MBR3030PT Equivalent & Substitute Parts

Part Overview

The MBR3030PT is a Schottky diode array manufactured by Diodes Incorporated, configured as a 1 Pair Common Cathode design rated for 30V DC reverse voltage and 30A average rectified current per diode. The device is housed in a TO-3P-3 (SC-65-3) through-hole package and is classified as Active product status with ROHS3 compliance. Identification of equivalent and substitute parts is necessary when the primary part is unavailable, when alternative packaging configurations are required for specific board layouts, or when supply chain optimization is needed while maintaining electrical and mechanical compatibility.

Substiute Parts

MBR3030PT
Diodes IncorporatedIn Stock: 861MBR3030PT Datasheet
MBR3030PT
Current Part
STPS60L30CW
STMicroelectronicsIn Stock: 90232STPS60L30CW Datasheet
STPS60L30CW
MFR Recommended

Key Parameters

Parameter Value
Diode Configuration 1 Pair Common Cathode
Technology Schottky
Voltage - DC Reverse (Vr) (Max) 30 V
Current - Average Rectified (Io) (per Diode) 30 A
Speed Fast Recovery ≤ 500ns, > 200mA (Io)
Mounting Type Through Hole
Operating Temperature - Junction -65°C ~ 150°C
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the MBR3030PT is permissible with parts that maintain electrical equivalence across the following critical parameters:

  • Diode Configuration: Must be 1 Pair Common Cathode
  • Technology: Must be Schottky
  • Voltage - DC Reverse (Vr) (Max): Must be 30 V or greater
  • Current - Average Rectified (Io) (per Diode): Must be 30 A or greater
  • Speed Classification: Must be Fast Recovery ≤ 500ns, > 200mA (Io)
  • Mounting Type: Must be Through Hole
  • Compliance: Must maintain ROHS3 compliance and MSL 1 rating

Package configuration (TO-3P-3 versus TO-247-3) represents a mechanical variation that does not affect electrical performance but requires verification of board layout compatibility. The STPS60L30CW meets all electrical and compliance requirements while utilizing an alternative through-hole package form factor.

Parameter Comparison

Parameter MBR3030PT STPS60L30CW
Manufacturer Diodes Incorporated STMicroelectronics
Diode Configuration 1 Pair Common Cathode 1 Pair Common Cathode
Technology Schottky Schottky
Voltage - DC Reverse (Vr) (Max) 30 V 30 V
Current - Average Rectified (Io) (per Diode) 30 A 30 A
Voltage - Forward (Vf) (Max) @ If 760 mV @ 30 A 460 mV @ 30 A
Speed Fast Recovery ≤ 500ns, > 200mA (Io) Fast Recovery ≤ 500ns, > 200mA (Io)
Current - Reverse Leakage @ Vr 1 mA @ 30 V 4 mA @ 30 V
Operating Temperature - Junction (Max) 150°C 150°C
Mounting Type Through Hole Through Hole
Package / Case TO-3P-3, SC-65-3 TO-247-3
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

The STPS60L30CW is electrically equivalent to the MBR3030PT and qualifies as a direct substitute based on matching diode configuration, technology, voltage rating, current rating, speed classification, and compliance certifications. Both parts maintain ROHS3 compliance and MSL 1 rating, ensuring regulatory and environmental compatibility.

The primary distinction between these parts is the package form factor: the MBR3030PT uses TO-3P-3 (SC-65-3) packaging while the STPS60L30CW uses TO-247-3 packaging. This mechanical difference requires board layout verification to confirm pin spacing and mounting hole compatibility. Additionally, the STPS60L30CW exhibits lower forward voltage drop (460 mV versus 760 mV at 30 A), which may result in reduced power dissipation in the application circuit.

Selection between these parts should be based on board design requirements, available mounting space, and thermal management considerations specific to the application.

Frequently Asked Questions (FAQ)

Q: Can the STPS60L30CW be used as a direct replacement for the MBR3030PT?

A: The STPS60L30CW is electrically equivalent to the MBR3030PT across all critical electrical parameters including voltage rating, current rating, diode configuration, and speed classification. However, the package form factor differs (TO-247-3 versus TO-3P-3). Board layout compatibility must be verified before substitution.

Q: What are the key electrical parameters that determine substitution compatibility?

A: Substitution compatibility is determined by: diode configuration (1 Pair Common Cathode), technology (Schottky), maximum reverse voltage (30 V), average rectified current per diode (30 A), speed classification (Fast Recovery ≤ 500ns, > 200mA), and operating temperature range. All these parameters must match or exceed the original specification.

Q: How do the forward voltage characteristics differ between these parts?

A: The MBR3030PT has a maximum forward voltage of 760 mV at 30 A, while the STPS60L30CW has a maximum forward voltage of 460 mV at 30 A. The lower forward voltage of the STPS60L30CW results in reduced power dissipation during operation.

Q: Are there compliance or regulatory differences between these parts?

A: Both parts maintain identical compliance status: ROHS3 compliant, REACH unaffected, MSL 1 (unlimited), and EAR99 classification. No regulatory or environmental differences exist between these parts.

Q: What is the significance of the reverse leakage current difference?

A: The MBR3030PT exhibits 1 mA reverse leakage at 30 V, while the STPS60L30CW exhibits 4 mA reverse leakage at 30 V. This difference may be relevant in applications with stringent leakage current requirements but does not affect basic substitution eligibility.

Q: How should package differences be evaluated for board compatibility?

A: Package differences require physical verification of pin spacing, lead configuration, and mounting hole locations on the target PCB. The TO-3P-3 and TO-247-3 packages have different mechanical dimensions and may not be interchangeable without board redesign or adapter solutions.

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