MD2310FX Equivalent & Substitute Parts

Part Overview

The MD2310FX is an NPN bipolar junction transistor manufactured by STMicroelectronics, rated for 700 V collector-emitter breakdown voltage and 14 A maximum collector current in a TO-3PF through-hole package. This device is classified as obsolete, necessitating identification of equivalent substitute components for ongoing design requirements and production continuity. Substitute parts must maintain functional compatibility across critical electrical parameters while accommodating available packaging options.

Substiute Parts

MD2310FX

STMicroelectronicsIn Stock: 1839MD2310FX Datasheet

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FJL6920TU

onsemiIn Stock: 30275FJL6920TU Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the MD2310FX are identified based on the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

• Transistor type must be NPN
• Voltage - Collector Emitter Breakdown (Max) must equal or exceed 700 V
• Current - Collector (Ic) (Max) must equal or exceed 14 A
• Power dissipation rating must equal or exceed 62 W
• Operating temperature range must support 150°C (TJ)

Mechanical Compatibility Criteria:

• Mounting type must be Through Hole
• Package must accommodate TO-3P or equivalent high-power through-hole form factors

Compliance Criteria:

• RoHS3 compliance required
• REACH Unaffected status required

The FJL6920TU from onsemi satisfies all substitution criteria with enhanced electrical ratings across voltage, current, and power parameters, while maintaining through-hole mounting and required compliance certifications.

Parameter Comparison

Engineering Selection Recommendations

The FJL6920TU is an active product with current manufacturing status and established supply chain availability, addressing the obsolescence of the MD2310FX. Both components maintain ROHS3 compliance and REACH Unaffected status, satisfying regulatory requirements for new designs and production continuity.

The FJL6920TU provides electrical performance that exceeds MD2310FX specifications across all critical parameters: 800 V breakdown voltage versus 700 V, 20 A maximum collector current versus 14 A, and 200 W power rating versus 62 W. These enhanced ratings ensure the substitute component operates within safe margins in applications originally designed for the MD2310FX.

Package differences exist between the TO-3P-3 (MD2310FX) and TO-264-3 (FJL6920TU) form factors. Both are through-hole packages suitable for high-power applications; however, PCB layout modifications may be required to accommodate the different pin configurations and thermal characteristics of the TO-264-3 package.

Frequently Asked Questions (FAQ)

Q: Can the FJL6920TU directly replace the MD2310FX without circuit modifications?

A: The FJL6920TU satisfies all electrical substitution criteria for the MD2310FX. However, package differences between TO-3P-3 and TO-264-3 require PCB layout verification. Pin assignments and thermal mounting interfaces differ between these packages, necessitating mechanical design review before implementation.

Q: What are the key electrical advantages of the FJL6920TU over the MD2310FX?

A: The FJL6920TU provides higher voltage rating (800 V versus 700 V), higher current capacity (20 A versus 14 A), and significantly higher power dissipation capability (200 W versus 62 W). These enhanced ratings provide additional design margin in high-voltage, high-current switching applications.

Q: Are both components compliant with current regulatory standards?

A: Both the MD2310FX and FJL6920TU are ROHS3 compliant and REACH Unaffected. The FJL6920TU, as an active product, maintains current compliance certifications and supply chain support.

Q: What is the significance of the different Vce saturation specifications?

A: The MD2310FX specifies 2.5 V saturation at 1.75 A base current and 7 A collector current, while the FJL6920TU specifies 3 V saturation at 2.75 A base current and 11 A collector current. These measurements reflect different test conditions and device geometry. Both values are within acceptable ranges for high-voltage switching applications.

Q: How does the TO-264-3 package compare thermally to the TO-3P-3 package?

A: Both packages are designed for high-power through-hole applications with thermal management capabilities. The TO-264-3 package used by the FJL6920TU provides enhanced thermal performance relative to its higher power rating. Specific thermal resistance values are not provided in the available parameters; thermal design verification is required for applications with stringent thermal constraints.

Q: Is the FJL6920TU available in the same packaging format as the MD2310FX?

A: No. The MD2310FX uses TO-3P-3 packaging, while the FJL6920TU uses TO-264-3 packaging. Both are through-hole packages for high-power applications, but they have different physical dimensions and pin configurations. PCB redesign is necessary for package conversion.