MIC59P50YN Equivalent & Substitute Parts

Part Overview

The MIC59P50YN is a Power Switch/Driver IC manufactured by Microchip Technology, designed for 1:1 bipolar switching applications with 500mA output capability. This component operates across a 5V to 12V load voltage range and includes integrated fault protection features including current limiting, over-temperature protection, and UVLO (Under-Voltage Lock-Out). The MIC59P50YN is classified as obsolete, making equivalent substitute parts necessary for new designs and ongoing production requirements. Substitute parts maintain identical electrical and functional specifications while offering active product status and improved availability.

Key Parameters

Parameter	Value
Manufacturer	Microchip Technology
Category	Power Management (PMIC)
Switch Type	Latched Driver
Number of Outputs	8
Ratio - Input:Output	1:1
Output Configuration	Low Side
Output Type	Bipolar
Interface	Strobe, Parallel
Voltage - Load	5V ~ 12V
Current - Output (Max)	500mA
Features	Status Flag
Fault Protection	Current Limiting (Fixed), Over Temperature, UVLO
Operating Temperature	-40°C ~ 85°C (TA)
RoHS Status	ROHS3 Compliant
Base Product Number	MIC59P50

Substitute Part Grouping Explanation

All substitute parts share the MIC59P50 base product number and maintain identical electrical specifications: 1:1 bipolar switching ratio, 8 outputs in low-side configuration, 500mA maximum output current, 5V to 12V load voltage range, and comprehensive fault protection (current limiting, over-temperature, UVLO). Substitution is determined by package type and mounting technology rather than electrical function. The MIC59P50YN (24-DIP through-hole) can be replaced by surface-mount variants in 28-PLCC or 24-SOIC packages. All substitute parts are manufactured by Microchip Technology and maintain ROHS3 compliance and EAR99 export classification.

Parameter Comparison

Part Number	Manufacturer	Package Type	Mounting Type	Product Status	Switch Type	Outputs	Ratio	Output Config	Output Type	Voltage - Load	Current - Output (Max)	Fault Protection	Operating Temp	RoHS Status
MIC59P50YN	Microchip Technology	24-DIP (0.400", 10.16mm)	Through Hole	Obsolete	Latched Driver	8	1:1	Low Side	Bipolar	5V ~ 12V	500mA	Current Limiting (Fixed), Over Temperature, UVLO	-40°C ~ 85°C	ROHS3 Compliant
MIC59P50YV	Microchip Technology	28-LCC (J-Lead)	Surface Mount	Active	Latched Driver	8	1:1	Low Side	Bipolar	5V ~ 12V	500mA	Current Limiting (Fixed), Over Temperature, UVLO	-40°C ~ 85°C	ROHS3 Compliant
MIC59P50YV-TR	Microchip Technology	28-LCC (J-Lead)	Surface Mount	Active	Latched Driver	8	1:1	Low Side	Bipolar	5V ~ 12V	500mA	Current Limiting (Fixed), Over Temperature, UVLO	-40°C ~ 85°C	ROHS3 Compliant
MIC59P50YWM	Microchip Technology	24-SOIC (0.295", 7.50mm Width)	Surface Mount	Active	Latched Driver	8	1:1	Low Side	Bipolar	5V ~ 12V	500mA	Current Limiting (Fixed), Over Temperature, UVLO	-40°C ~ 85°C	ROHS3 Compliant
MIC59P50YWM-TR	Microchip Technology	24-SOIC (0.295", 7.50mm Width)	Surface Mount	Active	Latched Driver	8	1:1	Low Side	Bipolar	5V ~ 12V	500mA	Current Limiting (Fixed), Over Temperature, UVLO	-40°C ~ 85°C	ROHS3 Compliant

Engineering Selection Recommendations

The MIC59P50YN is obsolete and should be replaced with active alternatives from the MIC59P50 family. Selection between substitute parts depends on PCB assembly technology and form factor requirements:

For surface-mount assembly with PLCC package compatibility, MIC59P50YV or MIC59P50YV-TR provide 28-LCC packaging. The -TR suffix indicates Tape & Reel packaging for automated assembly lines, while standard MIC59P50YV is supplied in tube packaging for manual or lower-volume assembly.

For surface-mount assembly with SOIC package compatibility, MIC59P50YWM or MIC59P50YWM-TR provide 24-SOIC packaging. The -TR variant is packaged in Tape & Reel format for high-volume production, while MIC59P50YWM is supplied in tube packaging.

All substitute parts maintain ROHS3 compliance and identical electrical specifications. Selection should be based on existing PCB layout, assembly equipment capabilities, and production volume requirements.

Frequently Asked Questions (FAQ)

Q: Can MIC59P50YN be directly replaced with MIC59P50YV or MIC59P50YWM?

A: Direct pin-for-pin replacement is not possible due to package differences. MIC59P50YN uses 24-DIP through-hole packaging, while MIC59P50YV uses 28-PLCC and MIC59P50YWM uses 24-SOIC surface-mount packages. PCB redesign is required for package conversion. However, all parts share identical electrical specifications and functional behavior.

Q: What is the difference between MIC59P50YV and MIC59P50YV-TR?

A: Both parts are electrically identical with 28-PLCC packaging. The difference is packaging format: MIC59P50YV is supplied in tube packaging for manual assembly, while MIC59P50YV-TR is supplied in Tape & Reel format optimized for automated pick-and-place assembly equipment.

Q: What is the difference between MIC59P50YWM and MIC59P50YWM-TR?

A: Both parts are electrically identical with 24-SOIC packaging. MIC59P50YWM is supplied in tube packaging, while MIC59P50YWM-TR is supplied in Tape & Reel format for automated assembly.

Q: Are all substitute parts ROHS3 compliant?

A: Yes, all substitute parts including MIC59P50YV, MIC59P50YV-TR, MIC59P50YWM, and MIC59P50YWM-TR are ROHS3 compliant.

Q: Which substitute part should I select for new designs?

A: For new designs, select based on your assembly process: MIC59P50YWM-TR for high-volume surface-mount production with automated equipment, or MIC59P50YV-TR as an alternative PLCC option. Both are active products with full availability.

Q: Do all substitute parts have the same fault protection features?

A: Yes, all substitute parts include identical fault protection: fixed current limiting, over-temperature protection, and UVLO (Under-Voltage Lock-Out).

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