MCP665-E/UN Equivalent & Substitute Parts

Part Overview

The MCP665-E/UN is a general purpose operational amplifier manufactured by Microchip Technology, featuring dual circuits in a 10-MSOP surface mount package. This device delivers rail-to-rail output capability with a 60 MHz gain bandwidth product and operates across a 2.5V to 5.5V supply range. The part is currently in active production status with 2294 units available in inventory.

Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required due to component availability, supply chain considerations, or design flexibility within the allowed parameter specifications.

Substiute Parts

MCP665-E/UN
Microchip TechnologyIn Stock: 2306MCP665-E/UN Datasheet
MCP665-E/UN
Current Part
OPA2357AIDGSR
Texas InstrumentsIn Stock: 1611OPA2357AIDGSR Datasheet
OPA2357AIDGSR
MFR Recommended
OPA2357AIDGST
Texas InstrumentsIn Stock: 3411OPA2357AIDGST Datasheet
OPA2357AIDGST
MFR Recommended

Key Parameters

Parameter Value Unit
Manufacturer Part Number MCP665-E/UN
Manufacturer Microchip Technology
Category Linear, Amplifiers
Amplifier Type General Purpose
Number of Circuits 2
Output Type Rail-to-Rail
Slew Rate 32 V/µs
Gain Bandwidth Product 60 MHz
Current - Input Bias 6 pA
Voltage - Input Offset 1.8 mV
Current - Supply (x2 Channels) 6 mA
Current - Output / Channel 90 mA
Voltage - Supply Span (Min) 2.5 V
Voltage - Supply Span (Max) 5.5 V
Operating Temperature -40 to 125 °C
Mounting Type Surface Mount
Package / Case 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Product Status Active

Substitute Part Grouping Explanation

Substitute parts for the MCP665-E/UN are qualified based on the following criteria:

Electrical Compatibility Parameters:

  • Dual circuit configuration (2 circuits required)
  • Rail-to-rail output capability
  • Supply voltage range: 2.5V to 5.5V minimum and maximum
  • Operating temperature range: -40°C to 125°C
  • Surface mount technology

Mechanical Compatibility Parameters:

  • 10-pin package footprint compatibility (10-TFSOP, 10-MSOP, or 10-VSSOP)
  • 0.118" (3.00mm) width specification

Compliance Parameters:

  • ROHS3 compliance
  • Active product status
  • REACH unaffected status

The substitute parts OPA2357AIDGSR and OPA2357AIDGST from Texas Instruments satisfy all mandatory electrical and mechanical compatibility requirements while maintaining regulatory compliance.

Parameter Comparison

Parameter MCP665-E/UN OPA2357AIDGSR OPA2357AIDGST Unit
Manufacturer Microchip Technology Texas Instruments Texas Instruments
Amplifier Type General Purpose CMOS CMOS
Number of Circuits 2 2 2
Output Type Rail-to-Rail Rail-to-Rail Rail-to-Rail
Slew Rate 32 150 150 V/µs
Gain Bandwidth Product 60 100 100 MHz
Current - Input Bias 6 3 3 pA
Voltage - Input Offset 1.8 2 2 mV
Current - Supply (x2 Channels) 6 4.9 4.9 mA
Current - Output / Channel 90 100 100 mA
Voltage - Supply Span (Min) 2.5 2.5 2.5 V
Voltage - Supply Span (Max) 5.5 5.5 5.5 V
Operating Temperature -40 to 125 -40 to 125 -40 to 125 °C
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 10-MSOP 10-VSSOP 10-VSSOP
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Product Status Active Active Active

Engineering Selection Recommendations

MCP665-E/UN (Primary Part)

The MCP665-E/UN remains the primary selection when Microchip Technology sourcing is specified or preferred. This device is in active production with 2294 units currently in stock. The part meets all ROHS3 compliance requirements and carries unlimited moisture sensitivity rating (MSL 1), indicating robust handling characteristics for manufacturing environments.

