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MM3Z2V7T1 Equivalent & Substitute Parts
Part Overview
The MM3Z2V7T1 is a Zener diode rated at 2.7 V nominal with 200 mW maximum power dissipation in a surface mount SOD-323 package. Manufactured by onsemi, this component is classified as obsolete product status. Due to its obsolete designation, equivalent and substitute parts from active product lines are necessary for new designs and ongoing production requirements. Substitute components maintain the core electrical specifications while offering improved availability and compliance certifications.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Zener (Nom) | 2.7 | V |
| Tolerance | ±7% | — |
| Power - Max | 200 | mW |
| Impedance (Max) | 100 | Ohms |
| Current - Reverse Leakage @ Vr | 20 | µA @ 1 V |
| Voltage - Forward (Vf) (Max) @ If | 900 | mV @ 10 mA |
| Operating Temperature Range | -65 to 150 | °C |
| Mounting Type | Surface Mount | — |
| Package / Case | SC-76, SOD-323 | — |
Substitute Part Grouping Explanation
Substitute parts for the MM3Z2V7T1 are classified into two functional categories based on allowed electrical parameters:
Direct Upgrade (Higher Power Rating): MM3Z2V7T1G maintains identical electrical specifications with increased power dissipation (300 mW vs. 200 mW). This part is a direct functional upgrade from the same manufacturer with active product status and RoHS3 compliance.
Similar Substitutes (Higher Power Rating with Tolerance Variation): BZX384-C2V7,115 and PZU2.7BA,115 provide 2.7 V nominal zener voltage with power ratings of 300 mW and 320 mW respectively. These parts feature ±5% tolerance (tighter than the original ±7%) and active product status. BZX384-C2V7,115 is manufactured by Nexperia USA Inc., while PZU2.7BA,115 is manufactured by NXP USA Inc.
Parametric Equivalents (Identical Specifications): BZT52C2V7S-7-F and BZT52C2V7S-TP match the original MM3Z2V7T1 across all critical parameters: 2.7 V nominal voltage, 200 mW power rating, ±7% tolerance, and identical thermal/electrical characteristics. Both are active products with RoHS3 compliance from alternative manufacturers (Diodes Incorporated and Micro Commercial Co respectively).
Substitution eligibility is determined by: (1) matching or exceeding zener voltage tolerance, (2) equal or greater power dissipation capability, (3) identical or superior impedance characteristics, and (4) compatible SOD-323 package format.
Parameter Comparison
| Parameter | MM3Z2V7T1 | MM3Z2V7T1G | BZX384-C2V7,115 | PZU2.7BA,115 | BZT52C2V7S-7-F | BZT52C2V7S-TP |
|---|---|---|---|---|---|---|
| Manufacturer | onsemi | onsemi | Nexperia USA Inc. | NXP USA Inc. | Diodes Incorporated | Micro Commercial Co |
| Voltage - Zener (Nom) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| Tolerance | ±7% | ±7% | ±5% | ±5% | ±7% | ±7% |
| Power - Max | 200 mW | 300 mW | 300 mW | 320 mW | 200 mW | 200 mW |
| Impedance (Max) | 100 Ohms | 100 Ohms | 100 Ohms | 100 Ohms | 100 Ohms | 100 Ohms |
| Current - Reverse Leakage @ Vr | 20 µA @ 1 V | 20 µA @ 1 V | 20 µA @ 1 V | 20 µA @ 1 V | 20 µA @ 1 V | 20 µA @ 1 V |
| Voltage - Forward (Vf) (Max) @ If | 900 mV @ 10 mA | 900 mV @ 10 mA | 1.1 V @ 100 mA | 1.1 V @ 100 mA | 900 mV @ 10 mA | 900 mV @ 10 mA |
| Operating Temperature Range | -65 to 150°C | -65 to 150°C | -65 to 150°C | -55 to 150°C | -65 to 150°C | -65 to 150°C |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | SC-76, SOD-323 | SC-76, SOD-323 | SC-76, SOD-323 | SC-76, SOD-323 | SC-76, SOD-323 | SC-76, SOD-323 |
| Product Status | Obsolete | Active | Active | Active | Active | Active |
| RoHS Status | Non-compliant | RoHS3 Compliant | RoHS3 Compliant | Not specified | RoHS3 Compliant | RoHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | Not specified | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
For Direct Replacement with Enhanced Capability: MM3Z2V7T1G is the primary substitute. It is manufactured by onsemi (same original manufacturer), maintains identical electrical specifications, and provides 50% increased power dissipation (300 mW vs. 200 mW). This part carries active product status and RoHS3 compliance, eliminating obsolescence risk.
