MCF5482CZP166 Equivalent & Substitute Parts

Part Overview

The MCF5482CZP166 is a Coldfire V4E 32-bit single-core microcontroller operating at 166MHz with ROMless architecture, manufactured by NXP USA Inc. This device integrates 32K x 8 RAM, 99 I/O pins, and comprehensive connectivity options including CANbus, Ethernet, I2C, SPI, and UART/USART interfaces. The part is classified as Not For New Designs, indicating end-of-life status. Identifying equivalent and substitute parts is necessary for legacy system maintenance, production continuity, and design migration to active product lines.

Substiute Parts

MCF5482CZP166

NXP USA Inc.In Stock: 946MCF5482CZP166 Datasheet

Current PartRFQ

MCF5482CVR166

NXP USA Inc.In Stock: 1155MCF5482CVR166 Datasheet

DirectRFQ

UPD60510BF1-HN4-M1-A

Renesas Electronics CorporationIn Stock: 1332UPD60510BF1-HN4-M1-A Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution logic for the MCF5482CZP166 is based on the following criteria:

Direct Equivalent (Same Manufacturer, Same Architecture): MCF5482CVR166 maintains identical core architecture (Coldfire V4E), processing speed (166MHz), memory configuration (32K x 8 RAM), I/O count (99), voltage supply range (1.43V ~ 1.58V), operating temperature range (-40°C ~ 85°C), and package footprint (388-BBGA 27x27). The primary distinction is packaging format (Tray vs. alternative) and RoHS compliance status (ROHS3 Compliant vs. RoHS non-compliant).

Cross-Architecture Substitute (Different Manufacturer, Different Core): UPD60510BF1-HN4-M1-A represents a functional alternative from Renesas Electronics Corporation with ARM Cortex-M3 architecture. While this part operates at lower speed (100MHz vs. 166MHz) and uses different package geometry (324-BGA 19x19 vs. 388-BBGA 27x27), it provides equivalent 32-bit single-core processing, ROMless memory architecture, comparable I/O capability (96 vs. 99), and overlapping connectivity features (CANbus, Ethernet, I2C, UART/USART). This substitute is suitable only when architectural migration and PCB redesign are feasible.

Parameter Comparison

Engineering Selection Recommendations

For Direct Replacement (Pin-Compatible, No Redesign): MCF5482CVR166 is the preferred direct substitute. It maintains identical electrical specifications, core architecture, processing speed, memory configuration, I/O count, and package footprint. The upgrade path offers ROHS3 compliance, addressing regulatory requirements for new production batches while preserving existing PCB designs and firmware compatibility.

For New Design Migration: UPD60510BF1-HN4-M1-A is suitable only when design migration to an active product line is planned. This part requires PCB redesign due to different package geometry (324-BGA 19x19 vs. 388-BBGA 27x27), firmware porting from Coldfire V4E to ARM Cortex-M3 architecture, and acceptance of reduced processing speed (100MHz vs. 166MHz). The substitute offers advantages including active product status, expanded RAM capacity (512K x 8 vs. 32K x 8), wider voltage supply range (0.9V ~ 3.6V), and internal oscillator capability. This option is appropriate for applications where performance headroom exists and long-term supply security is prioritized.

Frequently Asked Questions (FAQ)

Q: Can MCF5482CVR166 be used as a direct drop-in replacement for MCF5482CZP166? A: Yes. Both parts share identical core processor (Coldfire V4E), processing speed (166MHz), memory architecture (32K x 8 RAM, ROMless), I/O configuration (99 pins), voltage supply range (1.43V ~ 1.58V), operating temperature range (-40°C ~ 85°C), and package footprint (388-BBGA 27x27). No PCB modifications or firmware changes are required.

Q: What are the key differences between MCF5482CVR166 and MCF5482CZP166? A: The primary difference is RoHS compliance status. MCF5482CVR166 is ROHS3 compliant, while MCF5482CZP166 is RoHS non-compliant. Both parts are classified as Not For New Designs. Packaging format may differ (Tray designation), but electrical and functional specifications are identical.

Q: Is UPD60510BF1-HN4-M1-A a suitable replacement without PCB redesign? A: No. UPD60510BF1-HN4-M1-A requires PCB redesign due to different package geometry (324-BGA 19x19 vs. 388-BBGA 27x27). Additionally, this part uses ARM Cortex-M3 architecture instead of Coldfire V4E, requiring firmware porting. This substitute is appropriate only for new designs or major system revisions where architectural migration is planned.

Q: What are the performance trade-offs when using UPD60510BF1-HN4-M1-A? A: Processing speed is reduced from 166MHz to 100MHz. However, RAM capacity increases from 32K x 8 to 512K x 8, and voltage supply range expands from 1.43V ~ 1.58V to 0.9V ~ 3.6V. I/O count decreases slightly from 99 to 96 pins. Connectivity features overlap (CANbus, Ethernet, I2C, UART/USART) but CSI replaces SPI in the Renesas part.

Q: Are all three parts compatible with the same PCB footprint? A: No. MCF5482CZP166 and MCF5482CVR166 share identical 388-BBGA (27x27) package footprint. UPD60510BF1-HN4-M1-A uses 324-BGA (19x19) package, requiring different PCB layout and requalification.

Q: What is the inventory status for these parts? A: MCF5482CZP166 has 894 units in stock. MCF5482CVR166 has 1099 units in stock. UPD60510BF1-HN4-M1-A has 1303 units in stock. All parts are listed as New Original.

Q: Are there any compliance or regulatory differences between these parts? A: MCF5482CZP166 is RoHS non-compliant. MCF5482CVR166 and UPD60510BF1-HN4-M1-A are both ROHS3 compliant. All three parts are REACH Unaffected and share identical ECCN (3A991A2) and HTSUS (8542.31.0001) classifications.