MAX329C/D Equivalent & Substitute Parts

Part Overview

The MAX329C/D is a 2-circuit IC switch with SP4T (single-pole, 4-throw) configuration and 4.6kOhm on-state resistance, designed for analog signal routing and multiplexing applications. This part is classified as obsolete, making identification of active equivalent components essential for new designs and ongoing production support. The die package format limits its application to hybrid and custom assembly environments. Active substitute parts maintain the core electrical specifications while offering standard surface-mount packaging options for broader manufacturing compatibility.

Substiute Parts

MAX329C/D

Analog Devices Inc./Maxim IntegratedIn Stock: 1135MAX329C/D Datasheet

Current PartRFQ

MAX329CWE+

Analog Devices Inc./Maxim IntegratedIn Stock: 775MAX329CWE+ Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the MAX329C/D is determined by equivalence across the following critical parameters:

Electrical Equivalence Criteria:

• Switch circuit configuration: SP4T (single-pole, 4-throw)
• Multiplexer/demultiplexer circuit: 4:1
• Number of circuits: 2
• On-state resistance (Max): 4.6kOhm
• Channel-to-channel matching (ΔRon): 70Ohm
• Supply voltage ranges: Single supply 10V ~ 30V; Dual supply ±4.5V ~ 18V (minimum)
• Switch timing: Ton (Max) 1.5µs, Toff (Max) 1µs
• Charge injection: 2pC
• Channel capacitance: CS(off) 1.8pF, CD(off) 4pF (minimum)
• Leakage current (IS(off)): 10pA (maximum)
• Operating temperature: 0°C ~ 70°C

Mechanical & Compliance Criteria:

• Mounting type: Surface mount
• RoHS3 compliance
• MSL rating: 1 (Unlimited)

The MAX329CWE+ qualifies as a direct substitute based on matching all electrical parameters and maintaining equivalent performance specifications. The primary difference is packaging format: the substitute transitions from die to 16-SOIC surface-mount package, enabling standard PCB assembly processes while preserving functional equivalence.

Parameter Comparison

* Dual supply range: MAX329CWE+ minimum is ±5V versus MAX329C/D minimum of ±4.5V. Applications requiring operation below ±5V are not compatible.

** Channel capacitance (CD(off)): MAX329CWE+ specifies 8pF maximum versus MAX329C/D 4pF. Applications with strict capacitance requirements below 8pF require evaluation.

Engineering Selection Recommendations

Product Status Consideration: The MAX329C/D is obsolete. The MAX329CWE+ is active and maintains full production support from Analog Devices Inc./Maxim Integrated. For new designs, procurement of ongoing production, or long-term supply chain stability, the MAX329CWE+ is the appropriate selection.

Compliance & Certification: Both parts maintain ROHS3 compliance and MSL 1 (Unlimited) ratings, ensuring compatibility with standard manufacturing processes and storage requirements. The MAX329CWE+ carries ECCN EAR99 classification, while the obsolete MAX329C/D is marked OBSOLETE for export control purposes.

Packaging & Assembly Impact: The transition from die to 16-SOIC package requires PCB layout and assembly process modifications. Die packages are used in hybrid circuits and custom assemblies; 16-SOIC packages are standard for conventional surface-mount PCB assembly. This change affects manufacturing capability and cost structure but does not alter electrical performance.

Parameter Deviations: The dual supply voltage minimum (±5V versus ±4.5V) and channel capacitance maximum (8pF versus 4pF) represent the only specification differences. Applications operating within the MAX329CWE+ parameter envelope experience no functional impact.

Frequently Asked Questions (FAQ)

Q: Can MAX329CWE+ directly replace MAX329C/D in all applications?

A: Electrical substitution is valid for applications operating within the MAX329CWE+ parameter envelope. The dual supply voltage minimum is ±5V (versus ±4.5V for the die version), and channel capacitance (CD(off)) is specified at 8pF maximum (versus 4pF). Applications requiring operation below ±5V dual supply or with capacitance specifications below 8pF require detailed evaluation. Packaging format differs (16-SOIC versus die), necessitating PCB and assembly process changes.

Q: What is the functional difference between the die package and 16-SOIC package?

A: Both packages contain identical die and deliver equivalent electrical performance. The die package is used in hybrid circuits and custom assemblies where the bare die is mounted directly onto a substrate. The 16-SOIC package is a standard surface-mount integrated circuit package suitable for conventional PCB assembly. Selection depends on manufacturing capability and assembly process requirements, not electrical performance.

Q: Are there any supply voltage compatibility issues?

A: The MAX329CWE+ dual supply range is ±5V to ±18V, while the MAX329C/D die specifies ±4.5V to ±18V. If your application requires operation at ±4.5V dual supply, the MAX329CWE+ does not meet this requirement. Single supply operation (10V ~ 30V) is equivalent for both parts.

Q: How do the channel capacitance specifications differ?

A: The MAX329C/D die specifies CD(off) at 4pF maximum; the MAX329CWE+ specifies 8pF maximum. Both maintain CS(off) at 1.8pF. Applications with strict capacitance requirements below 8pF require circuit-level evaluation to determine if the higher capacitance introduces unacceptable performance degradation.

Q: Is the MAX329CWE+ the only active substitute for MAX329C/D?

A: Based on the provided substitute list, MAX329CWE+ is the identified manufacturer-recommended equivalent. Both parts share the MAX329 base product number and maintain identical electrical specifications within the noted parameter ranges.

Q: What compliance certifications apply to both parts?

A: Both MAX329C/D and MAX329CWE+ are ROHS3 compliant, REACH unaffected, and carry MSL 1 (Unlimited) moisture sensitivity ratings. These certifications ensure compatibility with standard manufacturing and storage environments.