MIC5801YN Equivalent & Substitute Parts

Part Overview

The MIC5801YN is a Power Management Integrated Circuit (PMIC) manufactured by Microchip Technology, classified as a Power Switch/Driver with 1:1 bipolar configuration. This component functions as a latched driver with 8 outputs, rated for 500mA maximum output current and 50V maximum load voltage. The MIC5801YN is currently listed as obsolete, necessitating identification of functionally equivalent alternatives for ongoing design requirements and production continuity. The part is packaged in a 22-DIP through-hole configuration and maintains ROHS3 compliance with unlimited moisture sensitivity rating.

Substiute Parts

MIC5801YN
Microchip TechnologyIn Stock: 7352MIC5801YN Datasheet
MIC5801YN
Current Part
MIC5801YWM
Microchip TechnologyIn Stock: 3554MIC5801YWM Datasheet
MIC5801YWM
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Microchip Technology
Category Power Management (PMIC)
Base Product Number MIC5801
Switch Type Latched Driver
Number of Outputs 8
Ratio - Input:Output 1:1
Output Configuration Low Side
Output Type Bipolar
Interface Strobe, Parallel
Voltage - Load (Max) 50V
Current - Output (Max) 500mA
Operating Temperature Range -40°C ~ 85°C (TA)
RoHS Status ROHS3 Compliant
REACH Status REACH Unaffected
ECCN EAR99

Substitute Part Grouping Explanation

Substitution of the MIC5801YN is determined by strict equivalence across the following critical parameters:

Functional Equivalence Criteria:

  • Identical base product number (MIC5801 series)
  • Matching switch type (Latched Driver)
  • Identical number of outputs (8)
  • Identical input:output ratio (1:1)
  • Matching output configuration (Low Side)
  • Matching output type (Bipolar)
  • Identical interface specification (Strobe, Parallel)
  • Equivalent voltage rating (50V maximum load voltage)
  • Equivalent current rating (500mA maximum output current)
  • Matching operating temperature range (-40°C ~ 85°C)
  • Equivalent regulatory compliance (ROHS3, REACH Unaffected, EAR99)

The primary distinction between the MIC5801YN and its substitute lies in packaging format and mounting technology. The MIC5801YN utilizes through-hole 22-DIP packaging, while the substitute employs surface-mount 24-SOIC packaging. This difference necessitates circuit board redesign and assembly process modification but does not alter electrical performance or functional capability.

Parameter Comparison

Parameter MIC5801YN (Main Part) MIC5801YWM (Substitute)
Manufacturer Microchip Technology Microchip Technology
Base Product Number MIC5801 MIC5801
Switch Type Latched Driver Latched Driver
Number of Outputs 8 8
Ratio - Input:Output 1:1 1:1
Output Configuration Low Side Low Side
Output Type Bipolar Bipolar
Interface Strobe, Parallel Strobe, Parallel
Voltage - Load (Max) 50V 50V
Current - Output (Max) 500mA 500mA
Operating Temperature Range -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Through Hole Surface Mount
Supplier Device Package 22-PDIP 24-SOIC
Package / Case 22-DIP (0.400", 10.16mm) 24-SOIC (0.295", 7.50mm Width)
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99
Moisture Sensitivity Level (MSL) 1 (Unlimited) 3 (168 Hours)

Engineering Selection Recommendations

MIC5801YWM as Primary Substitute:

The MIC5801YWM is the manufacturer-recommended substitute for the obsolete MIC5801YN. Both components share identical electrical specifications, functional architecture, and regulatory compliance certifications. The MIC5801YWM maintains active product status with Microchip Technology, ensuring continued availability and technical support.

Design Considerations:

The transition from MIC5801YN to MIC5801YWM requires modification of the printed circuit board layout to accommodate the change from through-hole 22-DIP mounting to surface-mount 24-SOIC mounting. This substitution is electrically transparent and does not require modification to firmware, software, or system-level design parameters.

Compliance Status:

Both parts maintain ROHS3 compliance and REACH Unaffected status, satisfying regulatory requirements for electronic component procurement. The EAR99 export classification remains consistent between the main part and substitute.

Moisture Sensitivity:

The MIC5801YWM carries a Moisture Sensitivity Level (MSL) rating of 3 (168 Hours), compared to the MIC5801YN rating of 1 (Unlimited). This difference requires adherence to moisture control protocols during storage, handling, and assembly operations for the substitute component.

Frequently Asked Questions (FAQ)

Q: Can the MIC5801YWM directly replace the MIC5801YN without circuit modification?

A: Electrical substitution is direct. However, circuit board layout modification is required due to the change from 22-DIP through-hole packaging to 24-SOIC surface-mount packaging. Pin assignments and electrical functionality remain equivalent.

Q: What is the significance of the different Moisture Sensitivity Level ratings?

A: The MIC5801YN carries MSL 1 (Unlimited), indicating no moisture sensitivity restrictions. The MIC5801YWM carries MSL 3 (168 Hours), requiring that the component be stored in controlled humidity conditions and used within 168 hours of package opening if exposed to ambient humidity. Proper moisture control during assembly is necessary.

Q: Are both parts compliant with current regulatory standards?

A: Both the MIC5801YN and MIC5801YWM maintain ROHS3 compliance and REACH Unaffected status. Both carry EAR99 export classification. Regulatory compliance is equivalent between the two components.

Q: Why is the MIC5801YN listed as obsolete?

A: The MIC5801YN is obsolete due to Microchip Technology's transition from through-hole DIP packaging to surface-mount SOIC packaging for this product line. The MIC5801YWM represents the current active production variant.

Q: Are the electrical specifications identical between MIC5801YN and MIC5801YWM?

A: Yes. Both components provide 8 outputs, 1:1 input:output ratio, 50V maximum load voltage, 500mA maximum output current, and -40°C to 85°C operating temperature range. Output configuration, output type, and interface specifications are identical.

Q: What packaging format does each part use?

A: The MIC5801YN uses 22-DIP (Dual Inline Package) through-hole mounting with 0.400" (10.16mm) pitch. The MIC5801YWM uses 24-SOIC (Small Outline Integrated Circuit) surface-mount packaging with 0.295" (7.50mm) width.

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