MHT1005HSR3 Equivalent & Substitute Parts

Part Overview

The MHT1005HSR3 is an RF MOSFET LDMOS device manufactured by NXP USA Inc., classified as an obsolete product. This component is designed for radio frequency applications utilizing LDMOS (Laterally Diffused Metal-Oxide-Semiconductor) technology. Due to its obsolete status, identifying functionally equivalent substitute parts is essential for design continuity, production support, and system maintenance. The availability of alternative components ensures that applications dependent on this RF MOSFET technology can continue operation without design interruption.

Substiute Parts

MHT1005HSR3

NXP USA Inc.In Stock: 831MHT1005HSR3 Datasheet

Current PartRFQ

MRF24G300HSR5

NXP USA Inc.In Stock: 988MRF24G300HSR5 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the MHT1005HSR3 is determined by alignment across the following critical parameters:

Manufacturer Consistency: Both the main part and substitute are manufactured by NXP USA Inc., ensuring design heritage and manufacturing process compatibility.

Package Designation: The NI780S package family serves as the primary substitution criterion. The substitute part MRF24G300HSR5 utilizes the NI-780S-4L package variant, maintaining mechanical and electrical interface compatibility.

Compliance Certifications: Both parts maintain ROHS3 compliance and REACH Unaffected status, ensuring regulatory alignment for current and future applications.

Moisture Sensitivity Level: Both components share MSL 1 (Unlimited) classification, indicating identical moisture handling and storage requirements.

RF MOSFET Category: Both parts function as RF MOSFET devices within the transistor category, supporting radio frequency circuit applications.

The substitute part MRF24G300HSR5 represents a technology evolution from LDMOS to GaN (Gallium Nitride) while maintaining the same package family and manufacturer ecosystem.

Parameter Comparison

Engineering Selection Recommendations

Regulatory Compliance: Both the MHT1005HSR3 and MRF24G300HSR5 maintain ROHS3 compliance and REACH Unaffected status, satisfying current environmental and regulatory requirements for electronic component procurement.

Obsolescence Management: Both parts carry obsolete product status. Selection between these components should be based on application-specific requirements and available inventory. The MRF24G300HSR5 provides documented performance specifications (frequency, power output, gain, and voltage ratings) that enable precise application matching, whereas the MHT1005HSR3 specifications are limited in the provided data.

Manufacturer Support: Both components originate from NXP USA Inc., ensuring access to consistent technical documentation, application notes, and design support resources within the NXP ecosystem.

Package Compatibility: The NI780S package family designation indicates mechanical and thermal interface compatibility. The MRF24G300HSR5 utilizes the NI-780S-4L variant, which maintains the same package footprint and mounting requirements as the original part.

Moisture and Storage: Identical MSL 1 ratings eliminate any differences in handling, storage, or reflow process requirements between the two components.

Frequently Asked Questions (FAQ)

Q: Can the MRF24G300HSR5 directly replace the MHT1005HSR3 in existing designs?

A: Direct replacement requires verification of application-specific electrical parameters. Both components share the NI780S package family and identical compliance certifications. However, the MRF24G300HSR5 operates at 2.4GHz ~ 2.5GHz with 300W output and 15.3dB gain, while the MHT1005HSR3 specifications are not fully documented. Circuit design validation is necessary to confirm compatibility with your specific frequency, power, and impedance requirements.

Q: What is the primary technical difference between these two parts?

A: The MHT1005HSR3 uses LDMOS technology, while the MRF24G300HSR5 uses GaN (Gallium Nitride) technology. GaN devices typically offer improved efficiency and thermal performance compared to LDMOS at RF frequencies. Both maintain the same package family and manufacturer origin.

Q: Are there any differences in handling or storage requirements?

A: No. Both components carry MSL 1 (Unlimited) ratings, indicating identical moisture sensitivity levels and storage requirements. Standard ESD precautions and dry storage conditions apply equally to both parts.

Q: What packaging format is available for the MRF24G300HSR5?

A: The MRF24G300HSR5 is supplied in Cut Tape (CT) packaging with the NI-780S-4L surface mount package designation.

Q: Are both parts currently available for procurement?

A: Both parts carry obsolete product status. Current inventory availability is 803 pieces for the MHT1005HSR3 and 922 pieces for the MRF24G300HSR5. Availability through authorized distributors should be verified for your procurement timeline.

Q: Do both parts meet current environmental regulations?

A: Yes. Both the MHT1005HSR3 and MRF24G300HSR5 are ROHS3 compliant and REACH Unaffected, satisfying current environmental and regulatory requirements for electronic component use in regulated markets.