MAX560CWI+ Equivalent & Substitute Parts

Part Overview

The MAX560CWI+ is an active RS562 transceiver IC manufactured by Analog Devices Inc./Maxim Integrated. This 28-SOIC surface mount interface component provides full-duplex communication with 4 drivers and 5 receivers, operating at data rates up to 116 Kbps. The part is currently in active production status with 707 units in stock. Substitute parts are identified when equivalent electrical performance, mechanical compatibility, and compliance certifications align with the original specification, enabling component selection flexibility for design requirements or supply chain optimization.

Substiute Parts

MAX560CWI+

Analog Devices Inc./Maxim IntegratedIn Stock: 741MAX560CWI+ Datasheet

Current PartRFQ

MAX560CWI+

Analog Devices Inc./Maxim IntegratedIn Stock: 741MAX560CWI+ Datasheet

Parametric EquivalentRFQ

ADM560JRZ

Analog Devices Inc.In Stock: 3915ADM560JRZ Datasheet

Parametric EquivalentRFQ

ADM561JRZ

Analog Devices Inc.In Stock: 36348ADM561JRZ Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the MAX560CWI+ are identified based on the following critical parameters that determine functional and mechanical compatibility:

• Package / Case: 28-SOIC form factor with identical 0.295" (7.50mm) width
• Mounting Type: Surface mount compatibility
• Number of Drivers/Receivers: 4/5 configuration
• Duplex Mode: Full-duplex operation
• Data Rate: 116 Kbps capability
• Voltage Supply Range: 3V ~ 3.6V operation
• Operating Temperature Range: 0°C ~ 70°C
• Receiver Hysteresis: 300 mV
• Compliance: ROHS3 Compliant, MSL Level 1

The identified substitutes (ADM560JRZ and ADM561JRZ) maintain identical electrical performance parameters and mechanical compatibility. Protocol differences (RS562 vs. RS232) do not prevent substitution when application requirements permit protocol flexibility.

Parameter Comparison

Engineering Selection Recommendations

All three parts maintain active product status and full compliance with ROHS3 and REACH requirements. Selection between MAX560CWI+, ADM560JRZ, and ADM561JRZ is determined by application protocol requirements and inventory availability:

• MAX560CWI+: Primary selection for RS562 protocol applications. 707 units available.
• ADM560JRZ: RS232 protocol alternative with equivalent electrical and mechanical specifications. 3839 units available.
• ADM561JRZ: RS232 protocol alternative with equivalent electrical and mechanical specifications. 36300 units available, providing maximum supply availability.

All parts are MSL Level 1 rated, eliminating moisture sensitivity constraints for standard storage and handling conditions.

Frequently Asked Questions (FAQ)

Q: Can ADM560JRZ or ADM561JRZ replace MAX560CWI+ in existing designs?

A: Substitution is possible when the application protocol requirements permit RS232 operation in place of RS562. All three parts share identical electrical performance (4/5 drivers/receivers, 116 Kbps data rate, 3V-3.6V supply, 0°C-70°C operating range) and mechanical compatibility (28-SOIC package, surface mount).

Q: What is the difference between MAX560CWI+, ADM560JRZ, and ADM561JRZ?

A: The primary difference is protocol specification: MAX560CWI+ operates on RS562, while ADM560JRZ and ADM561JRZ operate on RS232. All other electrical parameters, package specifications, and compliance certifications are identical. ADM561JRZ offers significantly higher inventory availability (36300 units vs. 3839 for ADM560JRZ).

Q: Are all three parts pin-compatible?

A: Yes. All three parts use the 28-SOIC package with identical 0.295" (7.50mm) width and surface mount configuration, ensuring mechanical and electrical pin compatibility.

Q: Do these parts require special handling or storage?

A: No. All three parts carry MSL Level 1 rating, indicating unlimited shelf life under standard storage conditions without moisture sensitivity constraints.

Q: What compliance certifications apply to these parts?

A: All three parts are ROHS3 Compliant and REACH Unaffected, meeting current environmental and regulatory requirements for electronic component manufacturing and distribution.