MAX188DEWP+ Equivalent & Substitute Parts

Part Overview

The MAX188DEWP+ is a 12-bit Data Acquisition System (DAS) with analog-to-digital conversion capability, manufactured by Analog Devices Inc./Maxim Integrated. This component features 8 channels, a sampling rate of 133 kSPS, and supports multiple serial communication interfaces including MICROWIRE™, QSPI™, and SPI™. The device operates with dual ±5V supply voltage and is housed in a 20-SOIC surface mount package. Currently in active production status with full ROHS3 compliance, the MAX188DEWP+ serves applications requiring mid-range resolution data acquisition in industrial and embedded systems.

Substiute Parts

MAX188DEWP+
Analog Devices Inc./Maxim IntegratedIn Stock: 869MAX188DEWP+ Datasheet
MAX188DEWP+
Current Part
MAX188DEWP+
Analog Devices Inc./Maxim IntegratedIn Stock: 869MAX188DEWP+ Datasheet
MAX188DEWP+
Direct

Key Parameters

Parameter Specification
Manufacturer Part Number MAX188DEWP+
Manufacturer Analog Devices Inc./Maxim Integrated
Product Category Data Acquisition System (DAS), ADC
Number of Channels 8
Resolution 12 bits
Sampling Rate 133 kSPS
Data Interface MICROWIRE™, QSPI™, Serial, SPI™
Voltage Supply Dual ±5V
Operating Temperature Range -40°C to 85°C
Package Type 20-SOIC (0.295", 7.50mm Width)
Mounting Type Surface Mount
Product Status Active
RoHS Compliance ROHS3 Compliant
Moisture Sensitivity Level MSL 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the MAX188DEWP+ is determined by strict equivalence across the following critical parameters:

  • Channel Configuration: 8 channels
  • Resolution: 12-bit conversion
  • Sampling Rate: 133 kSPS minimum
  • Serial Interface Support: MICROWIRE™, QSPI™, and SPI™ compatibility
  • Supply Voltage: Dual ±5V operation
  • Package: 20-SOIC form factor
  • Temperature Range: -40°C to 85°C minimum
  • Compliance: ROHS3 and REACH status alignment

Based on the provided input data, the MAX188DEWP+ is listed as its own direct equivalent. No alternative part numbers meeting all specified parameters have been provided in the substitute list.

Parameter Comparison

Parameter MAX188DEWP+
Manufacturer Analog Devices Inc./Maxim Integrated
Channels 8
Resolution (Bits) 12
Sampling Rate (kSPS) 133
Data Interface MICROWIRE™, QSPI™, Serial, SPI™
Supply Voltage ±5V
Operating Temperature -40°C to 85°C
Package 20-SOIC
RoHS Status ROHS3 Compliant
Product Status Active

Engineering Selection Recommendations

The MAX188DEWP+ maintains active production status with full ROHS3 compliance and REACH unaffected classification, ensuring regulatory compliance for current and future applications. The component's MSL 1 rating indicates unlimited shelf life under standard storage conditions, reducing inventory management constraints. Selection of this part is supported by its established manufacturing continuity and compliance certifications suitable for industrial deployment across the specified -40°C to 85°C operating window.

Frequently Asked Questions (FAQ)

Q: What determines if a part can substitute for the MAX188DEWP+?

A: A substitute must match all critical parameters: 8-channel configuration, 12-bit resolution, 133 kSPS sampling rate, support for MICROWIRE™/QSPI™/SPI™ interfaces, dual ±5V supply, 20-SOIC package, and -40°C to 85°C operating range.

Q: Is the MAX188DEWP+ currently available?

A: Yes, the MAX188DEWP+ is in active production status with 850 pieces in stock as new original inventory.

Q: What is the significance of the 20-SOIC package specification?

A: The 20-SOIC (0.295", 7.50mm Width) package defines the physical footprint and pin configuration. Substitutes must use identical packaging to ensure PCB compatibility without redesign.

Q: Does the MAX188DEWP+ support multiple communication protocols?

A: Yes, the device supports MICROWIRE™, QSPI™, Serial, and SPI™ interfaces, providing flexibility in system integration.

Q: What does MSL 1 (Unlimited) mean for storage?

A: MSL 1 indicates the component has unlimited shelf life under standard moisture-controlled storage conditions, with no bake-out requirement before assembly.

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