MLF2012DR22MT Equivalent & Substitute Parts

Part Overview

The MLF2012DR22MT is a 220 nH shielded multilayer inductor manufactured by TDK Corporation, designed for surface mount applications in the 0805 (2012 Metric) package. This component delivers 250 mA current rating with 300mOhm maximum DC resistance and operates across the -55°C to 125°C temperature range. The part is classified as "Not For New Designs," making identification of suitable alternatives essential for ongoing production and maintenance applications.

Substiute Parts

MLF2012DR22MT

TDK CorporationIn Stock: 1014MLF2012DR22MT Datasheet

Current PartRFQ

MLF2012DR22KT000

TDK CorporationIn Stock: 2434MLF2012DR22KT000 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the MLF2012DR22MT is determined by strict alignment across the following critical parameters:

• Inductance Value: 220 nH (exact match required)
• Package / Case: 0805 (2012 Metric) (exact match required)
• Mounting Type: Surface Mount (exact match required)
• Current Rating: 250 mA minimum (equal or higher acceptable)
• DC Resistance: 300mOhm maximum (equal or lower acceptable)
• Shielding: Shielded (exact match required)
• Operating Temperature Range: -55°C ~ 125°C minimum (equal or wider acceptable)
• Material - Core: Ferrite (exact match required)

The MLF2012DR22KT000 qualifies as a direct substitute based on matching all critical electrical and mechanical parameters within the allowed tolerance specifications.

Parameter Comparison

Engineering Selection Recommendations

The MLF2012DR22KT000 is the qualified substitute for MLF2012DR22MT applications. Selection between these parts should be based on the following factors:

Product Status Consideration: The MLF2012DR22MT carries "Not For New Designs" status, while MLF2012DR22KT000 is classified as "Active." For new circuit designs and ongoing production, MLF2012DR22KT000 is the preferred selection.

Compliance Alignment: Both parts maintain ROHS3 compliance and REACH Unaffected status, ensuring regulatory compatibility across applications.

Tolerance Specification: MLF2012DR22KT000 provides ±10% inductance tolerance compared to the ±20% tolerance of MLF2012DR22MT. This tighter tolerance may benefit applications requiring improved frequency stability or reduced circuit tuning variation.

Inventory Availability: MLF2012DR22KT000 maintains higher stock levels (2340 Pcs) relative to MLF2012DR22MT (912 Pcs), supporting supply chain continuity.

Frequently Asked Questions (FAQ)

Q: Can MLF2012DR22KT000 directly replace MLF2012DR22MT in existing designs?

A: Yes. Both parts share identical inductance values, current ratings, DC resistance specifications, package dimensions, and operating temperature ranges. The 0805 (2012 Metric) surface mount package ensures mechanical and electrical compatibility without PCB layout modifications.

Q: What is the significance of the inductance tolerance difference?

A: MLF2012DR22MT specifies ±20% tolerance while MLF2012DR22KT000 specifies ±10% tolerance. The tighter tolerance of the substitute part provides improved consistency in inductance value across production batches, which may reduce circuit performance variation in frequency-dependent applications.

Q: Are there any thermal or environmental limitations when substituting?

A: No. Both parts operate across the identical -55°C to 125°C temperature range and maintain MSL 1 (Unlimited) moisture sensitivity rating, ensuring equivalent performance in thermal and humidity environments.

Q: Why is MLF2012DR22MT marked "Not For New Designs"?

A: This designation indicates the part is in mature or declining production status. MLF2012DR22KT000, classified as "Active," represents the current production alternative and is recommended for all new circuit development.

Q: Do package and mounting specifications remain identical?

A: Yes. Both parts use the 0805 (2012 Metric) surface mount package with identical dimensions (0.079" L x 0.049" W / 2.00mm x 1.25mm) and maximum seated height (0.041" / 1.05mm). No PCB footprint or assembly process changes are required.