MCF5480CZP166 Equivalent & Substitute Parts

Part Overview

The MCF5480CZP166 is a 32-bit single-core Coldfire V4E microcontroller operating at 166MHz with ROMless architecture in a 388-PBGA package. This device is classified as Not For New Designs, indicating it has reached end-of-life status. Finding equivalent substitute parts is necessary for legacy system maintenance, production continuity, and design updates where modern alternatives are required.

Substiute Parts

MCF5480CZP166
NXP USA Inc.In Stock: 1133MCF5480CZP166 Datasheet
MCF5480CZP166
Current Part
UPD60510BF1-HN4-M1-A
Renesas Electronics CorporationIn Stock: 1332UPD60510BF1-HN4-M1-A Datasheet
UPD60510BF1-HN4-M1-A
MFR Recommended

Key Parameters

Parameter MCF5480CZP166
Core Processor Coldfire V4E
Core Size 32-Bit Single-Core
Speed 166MHz
Program Memory Type ROMless
RAM Size 32K x 8
Voltage Supply (Vcc/Vdd) 1.43V ~ 1.58V
Number of I/O 99
Connectivity CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals DMA, PWM, WDT
Operating Temperature -40°C ~ 85°C (TA)
Package 388-PBGA (27x27)
Product Status Not For New Designs
RoHS Status RoHS non-compliant

Substitute Part Grouping Explanation

Substitution of the MCF5480CZP166 is based on the following critical parameters:

  • 32-bit single-core architecture requirement
  • ROMless memory configuration
  • Operating temperature range of -40°C to 85°C
  • Surface mount packaging with BGA technology
  • Connectivity support for CANbus, Ethernet, I2C, UART/USART, and USB
  • DMA and watchdog timer (WDT) peripheral availability

The UPD60510BF1-HN4-M1-A qualifies as a substitute based on matching core architecture (32-bit single-core), ROMless design, identical operating temperature range, surface mount BGA packaging, and overlapping connectivity features (CANbus, Ethernet, I2C, UART/USART). Both devices support DMA and WDT peripherals essential for embedded applications.

Parameter Comparison

Parameter MCF5480CZP166 UPD60510BF1-HN4-M1-A
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 166MHz 100MHz
Program Memory Type ROMless ROMless
RAM Size 32K x 8 512K x 8
Voltage Supply (Vcc/Vdd) 1.43V ~ 1.58V 0.9V ~ 3.6V
Number of I/O 99 96
Connectivity CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB CANbus, CSI, Ethernet, I2C, UART/USART
Peripherals DMA, PWM, WDT DMA, WDT
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Package 388-PBGA (27x27) 324-BGA (19x19)
Product Status Not For New Designs Active
RoHS Status RoHS non-compliant ROHS3 Compliant

Engineering Selection Recommendations

The MCF5480CZP166 is classified as Not For New Designs and carries RoHS non-compliant status. The UPD60510BF1-HN4-M1-A is an active product with ROHS3 compliance, making it suitable for new designs and applications requiring regulatory compliance.

Key differences in selection criteria:

  • The substitute operates at 100MHz versus 166MHz, requiring evaluation of timing-critical application requirements
  • The substitute provides 512K RAM versus 32K, offering greater memory capacity for complex applications
  • The substitute supports a wider voltage supply range (0.9V ~ 3.6V) versus the narrow range of the original (1.43V ~ 1.58V)
  • The substitute package is smaller (324-BGA 19x19 versus 388-PBGA 27x27), affecting PCB layout and thermal management
  • The substitute lacks PWM and SPI connectivity present in the original, requiring design modification if these features are critical
  • Both devices maintain identical operating temperature range and support essential peripherals (DMA, WDT)

Frequently Asked Questions (FAQ)

Q: Can the UPD60510BF1-HN4-M1-A directly replace the MCF5480CZP166 without design changes?

A: Direct replacement requires evaluation of application-specific requirements. The substitute differs in clock speed (100MHz vs 166MHz), RAM capacity (512K vs 32K), package size (324-BGA vs 388-PBGA), and lacks PWM and SPI connectivity. PCB layout redesign is necessary due to different package dimensions.

Q: What are the voltage supply differences between these parts?

A: The MCF5480CZP166 requires 1.43V ~ 1.58V supply voltage, while the UPD60510BF1-HN4-M1-A accepts 0.9V ~ 3.6V. The substitute's wider voltage tolerance provides greater flexibility in power supply design.

Q: Are both devices suitable for industrial temperature applications?

A: Yes, both devices operate across the identical temperature range of -40°C to 85°C (TA), meeting industrial and extended temperature requirements.

Q: What connectivity features are lost in substitution?

A: The substitute lacks PWM and SPI connectivity present in the original. Applications requiring these interfaces must implement alternative solutions or select a different substitute part.

Q: How do the package sizes affect PCB design?

A: The MCF5480CZP166 uses a larger 388-PBGA (27x27mm) package, while the UPD60510BF1-HN4-M1-A uses a smaller 324-BGA (19x19mm) package. This requires complete PCB layout redesign, including trace routing, via placement, and thermal management considerations.

Q: What is the significance of RoHS compliance status?

A: The MCF5480CZP166 is RoHS non-compliant, while the UPD60510BF1-HN4-M1-A is ROHS3 compliant. For applications subject to environmental regulations or customer requirements, the substitute meets modern compliance standards.

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