MLASE042SCG8R2DWNA01 Equivalent & Substitute Parts

Part Overview

The MLASE042SCG8R2DWNA01 is an 8.2 pF ceramic capacitor manufactured by Taiyo Yuden, rated for 16V operation with C0G/NP0 temperature coefficient characteristics. This surface-mount multilayer ceramic capacitor (MLCC) is packaged in 01005 (0402 Metric) form factor and is currently in active product status. The part is designed for medical and non-critical applications requiring stable capacitance across the operating temperature range of -55°C to 125°C.

Substitute parts become necessary when the primary manufacturer part experiences supply constraints, extended lead times, or when design flexibility permits the use of functionally equivalent alternatives from different manufacturers while maintaining electrical and mechanical compatibility.

Substiute Parts

MLASE042SCG8R2DWNA01

Taiyo YudenIn Stock: 650MLASE042SCG8R2DWNA01 Datasheet

Current PartRFQ

C0402C0G1C8R2D

TDK CorporationIn Stock: 3900C0402C0G1C8R2D Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the MLASE042SCG8R2DWNA01 is determined by strict equivalence across the following critical parameters:

Electrical Parameters (Non-Negotiable):

• Capacitance value: 8.2 pF
• Tolerance: ±0.5pF
• Voltage rating: 16V (minimum)
• Temperature coefficient: C0G or NP0 designation
• Operating temperature range: -55°C to 125°C

Mechanical Parameters (Non-Negotiable):

• Package type: 01005 (0402 Metric)
• Mounting type: Surface Mount, MLCC
• Physical dimensions: 0.016" L x 0.008" W (0.40mm x 0.20mm)
• Maximum thickness: 0.009" (0.22mm)

Compliance Parameters:

• RoHS3 compliance
• Moisture Sensitivity Level: 1 (Unlimited)
• REACH Unaffected status

Substitute parts must satisfy all parameters listed above. Variations in packaging format (Tape & Reel versus Cut Tape) do not affect electrical or mechanical compatibility and represent logistics considerations only. Product status differences (Active versus Obsolete) are noted for supply chain planning but do not disqualify functional equivalence.

Parameter Comparison

Engineering Selection Recommendations

Primary Part: MLASE042SCG8R2DWNA01 (Taiyo Yuden)

Selection of the primary part is recommended when supply availability permits. This part maintains active product status, ensuring long-term availability and consistent manufacturing processes. The Tape & Reel packaging format supports high-volume automated assembly operations. Current inventory of 628 pieces provides immediate availability for production requirements.

Substitute Part: C0402C0G1C8R2D (TDK Corporation)

The C0402C0G1C8R2D from TDK Corporation is a direct electrical and mechanical equivalent. All critical parameters—capacitance, tolerance, voltage rating, temperature coefficient, operating temperature range, package dimensions, and compliance certifications—match the primary part exactly. This substitute is suitable for applications where supply of the primary part is constrained.

Supply Chain Consideration:

The substitute part carries an Obsolete product status designation. While this does not affect functional equivalence or current availability (3890 pieces in stock), it indicates that TDK Corporation has discontinued this part number. Selection of this substitute should account for long-term supply planning, as inventory depletion will eventually occur without manufacturing continuation.

Compliance Verification:

Both parts satisfy ROHS3 compliance, REACH Unaffected status, and Moisture Sensitivity Level 1 requirements. No additional compliance validation is required for substitution in applications where the primary part was originally specified.

Frequently Asked Questions (FAQ)

Q: Can the C0402C0G1C8R2D substitute for the MLASE042SCG8R2DWNA01 in all applications?

A: Yes. The substitute part matches all electrical parameters (capacitance, tolerance, voltage rating, temperature coefficient, operating temperature range) and all mechanical parameters (package type, dimensions, mounting type). Functional equivalence is complete.

Q: Does the difference in packaging format (Tape & Reel versus Cut Tape) affect compatibility?

A: No. Packaging format differences represent logistics and assembly process considerations only. Both formats contain identical components. Selection between Tape & Reel and Cut Tape depends on production volume and assembly equipment capabilities, not on electrical or mechanical compatibility.

Q: Why is the substitute part listed as Obsolete?

A: Obsolete status indicates that TDK Corporation has discontinued manufacturing of the C0402C0G1C8R2D. Current inventory remains available (3890 pieces), but future supply cannot be guaranteed. For applications requiring long-term component availability, the active-status primary part (MLASE042SCG8R2DWNA01) is preferred.

Q: Are there any temperature or voltage derating considerations when using the substitute?

A: No. Both parts operate across the identical temperature range (-55°C to 125°C) and carry the same 16V voltage rating. No derating adjustments are necessary.

Q: Do both parts meet the same regulatory and compliance standards?

A: Yes. Both the MLASE042SCG8R2DWNA01 and C0402C0G1C8R2D are ROHS3 compliant, REACH Unaffected, and carry Moisture Sensitivity Level 1 (Unlimited). Compliance requirements are satisfied by either part.

Q: What is the significance of the C0G/NP0 temperature coefficient designation?

A: C0G and NP0 designations are equivalent specifications indicating minimal capacitance change across the operating temperature range. This characteristic is essential for applications requiring stable capacitance performance in medical and non-critical circuits. Both the primary and substitute parts provide this stability.

Q: Can the 01005 (0402 Metric) package be used interchangeably with other small-form-factor packages?

A: No. The 01005 package is a specific physical form factor with defined dimensions (0.40mm x 0.20mm x 0.22mm maximum thickness). PCB layouts and assembly equipment are designed for this specific package. Substitution with different package types requires PCB redesign and equipment reconfiguration.