For Parametric Equivalence: BZT52C2V7S-7-F and BZT52C2V7S-TP provide exact electrical parameter matching to the original MM3Z2V7T1, including 200 mW power rating and ±7% tolerance. Both parts are active products with RoHS3 compliance. Selection between these two depends on packaging requirements: BZT52C2V7S-7-F is supplied in Cut Tape & Digi-Reel format, while BZT52C2V7S-TP is supplied in Tape & Reel format.
For Higher Power Applications: BZX384-C2V7,115 and PZU2.7BA,115 are suitable when circuit design permits increased power dissipation. BZX384-C2V7,115 offers 300 mW with ±5% tolerance and active status. PZU2.7BA,115 provides 320 mW with ±5% tolerance and active status. Note that PZU2.7BA,115 has a reduced operating temperature minimum of -55°C compared to -65°C for other options.
All substitute parts maintain SOD-323 package compatibility and identical reverse leakage characteristics. Selection should account for product status (all substitutes are active), compliance requirements (RoHS3 compliance available for all primary options), and specific packaging and power dissipation needs of the application.
Frequently Asked Questions (FAQ)
Q: Can MM3Z2V7T1G be used as a direct replacement for MM3Z2V7T1?
A: Yes. MM3Z2V7T1G is a direct substitute from the same manufacturer with identical zener voltage (2.7 V), tolerance (±7%), and electrical characteristics. The primary difference is increased power dissipation (300 mW vs. 200 mW), which provides enhanced thermal margin. Both parts use the SOD-323 package and are pin-compatible.
Q: What is the difference between parametric equivalents and similar substitutes?
A: Parametric equivalents (BZT52C2V7S-7-F and BZT52C2V7S-TP) match all electrical specifications of the original part, including 200 mW power rating and ±7% tolerance. Similar substitutes (BZX384-C2V7,115 and PZU2.7BA,115) provide higher power dissipation (300–320 mW) and tighter tolerance (±5%), making them suitable for applications requiring enhanced performance but not requiring exact parameter matching.
Q: Are all substitute parts RoHS compliant?
A: MM3Z2V7T1G, BZX384-C2V7,115, BZT52C2V7S-7-F, and BZT52C2V7S-TP are all RoHS3 compliant. PZU2.7BA,115 RoHS status is not specified in the provided data. The original MM3Z2V7T1 is RoHS non-compliant.
Q: Does packaging format affect electrical performance?
A: No. Packaging format (Tape & Reel, Cut Tape & Digi-Reel, or Bulk) affects handling, storage, and assembly processes but does not alter electrical performance. All substitute parts in SOD-323 package format are electrically equivalent within their specified parameter ranges.
Q: What is the operating temperature range for each substitute?
A: MM3Z2V7T1, MM3Z2V7T1G, BZX384-C2V7,115, BZT52C2V7S-7-F, and BZT52C2V7S-TP all operate from -65°C to 150°C. PZU2.7BA,115 operates from -55°C to 150°C, with a higher minimum temperature limit.
Q: Can BZX384-C2V7,115 or PZU2.7BA,115 be used in circuits designed for 200 mW dissipation?
A: Yes. Both parts are rated for higher power dissipation (300 mW and 320 mW respectively) and will function in circuits designed for 200 mW operation. The higher power rating provides additional thermal margin and does not degrade performance in lower-power applications.
Q: How does tolerance affect part selection?
A: The original MM3Z2V7T1 has ±7% tolerance. Substitute parts with ±7% tolerance (MM3Z2V7T1G, BZT52C2V7S-7-F, BZT52C2V7S-TP) maintain identical tolerance specifications. Substitutes with ±5% tolerance (BZX384-C2V7,115, PZU2.7BA,115) provide tighter voltage regulation, which may be beneficial in precision applications but is not required for direct replacement.
Q: Is the SOD-323 package identical across all substitute parts?
A: Yes. All substitute parts use the SC-76/SOD-323 package format, ensuring mechanical and electrical compatibility with the original MM3Z2V7T1 in PCB layouts and assembly processes.
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