrictions.

The AFV10700HSR5 is classified as an active product with current manufacturing support and inventory availability, eliminating supply chain risk associated with the obsolete MMRF1009HSR5. This substitution provides enhanced output power capability (770W versus 500W) while maintaining equivalent test voltage specifications and comparable gain performance.

The primary design consideration is the transition from chassis mount (NI-780S) to surface mount (NI-780S-4L) packaging. This change requires PCB layout modification and may affect thermal management strategy. The dual configuration of the AFV10700HSR5 provides additional design flexibility for multi-stage amplifier topologies.

Frequently Asked Questions (FAQ)

Q: Can the AFV10700HSR5 directly replace the MMRF1009HSR5 without circuit modification?

A: The AFV10700HSR5 is electrically compatible based on matching LDMOS technology, test voltage (50V), and frequency range (1.03–1.09 GHz includes the original 1.03 GHz specification). However, the package transition from chassis mount (NI-780S) to surface mount (NI-780S-4L) requires PCB layout redesign. Thermal management and mounting hardware must be re-evaluated for the new package configuration.

Q: What is the significance of the frequency range difference (1.03 GHz versus 1.03–1.09 GHz)?

A: The AFV10700HSR5 operates across a broader frequency range that encompasses the original MMRF1009HSR5 operating point of 1.03 GHz. This expanded bandwidth provides design flexibility and does not compromise compatibility at the original frequency specification.

Q: How do the gain specifications compare?

A: The MMRF1009HSR5 provides 19.7 dB gain, while the AFV10700HSR5 provides 19.2 dB gain. The 0.5 dB difference is within typical engineering tolerance for RF amplifier design and does not preclude substitution. System gain adjustment through impedance matching or biasing may be required to achieve identical performance.

Q: What are the implications of the higher output power rating (770W versus 500W)?

A: The AFV10700HSR5 delivers 54% greater output power capability. This enhancement provides design margin and improved efficiency in power amplifier applications. Existing circuit designs operating at 500W output will function within the AFV10700HSR5 power envelope without modification.

Q: Are there compliance or regulatory differences between these parts?

A: Both the MMRF1009HSR5 and AFV10700HSR5 maintain identical ROHS3 compliance and REACH unaffected status. No regulatory re-qualification is required for substitution in applications subject to these environmental standards.

Q: What is the difference between the NI-780S and NI-780S-4L packages?

A: The NI-780S is a chassis mount package designed for through-hole or bolt-down mounting. The NI-780S-4L is a surface mount variant with four leads optimized for PCB assembly. The transition requires mechanical redesign of the mounting interface and thermal path.

Q: Is the AFV10700HSR5 available in the same tape and reel packaging as the original part?

A: The AFV10700HSR5 is supplied in tape and reel (TR) packaging, suitable for automated assembly processes. The MMRF1009HSR5 packaging format was not specified in the original documentation. Verify packaging requirements with your procurement process.

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