OPA2357AIDGSR (Substitute - Cut Tape & Digi-Reel Packaging)

The OPA2357AIDGSR from Texas Instruments is qualified as a substitute when supply flexibility or alternative sourcing is required. This variant is supplied in Cut Tape and Digi-Reel packaging with 1508 units in inventory. The device maintains identical electrical operating parameters within the specified supply voltage and temperature ranges. The 10-VSSOP package provides mechanical compatibility with the MCP665-E/UN footprint. Moisture sensitivity level is rated at MSL 2 (1 Year), requiring standard moisture control during storage and assembly.

OPA2357AIDGST (Substitute - Tape & Reel Packaging)

The OPA2357AIDGST from Texas Instruments is qualified as a substitute for high-volume production environments utilizing Tape & Reel packaging. This variant has 3318 units in inventory. Electrical specifications and operating parameters are identical to the OPA2357AIDGSR. The 10-VSSOP package maintains mechanical compatibility. Moisture sensitivity level is MSL 2 (1 Year).

Substitution Basis

Both OPA2357 variants satisfy the mandatory compatibility criteria: dual-circuit configuration, rail-to-rail output, 2.5V to 5.5V supply range, -40°C to 125°C operating temperature, surface mount technology, 10-pin package compatibility, ROHS3 compliance, and active product status. The substitute parts deliver enhanced performance in slew rate (150V/µs vs. 32V/µs) and gain bandwidth product (100 MHz vs. 60 MHz), with lower input bias current (3 pA vs. 6 pA) and reduced supply current (4.9 mA vs. 6 mA per dual channels).

Frequently Asked Questions (FAQ)

Q: Can OPA2357AIDGSR and OPA2357AIDGST be used interchangeably with MCP665-E/UN?

A: Both OPA2357 variants are electrically and mechanically compatible substitutes. The primary difference is packaging format: OPA2357AIDGSR uses Cut Tape & Digi-Reel, while OPA2357AIDGST uses Tape & Reel. Selection depends on production volume and assembly line requirements. Both maintain identical electrical performance within the specified operating parameters.

Q: What is the difference between OPA2357AIDGSR and OPA2357AIDGST?

A: The two parts are electrically identical. The distinction is packaging only. OPA2357AIDGSR is supplied in Cut Tape and Digi-Reel format suitable for lower-volume or mixed-component assembly. OPA2357AIDGST is supplied in Tape & Reel format optimized for high-volume automated assembly lines.

Q: Are there package footprint differences between MCP665-E/UN and OPA2357 variants?

A: The MCP665-E/UN uses 10-MSOP packaging, while OPA2357 variants use 10-VSSOP packaging. Both packages share the same 0.118" (3.00mm) width specification and 10-pin configuration, providing mechanical compatibility for PCB footprints designed for either package type.

Q: What are the moisture sensitivity implications for each part?

A: MCP665-E/UN carries MSL 1 (Unlimited), indicating no moisture sensitivity restrictions during storage or handling. OPA2357AIDGSR and OPA2357AIDGST both carry MSL 2 (1 Year), requiring standard moisture control measures. Parts must be stored in dry conditions and used within one year of packaging opening.

Q: Do all three parts meet the same regulatory compliance standards?

A: Yes. MCP665-E/UN, OPA2357AIDGSR, and OPA2357AIDGST are all ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99. All three parts are in active production status.

Q: What performance differences exist between MCP665-E/UN and OPA2357 substitutes?

A: The OPA2357 variants deliver higher slew rate (150V/µs vs. 32V/µs) and greater gain bandwidth product (100 MHz vs. 60 MHz). Input bias current is lower (3 pA vs. 6 pA), and supply current per dual channels is reduced (4.9 mA vs. 6 mA). These enhancements represent improved performance characteristics while maintaining full compatibility with the MCP665-E/UN electrical and mechanical specifications.

Q: Can the MCP665-E/UN be replaced mid-production with an OPA2357 variant?

A: Substitution is permissible based on electrical and mechanical compatibility. However, design validation should confirm that the enhanced performance characteristics of the OPA2357 (higher slew rate, greater bandwidth, lower bias current) do not introduce unintended circuit behavior. No design changes are required for basic pin-compatible replacement.

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