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MAX944EPD Equivalent & Substitute Parts
Part Overview
The MAX944EPD is a general-purpose CMOS comparator with four independent elements, designed for applications requiring precision voltage comparison with TTL-compatible output. Manufactured by Analog Devices Inc./Maxim Integrated, this device operates across a 2.7V to 5.5V supply range and features push-pull output architecture suitable for direct logic interfacing.
The MAX944EPD is classified as obsolete. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain reliability, and support long-term product availability for applications currently utilizing this comparator.
Substiute Parts
Key Parameters
| Parameter | MAX944EPD |
|---|---|
| Manufacturer | Analog Devices Inc./Maxim Integrated |
| Category | Linear - Comparator |
| Type | General Purpose |
| Number of Elements | 4 |
| Output Type | CMOS, Push-Pull, TTL |
| Voltage - Supply, Single/Dual (±) | 2.7V ~ 5.5V |
| Voltage - Input Offset (Max) | 2mV @ 5.5V |
| Current - Input Bias (Max) | 0.15µA @ 5.5V |
| Current - Quiescent (Max) | 600µA |
| CMRR, PSRR (Typ) | 81.94dB CMRR, 81.94dB PSRR |
| Propagation Delay (Max) | 80ns |
| Operating Temperature | -40°C ~ 85°C |
| Package / Case | 14-DIP (0.300", 7.62mm) |
| Mounting Type | Through Hole |
| Product Status | Obsolete |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitution of the MAX944EPD is determined by the following critical parameters:
- Functional Equivalence: Four independent general-purpose comparator elements with CMOS and TTL-compatible output
- Supply Voltage Compatibility: Operating range must encompass or exceed 2.7V ~ 5.5V
- Output Architecture: Push-pull output configuration for direct logic interfacing
- Electrical Performance: Input offset voltage, input bias current, quiescent current, and propagation delay must meet or exceed the original specification
- Package Compatibility: Electrical pin configuration must support direct substitution or adapter-based implementation
The MCP6564-E/SL qualifies as a functional substitute based on these criteria, with enhanced performance characteristics and active product status.
Parameter Comparison
| Parameter | MAX944EPD | MCP6564-E/SL | Compatibility Notes |
|---|---|---|---|
| Manufacturer | Analog Devices Inc./Maxim Integrated | Microchip Technology | Different manufacturer |
| Category | Linear - Comparator | Linear - Comparator | Functionally equivalent |
| Type | General Purpose | General Purpose | Functionally equivalent |
| Number of Elements | 4 | 4 | Functionally equivalent |
| Output Type | CMOS, Push-Pull, TTL | CMOS, Push-Pull, Rail-to-Rail, TTL | MCP6564-E/SL includes rail-to-rail capability |
| Voltage - Supply, Single/Dual (±) | 2.7V ~ 5.5V | 1.8V ~ 5.5V | MCP6564-E/SL supports lower minimum voltage |
| Voltage - Input Offset (Max) | 2mV @ 5.5V | 10mV @ 5.5V | MAX944EPD has superior offset specification |
| Current - Input Bias (Max) | 0.15µA @ 5.5V | 1pA @ 5.5V | MCP6564-E/SL has significantly lower bias current |
| Current - Quiescent (Max) | 600µA | 130µA | MCP6564-E/SL has lower quiescent current |
| CMRR, PSRR (Typ) | 81.94dB CMRR, 81.94dB PSRR | 66dB CMRR, 70dB PSRR | MAX944EPD has superior rejection ratios |
| Propagation Delay (Max) | 80ns | 80ns | Functionally equivalent |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 125°C | MCP6564-E/SL supports extended temperature range |
| Package / Case | 14-DIP (0.300", 7.62mm) | 14-SOIC (0.154", 3.90mm Width) | Different package form factor |
| Mounting Type | Through Hole | Surface Mount | Different mounting technology |
| Product Status | Obsolete | Active | MCP6564-E/SL is actively manufactured |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Both compliant |
Engineering Selection Recommendations
The MCP6564-E/SL is an active, ROHS3-compliant substitute for the obsolete MAX944EPD. Selection of this substitute requires consideration of the following factors:
Package Transition: The MAX944EPD uses through-hole 14-DIP packaging, while the MCP6564-E/SL uses surface-mount 14-SOIC packaging. Direct socket replacement is not possible without adapter circuitry or PCB redesign.
Electrical Performance Trade-offs: The MCP6564-E/SL provides superior input bias current (1pA vs. 0.15µA) and lower quiescent current (130µA vs. 600µA), beneficial for low-power applications. However, the MAX944EPD maintains superior input offset voltage (2mV vs. 10mV) and common-mode rejection ratio (81.94dB vs. 66dB), which may be critical in precision measurement applications.
Supply Voltage Range: The MCP6564-E/SL supports operation down to 1.8V, extending applicability to lower-voltage systems while maintaining full compatibility with the 2.7V ~ 5.5V range of the original device.
Temperature Range: The MCP6564-E/SL extends the operating temperature range to -40°C ~ 125°C, providing enhanced thermal margin for industrial and automotive applications.
Compliance and Availability: Both devices are ROHS3 compliant and REACH unaffected. The MCP6564-E/SL is actively manufactured with established supply chain availability, whereas the MAX944EPD is obsolete.
Frequently Asked Questions (FAQ)
Q: Can the MCP6564-E/SL be used as a direct replacement for the MAX944EPD?
A: Electrical substitution is feasible based on functional equivalence and parameter compatibility. However, package form factor differs (14-DIP through-hole vs. 14-SOIC surface-mount), requiring either PCB redesign or adapter implementation. Pin configuration must be verified against device datasheets to ensure correct signal routing.
Q: What are the key differences in electrical performance between these devices?
A: The MAX944EPD provides superior input offset voltage (2mV vs. 10mV) and common-mode rejection ratio (81.94dB vs. 66dB). The MCP6564-E/SL offers significantly lower input bias current (1pA vs. 0.15µA) and quiescent current (130µA vs. 600µA), making it more suitable for low-power and high-impedance applications.
Q: Is the MCP6564-E/SL suitable for precision measurement applications?
A: The MCP6564-E/SL is suitable for general-purpose comparator applications. Applications requiring the superior input offset voltage and rejection ratios of the MAX944EPD may require alternative evaluation or circuit compensation techniques.
Q: What is the impact of switching from through-hole to surface-mount packaging?
A: Surface-mount packaging (14-SOIC) reduces board space and enables automated assembly processes. Through-hole packaging (14-DIP) provides mechanical robustness and manual rework capability. PCB redesign or adapter circuitry is necessary to accommodate the package transition.
Q: Are both devices compliant with current regulatory standards?
A: Both the MAX944EPD and MCP6564-E/SL are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements for electronic components.
Q: What is the significance of the MCP6564-E/SL being an active product?
A: Active product status ensures ongoing manufacturing, established supply chain availability, and continued technical support from the manufacturer. The obsolete status of the MAX944EPD creates long-term supply risk and limits access to technical resources.
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