MCP1405T-E/MF Equivalent & Substitute Parts

Part Overview

The MCP1405T-E/MF is a low-side gate driver IC manufactured by Microchip Technology, designed for driving IGBT and MOSFET gates in power management applications. This device operates with dual independent channels supporting both inverting and non-inverting configurations. The part is currently in active production status with 772 units in stock. Alternative packaging options exist to accommodate different procurement and assembly requirements while maintaining identical electrical and functional specifications.

Substiute Parts

MCP1405T-E/MF
Microchip TechnologyIn Stock: 789MCP1405T-E/MF Datasheet
MCP1405T-E/MF
Current Part
MCP1405-E/MF
Microchip TechnologyIn Stock: 2755MCP1405-E/MF Datasheet
MCP1405-E/MF
Direct

Key Parameters

Parameter Value
Manufacturer Microchip Technology
Base Product Number MCP1405
Package Type 8-VDFN Exposed Pad
Supplier Device Package 8-DFN-S (6x5)
Supply Voltage Range 4.5V ~ 18V
Peak Output Current (Source/Sink) 4.5A / 4.5A
Number of Drivers 2 (Independent)
Gate Type Support IGBT, N-Channel MOSFET, P-Channel MOSFET
Input Type Inverting, Non-Inverting
Rise/Fall Time (Typical) 15ns / 18ns
Operating Temperature Range -40°C ~ 150°C (TJ)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the MCP1405T-E/MF is determined by strict equivalence across the following critical parameters:

  • Base product number (MCP1405)
  • Electrical specifications (supply voltage, output current, rise/fall time)
  • Functional configuration (dual independent channels, inverting/non-inverting inputs)
  • Gate type support (IGBT and MOSFET compatibility)
  • Package type (8-VDFN Exposed Pad with 8-DFN-S 6x5 footprint)
  • Compliance certifications (RoHS3, REACH status)

The primary variable between equivalent parts is the packaging format (Tape & Reel versus Tube), which affects procurement and assembly logistics but does not alter electrical performance or functional capability.

Parameter Comparison

Parameter MCP1405T-E/MF (Main Part) MCP1405-E/MF (Substitute)
Manufacturer Microchip Technology Microchip Technology
Base Product Number MCP1405 MCP1405
Packaging Format Tape & Reel (TR) Tube
Package / Case 8-VDFN Exposed Pad 8-VDFN Exposed Pad
Supplier Device Package 8-DFN-S (6x5) 8-DFN-S (6x5)
Supply Voltage Range 4.5V ~ 18V 4.5V ~ 18V
Peak Output Current (Source) 4.5A 4.5A
Peak Output Current (Sink) 4.5A 4.5A
Number of Drivers 2 (Independent) 2 (Independent)
Gate Type Support IGBT, N-Channel, P-Channel MOSFET IGBT, N-Channel, P-Channel MOSFET
Input Type Inverting, Non-Inverting Inverting, Non-Inverting
Rise Time (Typical) 15ns 15ns
Fall Time (Typical) 18ns 18ns
Operating Temperature Range -40°C ~ 150°C (TJ) -40°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected
Product Status Active Active

Engineering Selection Recommendations

Both the MCP1405T-E/MF and MCP1405-E/MF are active production parts from Microchip Technology with identical electrical specifications and functional capabilities. Selection between these parts is based on packaging format requirements:

  • MCP1405T-E/MF (Tape & Reel): Suitable for high-volume automated assembly operations where reel-based component feeding is standard.
  • MCP1405-E/MF (Tube): Suitable for lower-volume production, manual assembly, or procurement scenarios where tube packaging is preferred.

Both parts maintain full compliance with RoHS3 and REACH regulations. The MSL rating of 1 (Unlimited) indicates no moisture sensitivity constraints during storage or handling. Selection of either part does not require design modification, PCB layout changes, or firmware updates.

Frequently Asked Questions (FAQ)

Q: Can MCP1405-E/MF replace MCP1405T-E/MF in production?

A: Yes. Both parts are electrically and functionally identical. The only difference is packaging format (Tube versus Tape & Reel). PCB footprint, pin configuration, and electrical performance are unchanged.

Q: Does packaging format affect component performance?

A: No. Packaging format affects only procurement logistics and assembly handling. Electrical specifications, thermal performance, and functional behavior are identical between Tape & Reel and Tube formats.

Q: Are there any compliance differences between these parts?

A: No. Both parts carry identical RoHS3 compliance, REACH status, and MSL ratings. Regulatory and environmental certifications are equivalent.

Q: What is the PCB footprint compatibility?

A: Both parts use the 8-DFN-S (6x5) footprint with 8-VDFN Exposed Pad package type. PCB designs require no modification when switching between these parts.

Q: Can these parts be used interchangeably in existing designs?

A: Yes. No design changes, schematic modifications, or layout adjustments are required. Direct substitution is supported for all applications.

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