MJD31C1 Equivalent & Substitute Parts

Part Overview

The MJD31C1 is an NPN bipolar junction transistor manufactured by onsemi, rated for 100V collector-emitter breakdown voltage and 3A maximum collector current. The device is packaged in TO-251-3 (IPAK) through-hole configuration and is designed for general-purpose switching and amplification applications requiring moderate power dissipation up to 1.56W.

The MJD31C1 is classified as obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications currently utilizing this component.

Substiute Parts

MJD31C1
onsemiIn Stock: 1063MJD31C1 Datasheet
MJD31C1
Current Part
PHPT61003NYX
Nexperia USA Inc.In Stock: 4678PHPT61003NYX Datasheet
PHPT61003NYX
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Key Parameters

Parameter Value Unit
Transistor Type NPN
Current - Collector (Ic) Max 3 A
Voltage - Collector Emitter Breakdown (Max) 100 V
Power - Max 1.56 W
Frequency - Transition 3 MHz
Operating Temperature Range -65 to 150 °C
Mounting Type Through Hole
Package / Case TO-251-3 (IPAK)

Substitute Part Grouping Explanation

Substitution of the MJD31C1 is determined by electrical parameter equivalence and functional compatibility. The critical parameters that define substitutability are:

Electrical Equivalence Criteria:

  • Transistor type: NPN configuration
  • Maximum collector current: 3A or greater
  • Collector-emitter breakdown voltage: 100V or greater
  • Maximum power dissipation: 1.56W or greater

Functional Compatibility:

  • DC current gain (hFE) sufficient for intended switching or amplification function
  • Collector-emitter saturation voltage within acceptable operating margins
  • Transition frequency adequate for application bandwidth requirements

Physical and Compliance Considerations:

  • Mounting type compatibility (through-hole or surface-mount with appropriate adapter consideration)
  • Operating temperature range coverage
  • RoHS and REACH compliance status for regulatory requirements

The PHPT61003NYX meets the electrical equivalence criteria while offering enhanced performance characteristics and active product status. Substitution is valid where mounting type conversion is feasible within the application design.

Parameter Comparison

Parameter MJD31C1 (Main Part) PHPT61003NYX (Substitute) Unit
Manufacturer onsemi Nexperia USA Inc.
Transistor Type NPN NPN
Current - Collector (Ic) Max 3 3 A
Voltage - Collector Emitter Breakdown (Max) 100 100 V
Power - Max 1.56 1.25 W
Frequency - Transition 3 140 MHz
Operating Temperature (Max) 150 175 °C
Mounting Type Through Hole Surface Mount
Package / Case TO-251-3 (IPAK) SC-100 (LFPAK56, Power-SO8)
Product Status Obsolete Active
RoHS Status Non-compliant ROHS3 Compliant

Engineering Selection Recommendations

For Direct Electrical Substitution:

The PHPT61003NYX satisfies the core electrical requirements of the MJD31C1. Both devices share identical maximum collector current (3A) and collector-emitter breakdown voltage (100V) ratings. The substitute part exceeds the transition frequency specification (140MHz vs. 3MHz) and supports higher maximum operating temperature (175°C vs. 150°C), providing performance margin for demanding applications.

Product Status Consideration:

The MJD31C1 is classified as obsolete, while the PHPT61003NYX maintains active product status with automotive-grade qualification (AEC-Q100) and ROHS3 compliance. Selection of the active substitute part ensures long-term supply chain viability and regulatory alignment with current manufacturing standards.

Mounting Type Transition:

The primary design consideration is the transition from through-hole (TO-251-3 IPAK) to surface-mount (LFPAK56 Power-SO8) packaging. This substitution requires PCB layout modification and assembly process adaptation. Applications with existing through-hole designs must evaluate the feasibility of board redesign or implement adapter solutions.

Power Dissipation Margin:

The PHPT61003NYX maximum power rating (1.25W) is lower than the MJD31C1 (1.56W). Applications operating near the upper thermal limits of the original design require thermal analysis to confirm adequate margin with the substitute part.

Frequently Asked Questions (FAQ)

Q: Can the PHPT61003NYX directly replace the MJD31C1 in existing PCB designs?

A: Direct PCB replacement is not feasible without layout modification. The MJD31C1 uses through-hole TO-251-3 (IPAK) packaging, while the PHPT61003NYX uses surface-mount LFPAK56 (Power-SO8) packaging. PCB redesign or adapter implementation is required.

Q: Are the electrical characteristics of both parts equivalent?

A: The parts share equivalent maximum ratings for collector current (3A) and collector-emitter breakdown voltage (100V). The PHPT61003NYX provides superior transition frequency (140MHz vs. 3MHz) and higher maximum operating temperature (175°C vs. 150°C). The substitute part has lower maximum power dissipation (1.25W vs. 1.56W), requiring thermal verification in high-power applications.

Q: What is the significance of the AEC-Q100 qualification on the PHPT61003NYX?

A: AEC-Q100 qualification indicates the PHPT61003NYX meets automotive industry reliability and quality standards. This certification is relevant for applications requiring automotive-grade components or equivalent reliability assurance.

Q: Does the PHPT61003NYX meet current regulatory compliance requirements?

A: Yes. The PHPT61003NYX is ROHS3 compliant and REACH unaffected, meeting current regulatory requirements. The MJD31C1 is RoHS non-compliant, which may restrict its use in new designs subject to RoHS regulations.

Q: What thermal considerations apply when substituting the PHPT61003NYX for the MJD31C1?

A: The PHPT61003NYX supports higher maximum junction temperature (175°C vs. 150°C) but has lower maximum power dissipation (1.25W vs. 1.56W). Applications operating at high power levels require thermal analysis to confirm the substitute part remains within safe operating limits.

Q: Is the PHPT61003NYX available in tape and reel packaging?

A: Yes. The PHPT61003NYX is supplied in Tape & Reel (TR) packaging, suitable for automated assembly processes. The MJD31C1 through-hole packaging is typically supplied in bulk or tube configurations.

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