MJD3055 Equivalent & Substitute Parts

Part Overview

The MJD3055 is an NPN bipolar junction transistor manufactured by onsemi, rated for 60 V collector-emitter breakdown voltage and 10 A maximum collector current in a surface mount DPAK package. This device is classified as obsolete, which necessitates identification of equivalent and substitute components for ongoing design requirements and production continuity.

The MJD3055 serves applications requiring moderate-power NPN switching and amplification in compact surface mount form factors. Due to its obsolete status, equivalent parts with active product status are required for new designs and ongoing procurement.

Key Parameters

Parameter	Value	Unit
Transistor Type	NPN	—
Voltage - Collector Emitter Breakdown (Max)	60	V
Current - Collector (Ic) (Max)	10	A
Power - Max	1.75	W
Frequency - Transition	2	MHz
Vce Saturation (Max) @ Ib, Ic	8V @ 3.3A, 10A	—
DC Current Gain (hFE) (Min) @ Ic, Vce	20 @ 4A, 4V	—
Operating Temperature Range	-55 to 150	°C
Mounting Type	Surface Mount	—
Package / Case	TO-252-3, DPAK	—

Substitute Part Grouping Explanation

Substitution of the MJD3055 is determined by strict equivalence across the following critical parameters:

Mandatory Equivalence Criteria:

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 60 V
Current - Collector (Ic) (Max): 10 A
Vce Saturation characteristics: 8V @ 3.3A, 10A
DC Current Gain (hFE) (Min): 20 @ 4A, 4V
Frequency - Transition: 2 MHz
Operating Temperature Range: -55°C to 150°C minimum
Mounting Type: Surface Mount

Package Considerations: Substitute parts are grouped into two categories based on package compatibility:

DPAK Package Equivalents (TO-252-3, DPAK): Direct mechanical and electrical replacements maintaining identical pinout and thermal characteristics.
Alternative Package Equivalents (LFPAK56, Power-SO8): Functionally equivalent devices with different package geometries, requiring PCB layout modifications.

Parameter Comparison

Parameter	MJD3055	MJD3055T4G	NJVMJD3055T4G	MJD3055T4 (STM)	PHPT60610NYX
Manufacturer	onsemi	onsemi	onsemi	STMicroelectronics	Nexperia USA Inc.
Product Status	Obsolete	Active	Active	Active	Active
Transistor Type	NPN	NPN	NPN	NPN	NPN
Voltage - Collector Emitter Breakdown (Max)	60 V	60 V	60 V	60 V	60 V
Current - Collector (Ic) (Max)	10 A	10 A	10 A	10 A	10 A
Vce Saturation (Max) @ Ib, Ic	8V @ 3.3A, 10A	8V @ 3.3A, 10A	8V @ 3.3A, 10A	8V @ 3.3A, 10A	360mV @ 1A, 10A
Current - Collector Cutoff (Max)	50µA	50µA	50µA	50µA	100nA
DC Current Gain (hFE) (Min) @ Ic, Vce	20 @ 4A, 4V	20 @ 4A, 4V	20 @ 4A, 4V	20 @ 4A, 4V	240 @ 500mA, 2V
Power - Max	1.75 W	1.75 W	1.75 W	20 W	1.5 W
Frequency - Transition	2 MHz	2 MHz	2 MHz	2 MHz	140 MHz
Operating Temperature (TJ)	-55 to 150°C	-55 to 150°C	-55 to 150°C	150°C	175°C
Package / Case	TO-252-3, DPAK	TO-252-3, DPAK	TO-252-3, DPAK	TO-252-3, DPAK	SC-100, SOT-669
RoHS Status	Non-compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Packaging Type	—	Cut Tape (CT) & Digi-Reel®	Tape & Reel (TR)	Cut Tape (CT) & Digi-Reel®	Tape & Reel (TR)

Engineering Selection Recommendations

Primary Substitutes (DPAK Package - Direct Replacement):

MJD3055T4G (onsemi) and NJVMJD3055T4G (onsemi) are direct electrical and mechanical equivalents to the MJD3055. Both devices maintain identical electrical specifications across all critical parameters and are housed in the same TO-252-3 DPAK package. Both substitute parts carry active product status and ROHS3 compliance, eliminating obsolescence risk and meeting modern regulatory requirements. These parts require no PCB layout modifications and provide pin-for-pin compatibility.

