MAX326C/D Equivalent & Substitute Parts

Part Overview

The MAX326C/D is a 4-circuit IC switch with SPST-NC (Single Pole Single Throw - Normally Closed) configuration and 4.6kOhm on-state resistance, manufactured by Analog Devices Inc./Maxim Integrated. This die-form component is classified as obsolete, making equivalent substitute parts necessary for new designs and production applications. The MAX326 base product family offers multiple packaging options to accommodate different assembly requirements while maintaining identical electrical performance.

Key Parameters

Parameter	Value
Switch Circuit Configuration	SPST - NC (Single Pole Single Throw - Normally Closed)
Number of Circuits	4
Multiplexer/Demultiplexer Circuit	1:1
On-State Resistance (Max)	4.6kOhm
Channel-to-Channel Matching (ΔRon)	175Ohm (Typ)
Voltage - Supply, Single (V+)	10V ~ 30V
Voltage - Supply, Dual (V±)	±5V ~ 18V
Switch Time (Ton, Toff) (Max)	1µs, 500ns
Charge Injection	2pC
Channel Capacitance (CS(off), CD(off))	1.7pF, 1.7pF
Current - Leakage (IS(off)) (Max)	10pA
Crosstalk	-90dB @ 100kHz
Operating Temperature	0°C ~ 70°C
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected

Substitute Part Grouping Explanation

Substitution for the MAX326C/D is determined by strict equivalence across all electrical parameters and compliance certifications. The MAX326 product family maintains identical electrical specifications across all package variants:

Electrical Equivalence Criteria:

Switch circuit configuration: SPST - NC
Number of circuits: 4
On-state resistance: 4.6kOhm (Max)
Channel-to-channel matching: 175Ohm (Typ)
Supply voltage ranges: 10V ~ 30V (single) and ±5V ~ 18V (dual)
Switch timing: 1µs, 500ns (Ton, Toff Max)
Charge injection: 2pC
Channel capacitance: 1.7pF, 1.7pF
Leakage current: 10pA (Max)
Crosstalk: -90dB @ 100kHz
Operating temperature: 0°C ~ 70°C

Compliance Equivalence:

RoHS3 Compliant
REACH Unaffected
MSL 1 (Unlimited)

The substitute parts differ only in packaging format and product status (Active vs. Obsolete), with no electrical performance variation.

Parameter Comparison

Parameter	MAX326C/D (Die)	MAX326CPE+ (16-DIP)	MAX326CSE+ (16-SOIC)
Manufacturer	Analog Devices Inc./Maxim Integrated	Analog Devices Inc./Maxim Integrated	Analog Devices Inc./Maxim Integrated
Product Status	Obsolete	Active	Active
Switch Circuit	SPST - NC	SPST - NC	SPST - NC
Number of Circuits	4	4	4
On-State Resistance (Max)	4.6kOhm	4.6kOhm	4.6kOhm
Channel-to-Channel Matching (ΔRon)	175Ohm (Typ)	175Ohm	175Ohm
Voltage - Supply, Single (V+)	10V ~ 30V	10V ~ 30V	10V ~ 30V
Voltage - Supply, Dual (V±)	±5V ~ 18V	±5V ~ 18V	±5V ~ 18V
Switch Time (Ton, Toff) (Max)	1µs, 500ns	1µs, 500ns	1µs, 500ns
Charge Injection	2pC	2pC	2pC
Channel Capacitance (CS(off), CD(off))	1.7pF, 1.7pF	1.7pF, 1.7pF	1.7pF, 1.7pF
Current - Leakage (IS(off)) (Max)	10pA	10pA	10pA
Crosstalk	-90dB @ 100kHz	-90dB @ 100kHz	-90dB @ 100kHz
Operating Temperature	0°C ~ 70°C	0°C ~ 70°C (TA)	0°C ~ 70°C (TA)
Mounting Type	Surface Mount	Through Hole	Surface Mount
Package / Case	Die	16-DIP (0.300", 7.62mm)	16-SOIC (0.154", 3.90mm Width)
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)
REACH Status	REACH Unaffected	REACH Unaffected	REACH Unaffected

Engineering Selection Recommendations

MAX326CPE+ (16-DIP Through Hole)

Active product status with established supply chain
Through-hole mounting suitable for breadboard prototyping and legacy PCB designs
Recommended for applications requiring through-hole assembly compatibility

MAX326CSE+ (16-SOIC Surface Mount)

Active product status with established supply chain
Surface-mount package suitable for modern PCB assembly processes
Recommended for new designs and high-density PCB layouts
Smaller footprint compared to 16-DIP variant

Both substitute parts maintain full electrical equivalence to the MAX326C/D die form and carry identical RoHS3 and REACH compliance certifications. Selection between MAX326CPE+ and MAX326CSE+ depends solely on PCB assembly requirements and form factor constraints.

Frequently Asked Questions (FAQ)

Q: Can MAX326CPE+ or MAX326CSE+ directly replace MAX326C/D in all applications? A: Electrically, yes. All three variants share identical electrical specifications across switch configuration, resistance, voltage ranges, timing, and leakage parameters. The difference is packaging format only. PCB layout and assembly method must accommodate the selected package type.

Q: What is the primary reason to substitute MAX326C/D? A: MAX326C/D is classified as obsolete. MAX326CPE+ and MAX326CSE+ are active products with current manufacturing and supply availability.

Q: How do the package types differ? A: MAX326C/D is supplied as a bare die for hybrid circuit integration. MAX326CPE+ uses 16-pin DIP (through-hole) packaging. MAX326CSE+ uses 16-pin SOIC (surface-mount) packaging. Electrical performance is identical across all three.

Q: Are there compliance differences between the three variants? A: No. All three parts are ROHS3 Compliant, REACH Unaffected, and carry MSL 1 (Unlimited) moisture sensitivity rating.

Q: Which substitute should I select for a new design? A: MAX326CSE+ (16-SOIC) is recommended for new designs due to surface-mount compatibility with modern manufacturing processes and smaller PCB footprint. MAX326CPE+ (16-DIP) is suitable if through-hole assembly is required.

Q: Are there any electrical performance differences between MAX326CPE+ and MAX326CSE+? A: No. Both active substitutes maintain identical electrical specifications. The only differences are mounting type and package dimensions.

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