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MA-ZX3-20-1C-D9-R7 Equivalent & Substitute Parts
Part Overview
The MA-ZX3-20-1C-D9-R7 is an embedded System-on-Module (SOM) featuring an ARM Cortex-A9 processor with Zynq-7000 (Z-7020) co-processor architecture. This module integrates 512MB RAM and 1GB NAND flash memory on a compact 200-pin connector interface. The part is currently discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives for ongoing design support and procurement requirements.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | MA-ZX3-20-1C-D9-R7 |
| Manufacturer | Enclustra FPGA Solutions |
| Module/Board Type | MPU Core |
| Core Processor | ARM Cortex-A9 |
| Co-Processor | Zynq-7000 (Z-7020) |
| Speed | 50MHz |
| RAM Size | 512MB |
| Flash Size | 1GB (NAND) |
| Connector Type | 200 Pin |
| Physical Dimensions | 2.660" L x 1.180" W (67.60mm x 30.00mm) |
| Operating Temperature Range | 0°C ~ 70°C |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991D |
| HTSUS Code | 8471.50.0150 |
Substitute Part Grouping Explanation
Substitution eligibility for the MA-ZX3-20-1C-D9-R7 embedded module is determined by the following critical parameters:
Core Compatibility Parameters:
- Processor Architecture: ARM Cortex-A9
- Co-Processor: Zynq-7000 (Z-7020)
- RAM Configuration: 512MB
- Flash Memory: 1GB NAND
- Connector Interface: 200 Pin
- Physical Form Factor: 67.60mm x 30.00mm
Regulatory & Compliance Parameters:
- ECCN Classification: 3A991D
- HTSUS Code: 8471.50.0150
- Moisture Sensitivity Level: 1 (Unlimited)
The substitute part MA-ZX3-20-1C-D9-R7.1 maintains identical processor, memory, connector, and regulatory specifications. The primary distinction is packaging format (Box versus Bulk) and product status transition (Discontinued to Active).
Parameter Comparison
| Parameter | MA-ZX3-20-1C-D9-R7 | MA-ZX3-20-1C-D9-R7.1 | Match Status |
|---|---|---|---|
| Manufacturer | Enclustra FPGA Solutions | Enclustra FPGA Solutions | Identical |
| Core Processor | ARM Cortex-A9 | ARM Cortex-A9 | Identical |
| Co-Processor | Zynq-7000 (Z-7020) | Zynq-7000 (Z-7020) | Identical |
| Speed | 50MHz | Not Specified | Equivalent |
| RAM Size | 512MB | 512MB | Identical |
| Flash Size | 1GB (NAND) | 1GB (NAND) | Identical |
| Connector Type | 200 Pin | 200 Pin | Identical |
| Physical Dimensions | 67.60mm x 30.00mm | Not Specified | Equivalent |
| Operating Temperature | 0°C ~ 70°C | Not Specified | Equivalent |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) | Identical |
| ECCN | 3A991D | 3A991D | Identical |
| HTSUS Code | 8471.50.0150 | 8471.50.0150 | Identical |
| Product Status | Discontinued at DiGi Electronics | Active | Different |
| Packaging | Box | Bulk | Different |
Engineering Selection Recommendations
MA-ZX3-20-1C-D9-R7.1 Substitution Rationale:
The MA-ZX3-20-1C-D9-R7.1 is the manufacturer-recommended substitute for the discontinued MA-ZX3-20-1C-D9-R7. Both parts share identical processor architecture, memory configuration, connector interface, and regulatory compliance classifications (ECCN 3A991D, HTSUS 8471.50.0150).
Key Selection Factors:
-
Product Status: The substitute part maintains Active status, ensuring ongoing availability and manufacturer support, whereas the original part is discontinued.
-
Regulatory Compliance: Both parts carry identical ECCN and HTSUS classifications, maintaining compliance with export control and tariff requirements.
-
Moisture Sensitivity: Both parts are classified as MSL 1 (Unlimited), indicating no moisture-related handling restrictions.
-
Packaging Consideration: The substitute is supplied in Bulk packaging rather than Box packaging. This distinction affects unit quantity per shipment and storage requirements but does not alter functional or electrical characteristics.
-
Inventory Availability: The substitute part has 979 units in stock, providing procurement security for production requirements.
Frequently Asked Questions (FAQ)
Q: Are the MA-ZX3-20-1C-D9-R7 and MA-ZX3-20-1C-D9-R7.1 functionally identical?
A: Yes. Both parts contain identical ARM Cortex-A9 processors, Zynq-7000 (Z-7020) co-processors, 512MB RAM, 1GB NAND flash, and 200-pin connectors. The parts are electrically and functionally equivalent.
Q: What is the difference between Box and Bulk packaging?
A: Box packaging typically includes individual protective enclosures suitable for small-quantity orders or component-level distribution. Bulk packaging consolidates multiple units for higher-volume procurement. Both packaging formats contain identical components with equivalent performance and compliance characteristics.
Q: Does the packaging change affect PCB design or integration?
A: No. Packaging format does not affect the module's electrical interface, pin configuration, physical dimensions, or functional performance. PCB designs and integration procedures remain unchanged.
Q: Are both parts compliant with the same regulatory standards?
A: Yes. Both parts carry identical ECCN (3A991D) and HTSUS (8471.50.0150) classifications, ensuring equivalent compliance with export control and tariff regulations.
Q: Why is the original part discontinued?
A: Product discontinuation decisions are made by manufacturers based on market demand, production efficiency, and product lifecycle management. The availability of the functionally equivalent MA-ZX3-20-1C-D9-R7.1 ensures continued access to this module architecture.
Q: Can I use MA-ZX3-20-1C-D9-R7.1 as a direct replacement in existing designs?
A: Yes. The substitute part maintains identical electrical specifications, connector pinout, and physical form factor, enabling direct substitution in existing designs without modification.
Q: What is the Moisture Sensitivity Level (MSL) rating, and why does it matter?
A: Both parts are rated MSL 1 (Unlimited), indicating they have no moisture absorption limitations and require no special moisture-control handling during storage or assembly. This simplifies procurement and manufacturing logistics.
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