MJD3055T4 (STMicroelectronics) is electrically equivalent with identical voltage, current, and saturation characteristics. This device offers enhanced power dissipation capability (20 W versus 1.75 W), providing thermal margin for applications with higher power requirements. The STMicroelectronics variant maintains DPAK packaging and active product status. The extended maximum power rating does not compromise compatibility in applications designed for the original 1.75 W specification.

Secondary Substitute (Alternative Package - LFPAK56):

PHPT60610NYX (Nexperia USA Inc.) meets the core electrical requirements of 60 V breakdown voltage and 10 A collector current. This device is housed in an LFPAK56 (Power-SO8) package, requiring PCB layout redesign. The PHPT60610NYX exhibits superior electrical characteristics including lower saturation voltage (360 mV versus 8 V), higher DC current gain (240 versus 20), and significantly higher transition frequency (140 MHz versus 2 MHz). This device carries automotive qualification (AEC-Q100) and operates to 175°C junction temperature. Selection of this alternative requires verification of PCB footprint compatibility and thermal management adequacy.

Compliance and Availability:

All active substitute parts carry ROHS3 compliance and REACH unaffected status. The onsemi variants (MJD3055T4G and NJVMJD3055T4G) provide the most direct replacement path with no design modifications required. Inventory availability is confirmed for all substitute parts.

Frequently Asked Questions (FAQ)

Q: Can MJD3055T4G be used as a direct replacement for MJD3055?

A: Yes. MJD3055T4G is electrically and mechanically equivalent to MJD3055. Both devices share identical voltage ratings (60 V), current ratings (10 A), saturation characteristics, DC current gain, and operating temperature range. Both are packaged in TO-252-3 DPAK with identical pinout. No circuit modifications or PCB layout changes are required.

Q: What is the difference between MJD3055T4G and NJVMJD3055T4G?

A: Both parts are manufactured by onsemi and are electrically identical. The primary difference is packaging format: MJD3055T4G is supplied in Cut Tape (CT) and Digi-Reel format, while NJVMJD3055T4G is supplied in Tape & Reel (TR) format. Selection depends on procurement and assembly requirements. Electrical performance and package geometry are identical.

Q: Why does MJD3055T4 (STMicroelectronics) have a 20 W power rating instead of 1.75 W?

A: The STMicroelectronics variant is manufactured with enhanced thermal characteristics that permit higher power dissipation. The 20 W rating reflects the device's thermal capability, not a change in electrical specifications. Applications designed for 1.75 W operation remain fully compatible. The higher power rating provides additional thermal margin for demanding applications.

Q: Can PHPT60610NYX replace MJD3055 in all applications?

A: PHPT60610NYX meets the core voltage and current specifications (60 V, 10 A) but differs in package geometry (LFPAK56 versus DPAK) and several electrical characteristics. The Nexperia device exhibits lower saturation voltage, higher current gain, and significantly higher transition frequency. PCB layout modification is required due to different package footprint. Electrical performance differences may require circuit analysis for specific applications.

Q: What is the impact of RoHS compliance on part selection?

A: The original MJD3055 is RoHS non-compliant. All active substitute parts (MJD3055T4G, NJVMJD3055T4G, MJD3055T4, and PHPT60610NYX) are ROHS3 compliant. For applications subject to RoHS regulations or customer requirements, selection of compliant substitutes is mandatory. Compliance status does not affect electrical performance or circuit compatibility.

Q: Are there differences in operating temperature range between substitute parts?

A: The onsemi variants (MJD3055T4G and NJVMJD3055T4G) maintain the original -55°C to 150°C operating range. The STMicroelectronics MJD3055T4 specifies 150°C maximum junction temperature without explicit minimum. The Nexperia PHPT60610NYX operates to 175°C junction temperature, providing extended thermal capability. For applications requiring the full -55°C to 150°C range, onsemi variants are preferred.

Q: What packaging considerations apply to each substitute?

A: MJD3055T4G, NJVMJD3055T4G, and MJD3055T4 (STM) all use TO-252-3 DPAK packaging with identical footprints and pinouts, requiring no PCB modifications. PHPT60610NYX uses LFPAK56 (Power-SO8) packaging with a different footprint, requiring PCB redesign. Packaging selection depends on available PCB space and assembly capabilities.

Request Quote (Ships tomorrow)

Part Number

Quantity

Company

Contact Name

E-mail

Message