MAX944EPD Equivalent & Substitute Parts

Part Overview

The MAX944EPD is a general-purpose CMOS comparator with four independent elements, designed for applications requiring precision voltage comparison with TTL-compatible output. Manufactured by Analog Devices Inc./Maxim Integrated, this device operates across a 2.7V to 5.5V supply range and features push-pull output architecture suitable for direct logic interfacing.

The MAX944EPD is classified as obsolete. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain reliability, and support long-term product availability for applications currently utilizing this comparator.

Substiute Parts

MAX944EPD
Analog Devices Inc./Maxim IntegratedIn Stock: 891MAX944EPD Datasheet
MAX944EPD
Current Part
MCP6564-E/SL
Microchip TechnologyIn Stock: 2199MCP6564-E/SL Datasheet
MCP6564-E/SL
MFR Recommended

Key Parameters

Parameter MAX944EPD
Manufacturer Analog Devices Inc./Maxim Integrated
Category Linear - Comparator
Type General Purpose
Number of Elements 4
Output Type CMOS, Push-Pull, TTL
Voltage - Supply, Single/Dual (±) 2.7V ~ 5.5V
Voltage - Input Offset (Max) 2mV @ 5.5V
Current - Input Bias (Max) 0.15µA @ 5.5V
Current - Quiescent (Max) 600µA
CMRR, PSRR (Typ) 81.94dB CMRR, 81.94dB PSRR
Propagation Delay (Max) 80ns
Operating Temperature -40°C ~ 85°C
Package / Case 14-DIP (0.300", 7.62mm)
Mounting Type Through Hole
Product Status Obsolete
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the MAX944EPD is determined by the following critical parameters:

  • Functional Equivalence: Four independent general-purpose comparator elements with CMOS and TTL-compatible output
  • Supply Voltage Compatibility: Operating range must encompass or exceed 2.7V ~ 5.5V
  • Output Architecture: Push-pull output configuration for direct logic interfacing
  • Electrical Performance: Input offset voltage, input bias current, quiescent current, and propagation delay must meet or exceed the original specification
  • Package Compatibility: Electrical pin configuration must support direct substitution or adapter-based implementation

The MCP6564-E/SL qualifies as a functional substitute based on these criteria, with enhanced performance characteristics and active product status.

Parameter Comparison

Parameter MAX944EPD MCP6564-E/SL Compatibility Notes
Manufacturer Analog Devices Inc./Maxim Integrated Microchip Technology Different manufacturer
Category Linear - Comparator Linear - Comparator Functionally equivalent
Type General Purpose General Purpose Functionally equivalent
Number of Elements 4 4 Functionally equivalent
Output Type CMOS, Push-Pull, TTL CMOS, Push-Pull, Rail-to-Rail, TTL MCP6564-E/SL includes rail-to-rail capability
Voltage - Supply, Single/Dual (±) 2.7V ~ 5.5V 1.8V ~ 5.5V MCP6564-E/SL supports lower minimum voltage
Voltage - Input Offset (Max) 2mV @ 5.5V 10mV @ 5.5V MAX944EPD has superior offset specification
Current - Input Bias (Max) 0.15µA @ 5.5V 1pA @ 5.5V MCP6564-E/SL has significantly lower bias current
Current - Quiescent (Max) 600µA 130µA MCP6564-E/SL has lower quiescent current
CMRR, PSRR (Typ) 81.94dB CMRR, 81.94dB PSRR 66dB CMRR, 70dB PSRR MAX944EPD has superior rejection ratios
Propagation Delay (Max) 80ns 80ns Functionally equivalent
Operating Temperature -40°C ~ 85°C -40°C ~ 125°C MCP6564-E/SL supports extended temperature range
Package / Case 14-DIP (0.300", 7.62mm) 14-SOIC (0.154", 3.90mm Width) Different package form factor
Mounting Type Through Hole Surface Mount Different mounting technology
Product Status Obsolete Active MCP6564-E/SL is actively manufactured
RoHS Status ROHS3 Compliant ROHS3 Compliant Both compliant

Engineering Selection Recommendations

The MCP6564-E/SL is an active, ROHS3-compliant substitute for the obsolete MAX944EPD. Selection of this substitute requires consideration of the following factors:

Package Transition: The MAX944EPD uses through-hole 14-DIP packaging, while the MCP6564-E/SL uses surface-mount 14-SOIC packaging. Direct socket replacement is not possible without adapter circuitry or PCB redesign.

Electrical Performance Trade-offs: The MCP6564-E/SL provides superior input bias current (1pA vs. 0.15µA) and lower quiescent current (130µA vs. 600µA), beneficial for low-power applications. However, the MAX944EPD maintains superior input offset voltage (2mV vs. 10mV) and common-mode rejection ratio (81.94dB vs. 66dB), which may be critical in precision measurement applications.

Supply Voltage Range: The MCP6564-E/SL supports operation down to 1.8V, extending applicability to lower-voltage systems while maintaining full compatibility with the 2.7V ~ 5.5V range of the original device.

Temperature Range: The MCP6564-E/SL extends the operating temperature range to -40°C ~ 125°C, providing enhanced thermal margin for industrial and automotive applications.

Compliance and Availability: Both devices are ROHS3 compliant and REACH unaffected. The MCP6564-E/SL is actively manufactured with established supply chain availability, whereas the MAX944EPD is obsolete.

Frequently Asked Questions (FAQ)

Q: Can the MCP6564-E/SL be used as a direct replacement for the MAX944EPD?

A: Electrical substitution is feasible based on functional equivalence and parameter compatibility. However, package form factor differs (14-DIP through-hole vs. 14-SOIC surface-mount), requiring either PCB redesign or adapter implementation. Pin configuration must be verified against device datasheets to ensure correct signal routing.

Q: What are the key differences in electrical performance between these devices?

A: The MAX944EPD provides superior input offset voltage (2mV vs. 10mV) and common-mode rejection ratio (81.94dB vs. 66dB). The MCP6564-E/SL offers significantly lower input bias current (1pA vs. 0.15µA) and quiescent current (130µA vs. 600µA), making it more suitable for low-power and high-impedance applications.

Q: Is the MCP6564-E/SL suitable for precision measurement applications?

A: The MCP6564-E/SL is suitable for general-purpose comparator applications. Applications requiring the superior input offset voltage and rejection ratios of the MAX944EPD may require alternative evaluation or circuit compensation techniques.

Q: What is the impact of switching from through-hole to surface-mount packaging?

A: Surface-mount packaging (14-SOIC) reduces board space and enables automated assembly processes. Through-hole packaging (14-DIP) provides mechanical robustness and manual rework capability. PCB redesign or adapter circuitry is necessary to accommodate the package transition.

Q: Are both devices compliant with current regulatory standards?

A: Both the MAX944EPD and MCP6564-E/SL are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements for electronic components.

Q: What is the significance of the MCP6564-E/SL being an active product?

A: Active product status ensures ongoing manufacturing, established supply chain availability, and continued technical support from the manufacturer. The obsolete status of the MAX944EPD creates long-term supply risk and limits access to technical resources.

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