MC9S08SH4MPJ Equivalent & Substitute Parts

Part Overview

The MC9S08SH4MPJ is an 8-bit microcontroller from NXP Semiconductors' S08 series, featuring 4KB of FLASH program memory, 256 bytes of RAM, and integrated peripherals including PWM, watchdog timer, and analog-to-digital conversion. The device operates at 40MHz with a supply voltage range of 2.7V to 5.5V and is rated for industrial temperature ranges from -40°C to 125°C.

This part is classified as obsolete. Locating equivalent or substitute components becomes necessary when original inventory is depleted or when transitioning to active production alternatives that maintain functional compatibility while offering improved availability and support.

Key Parameters

Parameter	Value
Core Processor	S08
Core Size	8-Bit
Speed	40MHz
Program Memory Size	4KB (4K x 8)
Program Memory Type	FLASH
RAM Size	256 x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V
Data Converters	A/D 12x10b
Number of I/O	17
Connectivity	I2C, LINbus, SCI, SPI
Peripherals	LVD, POR, PWM, WDT
Operating Temperature	-40°C ~ 125°C (TA)

Substitute Part Grouping Explanation

Substitution of the MC9S08SH4MPJ is determined by strict equivalence across the following critical parameters:

Core Architecture: S08 processor family
Memory Configuration: 4KB FLASH program memory and 256 x 8 RAM
Electrical Specifications: 40MHz operation, 2.7V to 5.5V supply voltage range
Peripheral Set: Identical I/O count (17), connectivity options (I2C, LINbus, SCI, SPI), and integrated functions (LVD, POR, PWM, WDT)
Data Conversion: 12-bit, 10-channel analog-to-digital converter
Temperature Rating: -40°C to 125°C operating range

The MC9S08SH4MTJ qualifies as a direct substitute based on matching all core functional parameters. The primary difference is packaging format: the original uses 20-DIP (through-hole), while the substitute uses 20-TSSOP (surface-mount). Both packages contain identical die and firmware compatibility.

Parameter Comparison

Parameter	MC9S08SH4MPJ (Original)	MC9S08SH4MTJ (Substitute)
Manufacturer	NXP Semiconductors	NXP USA Inc.
Series	S08	S08
Core Processor	S08	S08
Core Size	8-Bit	8-Bit
Speed	40MHz	40MHz
Program Memory Size	4KB (4K x 8)	4KB (4K x 8)
Program Memory Type	FLASH	FLASH
RAM Size	256 x 8	256 x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	2.7V ~ 5.5V
Data Converters	A/D 12x10b	A/D 12x10b
Number of I/O	17	17
Connectivity	I2C, LINbus, SCI, SPI	I2C, LINbus, SCI, SPI
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Mounting Type	Through Hole	Surface Mount
Package / Case	20-DIP (0.300", 7.62mm)	20-TSSOP (0.173", 4.40mm Width)
Product Status	Obsolete	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
REACH Status	REACH Unaffected	REACH Unaffected

Engineering Selection Recommendations

The MC9S08SH4MTJ is the direct functional equivalent of the MC9S08SH4MPJ. Both devices share identical core specifications, memory configuration, and peripheral architecture. The substitute part carries active product status from NXP USA Inc., ensuring ongoing availability and manufacturing support compared to the obsolete original.

Both parts maintain ROHS3 compliance and REACH unaffected status, meeting current environmental and regulatory requirements. The MC9S08SH4MTJ includes moisture sensitivity level (MSL) rating of 3 (168 hours), applicable to surface-mount handling and storage protocols.

Selection between these parts depends on board-level design requirements. The through-hole 20-DIP package of the original suits breadboard prototyping and legacy PCB designs. The surface-mount 20-TSSOP package of the substitute supports modern manufacturing processes and compact board layouts. Functional performance and firmware compatibility remain identical across both package options.

Frequently Asked Questions (FAQ)

Q: Can MC9S08SH4MTJ directly replace MC9S08SH4MPJ in existing designs?

A: Functional replacement is complete. The substitute contains identical processor core, memory, and peripherals. PCB layout and assembly process must accommodate the package change from 20-DIP (through-hole) to 20-TSSOP (surface-mount).

Q: What is the primary difference between these two parts?

A: The packaging format differs. MC9S08SH4MPJ uses 20-DIP through-hole mounting; MC9S08SH4MTJ uses 20-TSSOP surface-mount. All electrical and functional specifications are identical.

Q: Are there any compatibility concerns with the substitute part?

A: No compatibility concerns exist at the functional level. Firmware and application code require no modification. PCB design, soldering process, and board assembly procedures must align with surface-mount technology for the substitute.

Q: Why is the original part listed as obsolete?

A: The MC9S08SH4MPJ has reached end-of-life status. NXP has transitioned production to the MC9S08SH4MTJ, which offers the same functionality in a modern surface-mount package format.

Q: Do both parts meet current regulatory standards?

A: Yes. Both the MC9S08SH4MPJ and MC9S08SH4MTJ are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

Q: What is the moisture sensitivity level (MSL) for the substitute?

A: The MC9S08SH4MTJ carries MSL 3 (168 hours), standard for surface-mount microcontroller packages. Storage and handling must follow IPC-A-610 guidelines for MSL 3 components.

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