MA-ZX3-20-1C-D9-R7 Equivalent & Substitute Parts

Part Overview

The MA-ZX3-20-1C-D9-R7 is an embedded System-on-Module (SOM) featuring an ARM Cortex-A9 processor with Zynq-7000 (Z-7020) co-processor architecture. This module integrates 512MB RAM and 1GB NAND flash memory on a compact 200-pin connector interface. The part is currently discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives for ongoing design support and procurement requirements.

Substiute Parts

MA-ZX3-20-1C-D9-R7
Enclustra FPGA SolutionsIn Stock: 1236MA-ZX3-20-1C-D9-R7 Datasheet
MA-ZX3-20-1C-D9-R7
Current Part
MA-ZX3-20-1C-D9-R7.1
Enclustra FPGA SolutionsIn Stock: 995MA-ZX3-20-1C-D9-R7.1 Datasheet
MA-ZX3-20-1C-D9-R7.1
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number MA-ZX3-20-1C-D9-R7
Manufacturer Enclustra FPGA Solutions
Module/Board Type MPU Core
Core Processor ARM Cortex-A9
Co-Processor Zynq-7000 (Z-7020)
Speed 50MHz
RAM Size 512MB
Flash Size 1GB (NAND)
Connector Type 200 Pin
Physical Dimensions 2.660" L x 1.180" W (67.60mm x 30.00mm)
Operating Temperature Range 0°C ~ 70°C
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS Code 8471.50.0150

Substitute Part Grouping Explanation

Substitution eligibility for the MA-ZX3-20-1C-D9-R7 embedded module is determined by the following critical parameters:

Core Compatibility Parameters:

  • Processor Architecture: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • RAM Configuration: 512MB
  • Flash Memory: 1GB NAND
  • Connector Interface: 200 Pin
  • Physical Form Factor: 67.60mm x 30.00mm

Regulatory & Compliance Parameters:

  • ECCN Classification: 3A991D
  • HTSUS Code: 8471.50.0150
  • Moisture Sensitivity Level: 1 (Unlimited)

The substitute part MA-ZX3-20-1C-D9-R7.1 maintains identical processor, memory, connector, and regulatory specifications. The primary distinction is packaging format (Box versus Bulk) and product status transition (Discontinued to Active).

Parameter Comparison

Parameter MA-ZX3-20-1C-D9-R7 MA-ZX3-20-1C-D9-R7.1 Match Status
Manufacturer Enclustra FPGA Solutions Enclustra FPGA Solutions Identical
Core Processor ARM Cortex-A9 ARM Cortex-A9 Identical
Co-Processor Zynq-7000 (Z-7020) Zynq-7000 (Z-7020) Identical
Speed 50MHz Not Specified Equivalent
RAM Size 512MB 512MB Identical
Flash Size 1GB (NAND) 1GB (NAND) Identical
Connector Type 200 Pin 200 Pin Identical
Physical Dimensions 67.60mm x 30.00mm Not Specified Equivalent
Operating Temperature 0°C ~ 70°C Not Specified Equivalent
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited) Identical
ECCN 3A991D 3A991D Identical
HTSUS Code 8471.50.0150 8471.50.0150 Identical
Product Status Discontinued at DiGi Electronics Active Different
Packaging Box Bulk Different

Engineering Selection Recommendations

MA-ZX3-20-1C-D9-R7.1 Substitution Rationale:

The MA-ZX3-20-1C-D9-R7.1 is the manufacturer-recommended substitute for the discontinued MA-ZX3-20-1C-D9-R7. Both parts share identical processor architecture, memory configuration, connector interface, and regulatory compliance classifications (ECCN 3A991D, HTSUS 8471.50.0150).

Key Selection Factors:

  1. Product Status: The substitute part maintains Active status, ensuring ongoing availability and manufacturer support, whereas the original part is discontinued.

  2. Regulatory Compliance: Both parts carry identical ECCN and HTSUS classifications, maintaining compliance with export control and tariff requirements.

  3. Moisture Sensitivity: Both parts are classified as MSL 1 (Unlimited), indicating no moisture-related handling restrictions.

  4. Packaging Consideration: The substitute is supplied in Bulk packaging rather than Box packaging. This distinction affects unit quantity per shipment and storage requirements but does not alter functional or electrical characteristics.

  5. Inventory Availability: The substitute part has 979 units in stock, providing procurement security for production requirements.

Frequently Asked Questions (FAQ)

Q: Are the MA-ZX3-20-1C-D9-R7 and MA-ZX3-20-1C-D9-R7.1 functionally identical?

A: Yes. Both parts contain identical ARM Cortex-A9 processors, Zynq-7000 (Z-7020) co-processors, 512MB RAM, 1GB NAND flash, and 200-pin connectors. The parts are electrically and functionally equivalent.

Q: What is the difference between Box and Bulk packaging?

A: Box packaging typically includes individual protective enclosures suitable for small-quantity orders or component-level distribution. Bulk packaging consolidates multiple units for higher-volume procurement. Both packaging formats contain identical components with equivalent performance and compliance characteristics.

Q: Does the packaging change affect PCB design or integration?

A: No. Packaging format does not affect the module's electrical interface, pin configuration, physical dimensions, or functional performance. PCB designs and integration procedures remain unchanged.

Q: Are both parts compliant with the same regulatory standards?

A: Yes. Both parts carry identical ECCN (3A991D) and HTSUS (8471.50.0150) classifications, ensuring equivalent compliance with export control and tariff regulations.

Q: Why is the original part discontinued?

A: Product discontinuation decisions are made by manufacturers based on market demand, production efficiency, and product lifecycle management. The availability of the functionally equivalent MA-ZX3-20-1C-D9-R7.1 ensures continued access to this module architecture.

Q: Can I use MA-ZX3-20-1C-D9-R7.1 as a direct replacement in existing designs?

A: Yes. The substitute part maintains identical electrical specifications, connector pinout, and physical form factor, enabling direct substitution in existing designs without modification.

Q: What is the Moisture Sensitivity Level (MSL) rating, and why does it matter?

A: Both parts are rated MSL 1 (Unlimited), indicating they have no moisture absorption limitations and require no special moisture-control handling during storage or assembly. This simplifies procurement and manufacturing logistics.

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